TWI375606B - Polishing pad - Google Patents

Polishing pad Download PDF

Info

Publication number
TWI375606B
TWI375606B TW094145011A TW94145011A TWI375606B TW I375606 B TWI375606 B TW I375606B TW 094145011 A TW094145011 A TW 094145011A TW 94145011 A TW94145011 A TW 94145011A TW I375606 B TWI375606 B TW I375606B
Authority
TW
Taiwan
Prior art keywords
groove
polishing
polishing pad
pad
back surface
Prior art date
Application number
TW094145011A
Other languages
English (en)
Chinese (zh)
Other versions
TW200700187A (en
Inventor
Tatsutoshi Suzuki
Original Assignee
Toho Engineering Kabushiki Kaisha
Inoue Mtp Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toho Engineering Kabushiki Kaisha, Inoue Mtp Kk filed Critical Toho Engineering Kabushiki Kaisha
Publication of TW200700187A publication Critical patent/TW200700187A/zh
Application granted granted Critical
Publication of TWI375606B publication Critical patent/TWI375606B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW094145011A 2004-12-29 2005-12-19 Polishing pad TWI375606B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004383013A JP3872081B2 (ja) 2004-12-29 2004-12-29 研磨用パッド

Publications (2)

Publication Number Publication Date
TW200700187A TW200700187A (en) 2007-01-01
TWI375606B true TWI375606B (en) 2012-11-01

Family

ID=36614748

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094145011A TWI375606B (en) 2004-12-29 2005-12-19 Polishing pad

Country Status (5)

Country Link
US (1) US7867066B2 (enExample)
JP (1) JP3872081B2 (enExample)
CN (1) CN100562401C (enExample)
TW (1) TWI375606B (enExample)
WO (1) WO2006070629A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD559066S1 (en) * 2004-10-26 2008-01-08 Jsr Corporation Polishing pad
JP5105095B2 (ja) * 2006-10-27 2012-12-19 Ｊｓｒ株式会社 化学機械研磨パッドの製造方法および被研磨体の加工方法
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
TWI360459B (en) * 2008-04-11 2012-03-21 Bestac Advanced Material Co Ltd A polishing pad having groove structure for avoidi
JP5230328B2 (ja) 2008-09-30 2013-07-10 スピードファム株式会社 ウエハノッチ部の研磨パッド
CN102498549A (zh) * 2009-07-16 2012-06-13 嘉柏微电子材料股份公司 沟槽式化学机械抛光抛光垫
EP2498951A1 (en) * 2009-11-12 2012-09-19 3M Innovative Properties Company Rotary buffing pad
JP2012106328A (ja) * 2010-03-25 2012-06-07 Toyo Tire & Rubber Co Ltd 積層研磨パッド
KR101440175B1 (ko) 2010-06-30 2014-09-12 코오롱인더스트리 주식회사 연마패드 및 그 제조방법
TWI532565B (zh) * 2011-03-21 2016-05-11 智勝科技股份有限公司 研磨方法以及研磨系統
JPWO2013103142A1 (ja) * 2012-01-06 2015-05-11 東レ株式会社 研磨パッド
US9421669B2 (en) * 2012-07-30 2016-08-23 Globalfoundries Singapore Pte. Ltd. Single grooved polishing pad
JP5935168B2 (ja) 2012-08-20 2016-06-15 東邦エンジニアリング株式会社 基板研磨装置
CN102990535A (zh) * 2012-11-27 2013-03-27 无锡市彩云机械设备有限公司 一种抛光垫
US9308620B2 (en) * 2013-09-18 2016-04-12 Texas Instruments Incorporated Permeated grooving in CMP polishing pads
TWI599447B (zh) 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
US10150204B2 (en) * 2014-06-04 2018-12-11 Paolo Baratti Abrasive tool for machining surfaces
US10199242B2 (en) 2014-12-31 2019-02-05 Osaka University Planarizing processing method and planarizing processing device
US10092998B2 (en) * 2015-06-26 2018-10-09 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making composite polishing layer for chemical mechanical polishing pad
US10189143B2 (en) 2015-11-30 2019-01-29 Taiwan Semiconductor Manufacturing Company Limited Polishing pad, method for manufacturing polishing pad, and polishing method
JP6754519B2 (ja) * 2016-02-15 2020-09-16 国立研究開発法人海洋研究開発機構 研磨方法
JP6187948B1 (ja) 2016-03-11 2017-08-30 東邦エンジニアリング株式会社 平坦加工装置、その動作方法および加工物の製造方法
JP7026942B2 (ja) * 2018-04-26 2022-03-01 丸石産業株式会社 研磨パッド用の下敷及び該下敷を使用する研磨方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5441598A (en) * 1993-12-16 1995-08-15 Motorola, Inc. Polishing pad for chemical-mechanical polishing of a semiconductor substrate
JP3042593B2 (ja) 1995-10-25 2000-05-15 日本電気株式会社 研磨パッド
JP3324643B2 (ja) 1995-10-25 2002-09-17 日本電気株式会社 研磨パッド
US5913713A (en) * 1997-07-31 1999-06-22 International Business Machines Corporation CMP polishing pad backside modifications for advantageous polishing results
JP3152188B2 (ja) 1997-11-28 2001-04-03 日本電気株式会社 研磨パッド
KR100471527B1 (ko) * 1999-03-30 2005-03-09 가부시키가이샤 니콘 연마체, 연마장치, 연마방법 및 반도체 소자의 제조방법
US6217426B1 (en) 1999-04-06 2001-04-17 Applied Materials, Inc. CMP polishing pad
KR100867339B1 (ko) 2000-12-01 2008-11-06 도요 고무 고교 가부시키가이샤 연마 패드 및 그 제조 방법
US7121938B2 (en) 2002-04-03 2006-10-17 Toho Engineering Kabushiki Kaisha Polishing pad and method of fabricating semiconductor substrate using the pad
CN1504315A (zh) * 2002-12-05 2004-06-16 智胜科技股份有限公司 研磨垫的制造方法
JP2004202666A (ja) 2002-12-26 2004-07-22 Sony Corp 研磨装置、研磨部材、および研磨方法
JP4292025B2 (ja) * 2003-05-23 2009-07-08 Ｊｓｒ株式会社 研磨パッド
US20040259479A1 (en) * 2003-06-23 2004-12-23 Cabot Microelectronics Corporation Polishing pad for electrochemical-mechanical polishing
US7442116B2 (en) 2003-11-04 2008-10-28 Jsr Corporation Chemical mechanical polishing pad
JP4616571B2 (ja) 2004-03-31 2011-01-19 東洋ゴム工業株式会社 研磨パッド

Also Published As

Publication number Publication date
CN101119829A (zh) 2008-02-06
JP2006187819A (ja) 2006-07-20
JP3872081B2 (ja) 2007-01-24
WO2006070629A1 (ja) 2006-07-06
CN100562401C (zh) 2009-11-25
US7867066B2 (en) 2011-01-11
US20080064311A1 (en) 2008-03-13
TW200700187A (en) 2007-01-01

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MM4A Annulment or lapse of patent due to non-payment of fees