JP2006187819A5 - - Google Patents

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Publication number
JP2006187819A5
JP2006187819A5 JP2004383013A JP2004383013A JP2006187819A5 JP 2006187819 A5 JP2006187819 A5 JP 2006187819A5 JP 2004383013 A JP2004383013 A JP 2004383013A JP 2004383013 A JP2004383013 A JP 2004383013A JP 2006187819 A5 JP2006187819 A5 JP 2006187819A5
Authority
JP
Japan
Prior art keywords
polishing pad
side annular
polishing
annular groove
back surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004383013A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006187819A (ja
JP3872081B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2004383013A external-priority patent/JP3872081B2/ja
Priority to JP2004383013A priority Critical patent/JP3872081B2/ja
Priority to CN200580048296.3A priority patent/CN100562401C/zh
Priority to PCT/JP2005/023255 priority patent/WO2006070629A1/ja
Priority to TW094145011A priority patent/TWI375606B/zh
Priority to US11/813,141 priority patent/US7867066B2/en
Publication of JP2006187819A publication Critical patent/JP2006187819A/ja
Publication of JP2006187819A5 publication Critical patent/JP2006187819A5/ja
Publication of JP3872081B2 publication Critical patent/JP3872081B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2004383013A 2004-12-29 2004-12-29 研磨用パッド Expired - Fee Related JP3872081B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004383013A JP3872081B2 (ja) 2004-12-29 2004-12-29 研磨用パッド
US11/813,141 US7867066B2 (en) 2004-12-29 2005-12-19 Polishing pad
PCT/JP2005/023255 WO2006070629A1 (ja) 2004-12-29 2005-12-19 研磨用パッド
TW094145011A TWI375606B (en) 2004-12-29 2005-12-19 Polishing pad
CN200580048296.3A CN100562401C (zh) 2004-12-29 2005-12-19 抛光垫

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004383013A JP3872081B2 (ja) 2004-12-29 2004-12-29 研磨用パッド

Publications (3)

Publication Number Publication Date
JP2006187819A JP2006187819A (ja) 2006-07-20
JP2006187819A5 true JP2006187819A5 (enExample) 2006-08-31
JP3872081B2 JP3872081B2 (ja) 2007-01-24

Family

ID=36614748

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004383013A Expired - Fee Related JP3872081B2 (ja) 2004-12-29 2004-12-29 研磨用パッド

Country Status (5)

Country Link
US (1) US7867066B2 (enExample)
JP (1) JP3872081B2 (enExample)
CN (1) CN100562401C (enExample)
TW (1) TWI375606B (enExample)
WO (1) WO2006070629A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD559066S1 (en) * 2004-10-26 2008-01-08 Jsr Corporation Polishing pad
JP5105095B2 (ja) * 2006-10-27 2012-12-19 Ｊｓｒ株式会社 化学機械研磨パッドの製造方法および被研磨体の加工方法
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
TWI360459B (en) * 2008-04-11 2012-03-21 Bestac Advanced Material Co Ltd A polishing pad having groove structure for avoidi
JP5230328B2 (ja) 2008-09-30 2013-07-10 スピードファム株式会社 ウエハノッチ部の研磨パッド
JP2012533888A (ja) * 2009-07-16 2012-12-27 キャボット マイクロエレクトロニクス コーポレイション 溝付きｃｍｐ研磨ｐａｄ
BR112012011210A2 (pt) * 2009-11-12 2016-07-05 3M Innovative Properties Co blocos giratórios de alisamento
JP2012106328A (ja) * 2010-03-25 2012-06-07 Toyo Tire & Rubber Co Ltd 積層研磨パッド
KR101440175B1 (ko) 2010-06-30 2014-09-12 코오롱인더스트리 주식회사 연마패드 및 그 제조방법
TWI532565B (zh) * 2011-03-21 2016-05-11 智勝科技股份有限公司 研磨方法以及研磨系統
WO2013103142A1 (ja) * 2012-01-06 2013-07-11 東レ株式会社 研磨パッド
US9421669B2 (en) * 2012-07-30 2016-08-23 Globalfoundries Singapore Pte. Ltd. Single grooved polishing pad
JP5935168B2 (ja) 2012-08-20 2016-06-15 東邦エンジニアリング株式会社 基板研磨装置
CN102990535A (zh) * 2012-11-27 2013-03-27 无锡市彩云机械设备有限公司 一种抛光垫
US9308620B2 (en) * 2013-09-18 2016-04-12 Texas Instruments Incorporated Permeated grooving in CMP polishing pads
TWI599447B (zh) 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
ES2861973T3 (es) * 2014-06-04 2021-10-06 Paolo Baratti Herramienta abrasiva para el mecanizado de superficies
US10199242B2 (en) 2014-12-31 2019-02-05 Osaka University Planarizing processing method and planarizing processing device
US10092998B2 (en) * 2015-06-26 2018-10-09 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making composite polishing layer for chemical mechanical polishing pad
US10189143B2 (en) 2015-11-30 2019-01-29 Taiwan Semiconductor Manufacturing Company Limited Polishing pad, method for manufacturing polishing pad, and polishing method
JP6754519B2 (ja) * 2016-02-15 2020-09-16 国立研究開発法人海洋研究開発機構 研磨方法
JP6187948B1 (ja) 2016-03-11 2017-08-30 東邦エンジニアリング株式会社 平坦加工装置、その動作方法および加工物の製造方法
JP7026942B2 (ja) * 2018-04-26 2022-03-01 丸石産業株式会社 研磨パッド用の下敷及び該下敷を使用する研磨方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5441598A (en) * 1993-12-16 1995-08-15 Motorola, Inc. Polishing pad for chemical-mechanical polishing of a semiconductor substrate
JP3324643B2 (ja) 1995-10-25 2002-09-17 日本電気株式会社 研磨パッド
JP3042593B2 (ja) * 1995-10-25 2000-05-15 日本電気株式会社 研磨パッド
US5913713A (en) * 1997-07-31 1999-06-22 International Business Machines Corporation CMP polishing pad backside modifications for advantageous polishing results
JP3152188B2 (ja) 1997-11-28 2001-04-03 日本電気株式会社 研磨パッド
EP1211023B1 (en) * 1999-03-30 2008-05-28 Nikon Corporation Polishing body, polisher, polishing method, and method for producing semiconductor device
US6217426B1 (en) 1999-04-06 2001-04-17 Applied Materials, Inc. CMP polishing pad
KR100905266B1 (ko) * 2000-12-01 2009-06-29 도요 고무 고교 가부시키가이샤 연마 패드
WO2003083918A1 (en) 2002-04-03 2003-10-09 Toho Engineering Kabushiki Kaisha Polishing pad and semiconductor substrate manufacturing method using the polishing pad
CN1504315A (zh) * 2002-12-05 2004-06-16 智胜科技股份有限公司 研磨垫的制造方法
JP2004202666A (ja) * 2002-12-26 2004-07-22 Sony Corp 研磨装置、研磨部材、および研磨方法
JP4292025B2 (ja) * 2003-05-23 2009-07-08 Ｊｓｒ株式会社 研磨パッド
US20040259479A1 (en) * 2003-06-23 2004-12-23 Cabot Microelectronics Corporation Polishing pad for electrochemical-mechanical polishing
US7442116B2 (en) * 2003-11-04 2008-10-28 Jsr Corporation Chemical mechanical polishing pad
JP4616571B2 (ja) * 2004-03-31 2011-01-19 東洋ゴム工業株式会社 研磨パッド

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