JP2017208530A5 - - Google Patents

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Publication number
JP2017208530A5
JP2017208530A5 JP2017056833A JP2017056833A JP2017208530A5 JP 2017208530 A5 JP2017208530 A5 JP 2017208530A5 JP 2017056833 A JP2017056833 A JP 2017056833A JP 2017056833 A JP2017056833 A JP 2017056833A JP 2017208530 A5 JP2017208530 A5 JP 2017208530A5
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JP
Japan
Prior art keywords
polishing
groove
supply
polishing pad
radial
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JP2017056833A
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English (en)
Japanese (ja)
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JP6993090B2 (ja
JP2017208530A (ja
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Priority claimed from US15/079,824 external-priority patent/US10875146B2/en
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Publication of JP2017208530A5 publication Critical patent/JP2017208530A5/ja
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Publication of JP6993090B2 publication Critical patent/JP6993090B2/ja
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JP2017056833A 2016-03-24 2017-03-23 Ｃｍｐ研磨パッドのための研磨くず除去溝 Active JP6993090B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/079,824 2016-03-24
US15/079,824 US10875146B2 (en) 2016-03-24 2016-03-24 Debris-removal groove for CMP polishing pad

Publications (3)

Publication Number Publication Date
JP2017208530A JP2017208530A (ja) 2017-11-24
JP2017208530A5 true JP2017208530A5 (enExample) 2020-04-16
JP6993090B2 JP6993090B2 (ja) 2022-01-13

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ID=59886174

Family Applications (1)

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JP2017056833A Active JP6993090B2 (ja) 2016-03-24 2017-03-23 Ｃｍｐ研磨パッドのための研磨くず除去溝

Country Status (6)

Country Link
US (1) US10875146B2 (enExample)
JP (1) JP6993090B2 (enExample)
KR (1) KR102363154B1 (enExample)
CN (1) CN107225498A (enExample)
FR (1) FR3049205B1 (enExample)
TW (1) TWI773663B (enExample)

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JP7026942B2 (ja) * 2018-04-26 2022-03-01 丸石産業株式会社 研磨パッド用の下敷及び該下敷を使用する研磨方法
KR102059647B1 (ko) * 2018-06-21 2019-12-26 에스케이씨 주식회사 슬러리 유동성이 향상된 연마패드 및 이의 제조방법
NL2023396A (en) * 2018-07-27 2020-01-31 Asml Netherlands Bv Tool for modifying a support surface
KR101952829B1 (ko) * 2018-08-13 2019-02-27 최유섭 금속부품의 연마가공장치 및 이를 이용한 연마가공방법
JP7178662B2 (ja) * 2019-04-10 2022-11-28 パナソニックＩｐマネジメント株式会社 研磨装置および研磨方法
TWI771668B (zh) 2019-04-18 2022-07-21 美商應用材料股份有限公司 Cmp期間基於溫度的原位邊緣不對稱校正
KR102674356B1 (ko) * 2019-06-19 2024-06-11 주식회사 쿠라레 연마 패드, 연마 패드의 제조 방법 및 연마 방법
CN110732983A (zh) * 2019-10-30 2020-01-31 郑州伯利森新材料科技有限公司 一种硬脆材料加工用免修整超硬砂轮及其制备方法
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TWI826280B (zh) * 2019-11-22 2023-12-11 美商應用材料股份有限公司 在拋光墊中使用溝槽的晶圓邊緣不對稱校正
KR102746090B1 (ko) 2020-03-13 2024-12-26 삼성전자주식회사 Cmp 패드 및 이를 구비하는 화학적 기계적 연마 장치
US20210299816A1 (en) * 2020-03-25 2021-09-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cmp polishing pad with protruding structures having engineered open void space
KR102570825B1 (ko) * 2020-07-16 2023-08-28 한국생산기술연구원 다공성 돌출 패턴을 포함하는 연마 패드 및 이를 포함하는 연마 장치
CN114496880B (zh) * 2020-10-26 2025-07-25 昆明物理研究所 一种化学抛光夹具
CN117794687A (zh) * 2021-08-04 2024-03-29 株式会社可乐丽 抛光垫
KR102685134B1 (ko) * 2022-06-09 2024-07-15 케이피엑스케미칼 주식회사 개선된 연마속도를 갖는 연마패드 및 이를 포함하는 화학적 기계적 연마장치
KR102685136B1 (ko) * 2022-06-09 2024-07-15 케이피엑스케미칼 주식회사 개선된 연마속도를 갖는 연마패드 및 이를 포함하는 화학적 기계적 연마장치
KR20240105053A (ko) * 2022-12-28 2024-07-05 삼성전자주식회사 화학 기계적 연마 장치 및 이의 제어 방법
CN116276633B (zh) * 2023-02-13 2025-09-16 上海芯谦集成电路有限公司 一种具有透气孔的抛光垫
US20250108477A1 (en) * 2023-09-28 2025-04-03 Applied Materials, Inc. Chemical mechanical polishing edge control with pad recesses

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KR101232787B1 (ko) * 2010-08-18 2013-02-13 주식회사 엘지화학 연마 시스템용 연마 패드
US9211628B2 (en) * 2011-01-26 2015-12-15 Nexplanar Corporation Polishing pad with concentric or approximately concentric polygon groove pattern
US8968058B2 (en) * 2011-05-05 2015-03-03 Nexplanar Corporation Polishing pad with alignment feature
WO2013039181A1 (ja) * 2011-09-15 2013-03-21 東レ株式会社 研磨パッド
JPWO2013103142A1 (ja) 2012-01-06 2015-05-11 東レ株式会社 研磨パッド
TWI599447B (zh) * 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
JP2016124043A (ja) 2014-12-26 2016-07-11 東洋ゴム工業株式会社 研磨パッド

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