JP3872081B2 - 研磨用パッド - Google Patents

研磨用パッド Download PDF

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Publication number
JP3872081B2
JP3872081B2 JP2004383013A JP2004383013A JP3872081B2 JP 3872081 B2 JP3872081 B2 JP 3872081B2 JP 2004383013 A JP2004383013 A JP 2004383013A JP 2004383013 A JP2004383013 A JP 2004383013A JP 3872081 B2 JP3872081 B2 JP 3872081B2
Authority
JP
Japan
Prior art keywords
groove
polishing
polishing pad
back surface
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004383013A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006187819A (ja
JP2006187819A5 (enExample
Inventor
辰俊 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inoac Corp
Toho Engineering Co Ltd
Original Assignee
Inoac Corp
Toho Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inoac Corp, Toho Engineering Co Ltd filed Critical Inoac Corp
Priority to JP2004383013A priority Critical patent/JP3872081B2/ja
Priority to US11/813,141 priority patent/US7867066B2/en
Priority to TW094145011A priority patent/TWI375606B/zh
Priority to CN200580048296.3A priority patent/CN100562401C/zh
Priority to PCT/JP2005/023255 priority patent/WO2006070629A1/ja
Publication of JP2006187819A publication Critical patent/JP2006187819A/ja
Publication of JP2006187819A5 publication Critical patent/JP2006187819A5/ja
Application granted granted Critical
Publication of JP3872081B2 publication Critical patent/JP3872081B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2004383013A 2004-12-29 2004-12-29 研磨用パッド Expired - Fee Related JP3872081B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004383013A JP3872081B2 (ja) 2004-12-29 2004-12-29 研磨用パッド
US11/813,141 US7867066B2 (en) 2004-12-29 2005-12-19 Polishing pad
TW094145011A TWI375606B (en) 2004-12-29 2005-12-19 Polishing pad
CN200580048296.3A CN100562401C (zh) 2004-12-29 2005-12-19 抛光垫
PCT/JP2005/023255 WO2006070629A1 (ja) 2004-12-29 2005-12-19 研磨用パッド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004383013A JP3872081B2 (ja) 2004-12-29 2004-12-29 研磨用パッド

Publications (3)

Publication Number Publication Date
JP2006187819A JP2006187819A (ja) 2006-07-20
JP2006187819A5 JP2006187819A5 (enExample) 2006-08-31
JP3872081B2 true JP3872081B2 (ja) 2007-01-24

Family

ID=36614748

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004383013A Expired - Fee Related JP3872081B2 (ja) 2004-12-29 2004-12-29 研磨用パッド

Country Status (5)

Country Link
US (1) US7867066B2 (enExample)
JP (1) JP3872081B2 (enExample)
CN (1) CN100562401C (enExample)
TW (1) TWI375606B (enExample)
WO (1) WO2006070629A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD559066S1 (en) * 2004-10-26 2008-01-08 Jsr Corporation Polishing pad
JP5105095B2 (ja) * 2006-10-27 2012-12-19 Ｊｓｒ株式会社 化学機械研磨パッドの製造方法および被研磨体の加工方法
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
TWI360459B (en) * 2008-04-11 2012-03-21 Bestac Advanced Material Co Ltd A polishing pad having groove structure for avoidi
JP5230328B2 (ja) 2008-09-30 2013-07-10 スピードファム株式会社 ウエハノッチ部の研磨パッド
JP2012533888A (ja) * 2009-07-16 2012-12-27 キャボット マイクロエレクトロニクス コーポレイション 溝付きｃｍｐ研磨ｐａｄ
RU2012116583A (ru) * 2009-11-12 2013-12-20 3М Инновейтив Пропертиз Компани Вращающаяся полировальная подушка
JP2012106328A (ja) * 2010-03-25 2012-06-07 Toyo Tire & Rubber Co Ltd 積層研磨パッド
KR101440175B1 (ko) 2010-06-30 2014-09-12 코오롱인더스트리 주식회사 연마패드 및 그 제조방법
TWI532565B (zh) * 2011-03-21 2016-05-11 智勝科技股份有限公司 研磨方法以及研磨系統
WO2013103142A1 (ja) * 2012-01-06 2013-07-11 東レ株式会社 研磨パッド
US9421669B2 (en) * 2012-07-30 2016-08-23 Globalfoundries Singapore Pte. Ltd. Single grooved polishing pad
JP5935168B2 (ja) 2012-08-20 2016-06-15 東邦エンジニアリング株式会社 基板研磨装置
CN102990535A (zh) * 2012-11-27 2013-03-27 无锡市彩云机械设备有限公司 一种抛光垫
US9308620B2 (en) * 2013-09-18 2016-04-12 Texas Instruments Incorporated Permeated grooving in CMP polishing pads
TWI599447B (zh) 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
WO2015186076A2 (en) * 2014-06-04 2015-12-10 Paolo Baratti Abrasive tool for machining surfaces
WO2016108284A1 (ja) 2014-12-31 2016-07-07 東邦エンジニアリング株式会社 平坦加工方法および平坦加工装置
US10092998B2 (en) * 2015-06-26 2018-10-09 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making composite polishing layer for chemical mechanical polishing pad
US10189143B2 (en) * 2015-11-30 2019-01-29 Taiwan Semiconductor Manufacturing Company Limited Polishing pad, method for manufacturing polishing pad, and polishing method
JP6754519B2 (ja) * 2016-02-15 2020-09-16 国立研究開発法人海洋研究開発機構 研磨方法
JP6187948B1 (ja) 2016-03-11 2017-08-30 東邦エンジニアリング株式会社 平坦加工装置、その動作方法および加工物の製造方法
JP7026942B2 (ja) * 2018-04-26 2022-03-01 丸石産業株式会社 研磨パッド用の下敷及び該下敷を使用する研磨方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5441598A (en) * 1993-12-16 1995-08-15 Motorola, Inc. Polishing pad for chemical-mechanical polishing of a semiconductor substrate
JP3042593B2 (ja) 1995-10-25 2000-05-15 日本電気株式会社 研磨パッド
JP3324643B2 (ja) 1995-10-25 2002-09-17 日本電気株式会社 研磨パッド
US5913713A (en) * 1997-07-31 1999-06-22 International Business Machines Corporation CMP polishing pad backside modifications for advantageous polishing results
JP3152188B2 (ja) 1997-11-28 2001-04-03 日本電気株式会社 研磨パッド
DE60039054D1 (de) * 1999-03-30 2008-07-10 Nikon Corp Gt-polierkörper, poliervorrichtung, polierverfahren und verfahren zum herstellen einer halbleitervorrichtung (2002/23)
US6217426B1 (en) 1999-04-06 2001-04-17 Applied Materials, Inc. CMP polishing pad
WO2002043921A1 (en) 2000-12-01 2002-06-06 Toyo Boseki Kabushiki Kaisha Polishing pad, method of manufacturing the polishing pad, and cushion layer for polishing pad
AU2003236328A1 (en) 2002-04-03 2003-10-13 Toho Engineering Kabushiki Kaisha Polishing pad and semiconductor substrate manufacturing method using the polishing pad
CN1504315A (zh) * 2002-12-05 2004-06-16 智胜科技股份有限公司 研磨垫的制造方法
JP2004202666A (ja) 2002-12-26 2004-07-22 Sony Corp 研磨装置、研磨部材、および研磨方法
JP4292025B2 (ja) * 2003-05-23 2009-07-08 Ｊｓｒ株式会社 研磨パッド
US20040259479A1 (en) * 2003-06-23 2004-12-23 Cabot Microelectronics Corporation Polishing pad for electrochemical-mechanical polishing
US7442116B2 (en) 2003-11-04 2008-10-28 Jsr Corporation Chemical mechanical polishing pad
JP4616571B2 (ja) 2004-03-31 2011-01-19 東洋ゴム工業株式会社 研磨パッド

Also Published As

Publication number Publication date
TWI375606B (en) 2012-11-01
TW200700187A (en) 2007-01-01
WO2006070629A1 (ja) 2006-07-06
CN101119829A (zh) 2008-02-06
US7867066B2 (en) 2011-01-11
JP2006187819A (ja) 2006-07-20
CN100562401C (zh) 2009-11-25
US20080064311A1 (en) 2008-03-13

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