JP2019022931A5 - - Google Patents

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Publication number
JP2019022931A5
JP2019022931A5 JP2018111068A JP2018111068A JP2019022931A5 JP 2019022931 A5 JP2019022931 A5 JP 2019022931A5 JP 2018111068 A JP2018111068 A JP 2018111068A JP 2018111068 A JP2018111068 A JP 2018111068A JP 2019022931 A5 JP2019022931 A5 JP 2019022931A5
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JP
Japan
Prior art keywords
polishing
polishing pad
grooves
outer edge
radial supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2018111068A
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English (en)
Japanese (ja)
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JP7323271B2 (ja
JP2019022931A (ja
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Publication date
Priority claimed from US15/726,027 external-priority patent/US10777418B2/en
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Publication of JP2019022931A publication Critical patent/JP2019022931A/ja
Publication of JP2019022931A5 publication Critical patent/JP2019022931A5/ja
Application granted granted Critical
Publication of JP7323271B2 publication Critical patent/JP7323271B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2018111068A 2017-06-14 2018-06-11 偏倚されたパルスｃｍｐ溝パターン Active JP7323271B2 (ja)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201715623166A 2017-06-14 2017-06-14
US15/623,166 2017-06-14
US201715625003A 2017-06-16 2017-06-16
US15/625,003 2017-06-16
US15/726,027 2017-10-05
US15/726,027 US10777418B2 (en) 2017-06-14 2017-10-05 Biased pulse CMP groove pattern

Publications (3)

Publication Number Publication Date
JP2019022931A JP2019022931A (ja) 2019-02-14
JP2019022931A5 true JP2019022931A5 (enExample) 2021-07-26
JP7323271B2 JP7323271B2 (ja) 2023-08-08

Family

ID=64457742

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018111068A Active JP7323271B2 (ja) 2017-06-14 2018-06-11 偏倚されたパルスｃｍｐ溝パターン

Country Status (8)

Country Link
US (2) US10777418B2 (enExample)
JP (1) JP7323271B2 (enExample)
KR (1) KR102660716B1 (enExample)
CN (1) CN109079649B (enExample)
DE (1) DE102018004632A1 (enExample)
FR (1) FR3067630B1 (enExample)
SG (1) SG10201804560VA (enExample)
TW (1) TWI799413B (enExample)

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US11331767B2 (en) * 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
KR102222851B1 (ko) * 2019-05-29 2021-03-08 한국생산기술연구원 그루브가 형성된 연마용 패드
KR102746090B1 (ko) 2020-03-13 2024-12-26 삼성전자주식회사 Cmp 패드 및 이를 구비하는 화학적 기계적 연마 장치

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