JP2008188762A5 - - Google Patents

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Publication number
JP2008188762A5
JP2008188762A5 JP2008020161A JP2008020161A JP2008188762A5 JP 2008188762 A5 JP2008188762 A5 JP 2008188762A5 JP 2008020161 A JP2008020161 A JP 2008020161A JP 2008020161 A JP2008020161 A JP 2008020161A JP 2008188762 A5 JP2008188762 A5 JP 2008188762A5
Authority
JP
Japan
Prior art keywords
carrier
polishing pad
polishing
groove
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008020161A
Other languages
English (en)
Japanese (ja)
Other versions
JP5208530B2 (ja
JP2008188762A (ja
Filing date
Publication date
Priority claimed from US11/700,490 external-priority patent/US7520798B2/en
Priority claimed from US12/005,241 external-priority patent/US7520796B2/en
Application filed filed Critical
Publication of JP2008188762A publication Critical patent/JP2008188762A/ja
Publication of JP2008188762A5 publication Critical patent/JP2008188762A5/ja
Application granted granted Critical
Publication of JP5208530B2 publication Critical patent/JP5208530B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008020161A 2007-01-31 2008-01-31 スラリー消費を低減するための溝を有する研磨パッド Active JP5208530B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US11/700,490 US7520798B2 (en) 2007-01-31 2007-01-31 Polishing pad with grooves to reduce slurry consumption
US11/700,490 2007-01-31
US12/005,241 US7520796B2 (en) 2007-01-31 2007-12-26 Polishing pad with grooves to reduce slurry consumption
US12/005,241 2007-12-26

Publications (3)

Publication Number Publication Date
JP2008188762A JP2008188762A (ja) 2008-08-21
JP2008188762A5 true JP2008188762A5 (enExample) 2011-02-10
JP5208530B2 JP5208530B2 (ja) 2013-06-12

Family

ID=39587516

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008020161A Active JP5208530B2 (ja) 2007-01-31 2008-01-31 スラリー消費を低減するための溝を有する研磨パッド

Country Status (6)

Country Link
US (1) US7520796B2 (enExample)
JP (1) JP5208530B2 (enExample)
KR (1) KR101530711B1 (enExample)
DE (1) DE102008005331A1 (enExample)
FR (1) FR2912076B1 (enExample)
TW (1) TWI426980B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
US8062103B2 (en) 2008-12-23 2011-11-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High-rate groove pattern
US8057282B2 (en) * 2008-12-23 2011-11-15 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High-rate polishing method
TWI492818B (zh) * 2011-07-12 2015-07-21 Iv Technologies Co Ltd 研磨墊、研磨方法以及研磨系統
US9421669B2 (en) * 2012-07-30 2016-08-23 Globalfoundries Singapore Pte. Ltd. Single grooved polishing pad
TWI599447B (zh) 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2883802A (en) * 1956-09-24 1959-04-28 Crane Packing Co Method of and apparatus for lapping shoulders
US5081051A (en) * 1990-09-12 1992-01-14 Intel Corporation Method for conditioning the surface of a polishing pad
US5643053A (en) * 1993-12-27 1997-07-01 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved polishing control
US5664987A (en) * 1994-01-31 1997-09-09 National Semiconductor Corporation Methods and apparatus for control of polishing pad conditioning for wafer planarization
JPH07237120A (ja) * 1994-02-22 1995-09-12 Nec Corp ウェーハ研磨装置
US5695392A (en) * 1995-08-09 1997-12-09 Speedfam Corporation Polishing device with improved handling of fluid polishing media
JP3453977B2 (ja) * 1995-12-28 2003-10-06 信越半導体株式会社 ウェーハの研磨装置
JP3006568B2 (ja) * 1997-12-04 2000-02-07 日本電気株式会社 ウエハ研磨装置および研磨方法
JP2001298006A (ja) * 2000-04-17 2001-10-26 Ebara Corp 研磨装置
US6386962B1 (en) * 2000-06-30 2002-05-14 Lam Research Corporation Wafer carrier with groove for decoupling retainer ring from water
WO2003061904A1 (en) * 2002-01-22 2003-07-31 Multi Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface for slurry distribution
US6869335B2 (en) * 2002-07-08 2005-03-22 Micron Technology, Inc. Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces
US6869348B1 (en) * 2003-10-07 2005-03-22 Strasbaugh Retaining ring for wafer carriers
US7125318B2 (en) * 2003-11-13 2006-10-24 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad having a groove arrangement for reducing slurry consumption
JP2006147773A (ja) * 2004-11-18 2006-06-08 Ebara Corp 研磨装置および研磨方法
US7059949B1 (en) * 2004-12-14 2006-06-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having an overlapping stepped groove arrangement
US7001248B1 (en) * 2004-12-29 2006-02-21 Industrial Technology Research, Institute Fine tilting adjustment mechanism for grinding machine

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