JP2021034723A5 - - Google Patents

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Publication number
JP2021034723A5
JP2021034723A5 JP2020126728A JP2020126728A JP2021034723A5 JP 2021034723 A5 JP2021034723 A5 JP 2021034723A5 JP 2020126728 A JP2020126728 A JP 2020126728A JP 2020126728 A JP2020126728 A JP 2020126728A JP 2021034723 A5 JP2021034723 A5 JP 2021034723A5
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JP
Japan
Prior art keywords
chuck
zones
series
lands
superstrate
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JP2020126728A
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English (en)
Japanese (ja)
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JP7481937B2 (ja
JP2021034723A (ja
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Priority claimed from US16/542,062 external-priority patent/US11145535B2/en
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Publication of JP2021034723A publication Critical patent/JP2021034723A/ja
Publication of JP2021034723A5 publication Critical patent/JP2021034723A5/ja
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Publication of JP7481937B2 publication Critical patent/JP7481937B2/ja
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JP2020126728A 2019-08-15 2020-07-27 平坦化方法、平坦化装置及び物品製造方法 Active JP7481937B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16/542,062 US11145535B2 (en) 2019-08-15 2019-08-15 Planarization process, apparatus and method of manufacturing an article
US16/542,062 2019-08-15

Publications (3)

Publication Number Publication Date
JP2021034723A JP2021034723A (ja) 2021-03-01
JP2021034723A5 true JP2021034723A5 (enExample) 2023-06-01
JP7481937B2 JP7481937B2 (ja) 2024-05-13

Family

ID=74568188

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020126728A Active JP7481937B2 (ja) 2019-08-15 2020-07-27 平坦化方法、平坦化装置及び物品製造方法

Country Status (4)

Country Link
US (1) US11145535B2 (enExample)
JP (1) JP7481937B2 (enExample)
KR (1) KR102815060B1 (enExample)
TW (1) TWI772838B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11875967B2 (en) * 2020-05-21 2024-01-16 Applied Materials, Inc. System apparatus and method for enhancing electrical clamping of substrates using photo-illumination
US11538714B2 (en) 2020-05-21 2022-12-27 Applied Materials, Inc. System apparatus and method for enhancing electrical clamping of substrates using photo-illumination
KR20220124090A (ko) * 2021-03-02 2022-09-13 캐논 가부시끼가이샤 척, 기판 유지장치, 기판 처리장치, 및 물품의 제조방법
JP7778482B2 (ja) * 2021-03-02 2025-12-02 キヤノン株式会社 チャック、基板保持装置、基板処理装置、及び物品の製造方法
CN115008025B (zh) * 2021-03-04 2024-05-03 鑫天虹(厦门)科技有限公司 基板及半导体磊晶结构的雷射分离方法
US12027373B2 (en) 2021-05-28 2024-07-02 Canon Kabushiki Kaisha Planarization process, planarization system, and method of manufacturing an article
US12138747B2 (en) 2022-05-19 2024-11-12 Canon Kabushiki Kaisha Planarization process, apparatus and method of manufacturing an article
WO2024049719A2 (en) * 2022-08-29 2024-03-07 Rajeev Bajaj Advanced fluid delivery

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3106499B2 (ja) * 1990-11-30 2000-11-06 株式会社ニコン 露光装置
JPH0851143A (ja) * 1992-07-20 1996-02-20 Nikon Corp 基板保持装置
US5923408A (en) * 1996-01-31 1999-07-13 Canon Kabushiki Kaisha Substrate holding system and exposure apparatus using the same
JPH10242255A (ja) * 1997-02-28 1998-09-11 Kyocera Corp 真空吸着装置
TW524873B (en) 1997-07-11 2003-03-21 Applied Materials Inc Improved substrate supporting apparatus and processing chamber
US7790231B2 (en) * 2003-07-10 2010-09-07 Brewer Science Inc. Automated process and apparatus for planarization of topographical surfaces
JP3894562B2 (ja) * 2003-10-01 2007-03-22 キヤノン株式会社 基板吸着装置、露光装置およびデバイス製造方法
JP4739039B2 (ja) * 2006-01-31 2011-08-03 住友大阪セメント株式会社 静電チャック装置
US8336188B2 (en) * 2008-07-17 2012-12-25 Formfactor, Inc. Thin wafer chuck
JP2010067796A (ja) * 2008-09-11 2010-03-25 Canon Inc インプリント装置
US8913230B2 (en) * 2009-07-02 2014-12-16 Canon Nanotechnologies, Inc. Chucking system with recessed support feature
WO2012083578A1 (zh) 2010-12-22 2012-06-28 青岛理工大学 整片晶圆纳米压印的装置和方法.
USRE48429E1 (en) * 2013-05-23 2021-02-09 Nikon Corporation Substrate holding method, substrate holding apparatus, exposure apparatus and exposure method
WO2015070054A1 (en) * 2013-11-08 2015-05-14 Canon Nanotechnologies, Inc. Low contact imprint lithography template chuck system for improved overlay correction
US11104057B2 (en) 2015-12-11 2021-08-31 Canon Kabushiki Kaisha Imprint apparatus and method of imprinting a partial field
JP6546550B2 (ja) * 2016-03-09 2019-07-17 日本特殊陶業株式会社 真空吸着部材および真空吸着方法
EP3433875B1 (de) * 2016-03-22 2022-05-04 EV Group E. Thallner GmbH Verfahren zum bonden von substraten
JP6818351B2 (ja) * 2017-04-14 2021-01-20 サムコ株式会社 ウエハ処理装置
CN109390268B (zh) * 2017-08-10 2023-02-24 台湾积体电路制造股份有限公司 具有微粒凹口的夹盘的晶圆台、处理工具与使用晶圆台的方法
US11126083B2 (en) * 2018-01-24 2021-09-21 Canon Kabushiki Kaisha Superstrate and a method of using the same

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