JP3908549B2 - Ｒｆｉｄタグの製造方法 - Google Patents

Ｒｆｉｄタグの製造方法 Download PDF

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Publication number
JP3908549B2
JP3908549B2 JP2002024295A JP2002024295A JP3908549B2 JP 3908549 B2 JP3908549 B2 JP 3908549B2 JP 2002024295 A JP2002024295 A JP 2002024295A JP 2002024295 A JP2002024295 A JP 2002024295A JP 3908549 B2 JP3908549 B2 JP 3908549B2
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Japan
Prior art keywords
chip
rfid tag
base material
antenna pattern
recess
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Expired - Fee Related
Application number
JP2002024295A
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English (en)
Japanese (ja)
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JP2003223626A (ja
JP2003223626A5 (https=
Inventor
浩 山本
清 小口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
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Dai Nippon Printing Co Ltd
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Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP2002024295A priority Critical patent/JP3908549B2/ja
Publication of JP2003223626A publication Critical patent/JP2003223626A/ja
Publication of JP2003223626A5 publication Critical patent/JP2003223626A5/ja
Application granted granted Critical
Publication of JP3908549B2 publication Critical patent/JP3908549B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors

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  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)
JP2002024295A 2002-01-31 2002-01-31 Ｒｆｉｄタグの製造方法 Expired - Fee Related JP3908549B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002024295A JP3908549B2 (ja) 2002-01-31 2002-01-31 Ｒｆｉｄタグの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002024295A JP3908549B2 (ja) 2002-01-31 2002-01-31 Ｒｆｉｄタグの製造方法

Publications (3)

Publication Number Publication Date
JP2003223626A JP2003223626A (ja) 2003-08-08
JP2003223626A5 JP2003223626A5 (https=) 2005-08-11
JP3908549B2 true JP3908549B2 (ja) 2007-04-25

Family

ID=27746780

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JP2002024295A Expired - Fee Related JP3908549B2 (ja) 2002-01-31 2002-01-31 Ｒｆｉｄタグの製造方法

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JP (1) JP3908549B2 (https=)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6867983B2 (en) 2002-08-07 2005-03-15 Avery Dennison Corporation Radio frequency identification device and method
JP2006511969A (ja) * 2002-12-18 2006-04-06 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 液体の小滴でのマイクロメートル寸法の電子物体の操作
US7224280B2 (en) 2002-12-31 2007-05-29 Avery Dennison Corporation RFID device and method of forming
US6940408B2 (en) 2002-12-31 2005-09-06 Avery Dennison Corporation RFID device and method of forming
US20040200061A1 (en) 2003-04-11 2004-10-14 Coleman James P. Conductive pattern and method of making
US7930815B2 (en) 2003-04-11 2011-04-26 Avery Dennison Corporation Conductive pattern and method of making
JP4504694B2 (ja) * 2004-01-30 2010-07-14 トッパン・フォームズ株式会社 スレッドの製造方法及びｉｃチップ入りシートの製造方法、並びにこれらによって製造されたスレッド及びｉｃチップ入りシート
JP2006031336A (ja) * 2004-07-15 2006-02-02 Fujitsu Ltd Ｒｆｉｄタグの製造方法
US7202790B2 (en) * 2004-08-13 2007-04-10 Sensormatic Electronics Corporation Techniques for tuning an antenna to different operating frequencies
JP4653440B2 (ja) 2004-08-13 2011-03-16 富士通株式会社 Ｒｆｉｄタグおよびその製造方法
JP4845461B2 (ja) * 2004-09-14 2011-12-28 株式会社半導体エネルギー研究所 半導体装置及びその作製方法
US8698262B2 (en) 2004-09-14 2014-04-15 Semiconductor Energy Laboratory Co., Ltd. Wireless chip and manufacturing method of the same
JP5057767B2 (ja) * 2006-01-10 2012-10-24 株式会社半導体エネルギー研究所 半導体装置の作製方法
US20070158804A1 (en) 2006-01-10 2007-07-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, manufacturing method of semiconductor device, and RFID tag
JP2007274379A (ja) * 2006-03-31 2007-10-18 Sumitomo Chemical Co Ltd 無線タグ及びその製造方法
JP2008041005A (ja) * 2006-08-10 2008-02-21 Hitachi Ltd Ｒｆｉｄタグおよびその製造方法
KR101117006B1 (ko) 2006-12-26 2012-04-12 아사히 가세이 케미칼즈 가부시키가이샤 인쇄판용 수지 조성물
TWI423519B (zh) 2007-09-04 2014-01-11 Mitsubishi Electric Corp Radio frequency identification tag
JP5466381B2 (ja) * 2008-07-23 2014-04-09 株式会社沖データ 媒体搬送装置、印刷媒体、画像形成装置、及び画像形成方法
JP5114357B2 (ja) * 2008-10-09 2013-01-09 株式会社日立製作所 無線ｉｃタグ
JP5284858B2 (ja) * 2009-04-22 2013-09-11 富士通株式会社 Ｒｆｉｄタグ
WO2011055171A1 (en) * 2009-11-09 2011-05-12 Time Reversal Communications Device for receiving and / or emitting electromanetic waves
JP2014157180A (ja) * 2013-02-14 2014-08-28 Ricoh Co Ltd Ｒｆｉｄ粘着感熱ラベル
EP2767935A1 (fr) * 2013-02-18 2014-08-20 NagraID S.A. Couche plastique pour carte électronique
WO2015166832A1 (ja) * 2014-04-28 2015-11-05 株式会社 村田製作所 無線ｉｃデバイス、クリップ状ｒｆｉｄタグおよびｒｆｉｄタグ付き物品
JP7312355B2 (ja) * 2019-03-27 2023-07-21 大日本印刷株式会社 Ｉｃタグ、ｉｃタグの製造方法、及びｉｃ保持部の製造方法
CN114729246B (zh) * 2019-12-23 2024-05-28 三井化学株式会社 电子标签用粘接剂及电子标签
CN118590096B (zh) * 2024-08-02 2025-09-26 支付宝(杭州)信息技术有限公司 用于实现近场通信的电路单元和nfc设备

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JP2003223626A (ja) 2003-08-08

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