JP3916011B2 - 窒化ガリウム系化合物半導体発光素子及びその製造方法 - Google Patents

窒化ガリウム系化合物半導体発光素子及びその製造方法 Download PDF

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Publication number
JP3916011B2
JP3916011B2 JP3819897A JP3819897A JP3916011B2 JP 3916011 B2 JP3916011 B2 JP 3916011B2 JP 3819897 A JP3819897 A JP 3819897A JP 3819897 A JP3819897 A JP 3819897A JP 3916011 B2 JP3916011 B2 JP 3916011B2
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Japan
Prior art keywords
gallium nitride
compound semiconductor
semiconductor layer
nitride compound
type gallium
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Expired - Fee Related
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JP3819897A
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English (en)
Japanese (ja)
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JPH10242516A5 (https=
JPH10242516A (ja
Inventor
俊雄 幡
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Sharp Corp
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Sharp Corp
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Priority to JP3819897A priority Critical patent/JP3916011B2/ja
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Publication of JPH10242516A5 publication Critical patent/JPH10242516A5/ja
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  • Led Devices (AREA)
JP3819897A 1997-02-21 1997-02-21 窒化ガリウム系化合物半導体発光素子及びその製造方法 Expired - Fee Related JP3916011B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3819897A JP3916011B2 (ja) 1997-02-21 1997-02-21 窒化ガリウム系化合物半導体発光素子及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3819897A JP3916011B2 (ja) 1997-02-21 1997-02-21 窒化ガリウム系化合物半導体発光素子及びその製造方法

Publications (3)

Publication Number Publication Date
JPH10242516A JPH10242516A (ja) 1998-09-11
JPH10242516A5 JPH10242516A5 (https=) 2005-01-06
JP3916011B2 true JP3916011B2 (ja) 2007-05-16

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JP3819897A Expired - Fee Related JP3916011B2 (ja) 1997-02-21 1997-02-21 窒化ガリウム系化合物半導体発光素子及びその製造方法

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Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6268618B1 (en) 1997-05-08 2001-07-31 Showa Denko K.K. Electrode for light-emitting semiconductor devices and method of producing the electrode
JP4810751B2 (ja) * 2001-04-19 2011-11-09 日亜化学工業株式会社 窒化物半導体素子
JP2004047662A (ja) * 2002-07-11 2004-02-12 Rohm Co Ltd 半導体発光素子
KR100543696B1 (ko) * 2002-09-09 2006-01-20 삼성전기주식회사 고효율 발광 다이오드
JP2004200303A (ja) * 2002-12-17 2004-07-15 Sharp Corp 発光ダイオード
JP4317697B2 (ja) * 2003-01-30 2009-08-19 パナソニック株式会社 光半導体ベアチップ、プリント配線板、照明ユニットおよび照明装置
US20060002442A1 (en) * 2004-06-30 2006-01-05 Kevin Haberern Light emitting devices having current blocking structures and methods of fabricating light emitting devices having current blocking structures
US7335920B2 (en) 2005-01-24 2008-02-26 Cree, Inc. LED with current confinement structure and surface roughening
JP4951865B2 (ja) * 2005-03-02 2012-06-13 日亜化学工業株式会社 半導体発光素子
KR100714627B1 (ko) 2005-11-01 2007-05-07 삼성전기주식회사 질화물 반도체 발광소자 및 제조방법
JP2008218440A (ja) * 2007-02-09 2008-09-18 Mitsubishi Chemicals Corp GaN系LED素子および発光装置
JP2008244425A (ja) * 2007-02-21 2008-10-09 Mitsubishi Chemicals Corp GaN系LED素子および発光装置
JP2010153581A (ja) * 2008-12-25 2010-07-08 Showa Denko Kk 半導体発光素子及び半導体発光素子の製造方法、ランプ
JP5350833B2 (ja) * 2009-02-20 2013-11-27 株式会社東芝 半導体発光素子、半導体発光装置及び半導体発光素子の製造方法
JP5392611B2 (ja) * 2009-09-14 2014-01-22 スタンレー電気株式会社 半導体発光装置および半導体発光装置の製造方法
KR101047721B1 (ko) 2010-03-09 2011-07-08 엘지이노텍 주식회사 발광 소자, 발광 소자 제조방법 및 발광 소자 패키지
KR101081135B1 (ko) 2010-03-15 2011-11-07 엘지이노텍 주식회사 발광 소자, 발광 소자 제조방법 및 발광 소자 패키지

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