FR2912076B1 - Patin de polissage avec des rainures afin de reduire la consommation de pate - Google Patents

Patin de polissage avec des rainures afin de reduire la consommation de pate

Info

Publication number
FR2912076B1
FR2912076B1 FR0850601A FR0850601A FR2912076B1 FR 2912076 B1 FR2912076 B1 FR 2912076B1 FR 0850601 A FR0850601 A FR 0850601A FR 0850601 A FR0850601 A FR 0850601A FR 2912076 B1 FR2912076 B1 FR 2912076B1
Authority
FR
France
Prior art keywords
skate
polishing
grooves
pulp consumption
reduce pulp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0850601A
Other languages
English (en)
French (fr)
Other versions
FR2912076A1 (fr
Inventor
Gregory P Muldowney
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
DuPont Electronic Materials International LLC
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/700,490 external-priority patent/US7520798B2/en
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of FR2912076A1 publication Critical patent/FR2912076A1/fr
Application granted granted Critical
Publication of FR2912076B1 publication Critical patent/FR2912076B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/04—Zonally-graded surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
FR0850601A 2007-01-31 2008-01-31 Patin de polissage avec des rainures afin de reduire la consommation de pate Expired - Fee Related FR2912076B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/700,490 US7520798B2 (en) 2007-01-31 2007-01-31 Polishing pad with grooves to reduce slurry consumption
US12/005,241 US7520796B2 (en) 2007-01-31 2007-12-26 Polishing pad with grooves to reduce slurry consumption

Publications (2)

Publication Number Publication Date
FR2912076A1 FR2912076A1 (fr) 2008-08-08
FR2912076B1 true FR2912076B1 (fr) 2014-10-10

Family

ID=39587516

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0850601A Expired - Fee Related FR2912076B1 (fr) 2007-01-31 2008-01-31 Patin de polissage avec des rainures afin de reduire la consommation de pate

Country Status (6)

Country Link
US (1) US7520796B2 (enExample)
JP (1) JP5208530B2 (enExample)
KR (1) KR101530711B1 (enExample)
DE (1) DE102008005331A1 (enExample)
FR (1) FR2912076B1 (enExample)
TW (1) TWI426980B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
US8062103B2 (en) 2008-12-23 2011-11-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High-rate groove pattern
US8057282B2 (en) * 2008-12-23 2011-11-15 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High-rate polishing method
TWI492818B (zh) * 2011-07-12 2015-07-21 Iv Technologies Co Ltd 研磨墊、研磨方法以及研磨系統
US9421669B2 (en) * 2012-07-30 2016-08-23 Globalfoundries Singapore Pte. Ltd. Single grooved polishing pad
TWI599447B (zh) 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2883802A (en) * 1956-09-24 1959-04-28 Crane Packing Co Method of and apparatus for lapping shoulders
US5081051A (en) * 1990-09-12 1992-01-14 Intel Corporation Method for conditioning the surface of a polishing pad
US5643053A (en) * 1993-12-27 1997-07-01 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved polishing control
US5664987A (en) * 1994-01-31 1997-09-09 National Semiconductor Corporation Methods and apparatus for control of polishing pad conditioning for wafer planarization
JPH07237120A (ja) * 1994-02-22 1995-09-12 Nec Corp ウェーハ研磨装置
US5695392A (en) * 1995-08-09 1997-12-09 Speedfam Corporation Polishing device with improved handling of fluid polishing media
JP3453977B2 (ja) * 1995-12-28 2003-10-06 信越半導体株式会社 ウェーハの研磨装置
JP3006568B2 (ja) * 1997-12-04 2000-02-07 日本電気株式会社 ウエハ研磨装置および研磨方法
JP2001298006A (ja) * 2000-04-17 2001-10-26 Ebara Corp 研磨装置
US6386962B1 (en) * 2000-06-30 2002-05-14 Lam Research Corporation Wafer carrier with groove for decoupling retainer ring from water
WO2003061904A1 (en) * 2002-01-22 2003-07-31 Multi Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface for slurry distribution
US6869335B2 (en) * 2002-07-08 2005-03-22 Micron Technology, Inc. Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces
US6869348B1 (en) * 2003-10-07 2005-03-22 Strasbaugh Retaining ring for wafer carriers
US7125318B2 (en) * 2003-11-13 2006-10-24 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad having a groove arrangement for reducing slurry consumption
JP2006147773A (ja) * 2004-11-18 2006-06-08 Ebara Corp 研磨装置および研磨方法
US7059949B1 (en) * 2004-12-14 2006-06-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having an overlapping stepped groove arrangement
US7001248B1 (en) * 2004-12-29 2006-02-21 Industrial Technology Research, Institute Fine tilting adjustment mechanism for grinding machine

Also Published As

Publication number Publication date
TWI426980B (zh) 2014-02-21
US20080182493A1 (en) 2008-07-31
DE102008005331A1 (de) 2008-08-07
FR2912076A1 (fr) 2008-08-08
TW200911457A (en) 2009-03-16
US7520796B2 (en) 2009-04-21
JP5208530B2 (ja) 2013-06-12
KR101530711B1 (ko) 2015-06-22
JP2008188762A (ja) 2008-08-21
KR20080071934A (ko) 2008-08-05

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Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 9

PLFP Fee payment

Year of fee payment: 10

PLFP Fee payment

Year of fee payment: 11

PLFP Fee payment

Year of fee payment: 13

ST Notification of lapse

Effective date: 20210905