TWM475334U - Polishing pad - Google Patents

Polishing pad

Info

Publication number
TWM475334U
TWM475334U TW102210795U TW102210795U TWM475334U TW M475334 U TWM475334 U TW M475334U TW 102210795 U TW102210795 U TW 102210795U TW 102210795 U TW102210795 U TW 102210795U TW M475334 U TWM475334 U TW M475334U
Authority
TW
Taiwan
Prior art keywords
grooves
polishing pad
sub
polishing
rotational direction
Prior art date
Application number
TW102210795U
Other languages
Chinese (zh)
Inventor
Chun-Han Chen
Kun-Che Pai
Original Assignee
Iv Technologies Co Ltd
Taiwan Asahi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iv Technologies Co Ltd, Taiwan Asahi Diamond Industrial Co Ltd filed Critical Iv Technologies Co Ltd
Priority to TW102210795U priority Critical patent/TWM475334U/en
Priority to CN201410066190.7A priority patent/CN104227554A/en
Publication of TWM475334U publication Critical patent/TWM475334U/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Abstract

A polishing pad being applicable to a polishing system having a rotational direction is provided. The polishing pad has a polishing layer including a central region, a peripheral region, a plurality of main grooves and a plurality of sub grooves. The main grooves extend from near the central region to near the peripheral region, and the sub grooves are disposed between adjacent two of the main grooves. Each of the sub grooves has a respective length, and the respective lengths of the sub grooves are sequentially decreased along the rotational direction.
TW102210795U 2013-06-07 2013-06-07 Polishing pad TWM475334U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW102210795U TWM475334U (en) 2013-06-07 2013-06-07 Polishing pad
CN201410066190.7A CN104227554A (en) 2013-06-07 2014-02-26 Polishing pad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW102210795U TWM475334U (en) 2013-06-07 2013-06-07 Polishing pad

Publications (1)

Publication Number Publication Date
TWM475334U true TWM475334U (en) 2014-04-01

Family

ID=52216916

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102210795U TWM475334U (en) 2013-06-07 2013-06-07 Polishing pad

Country Status (2)

Country Link
CN (1) CN104227554A (en)
TW (1) TWM475334U (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10586708B2 (en) 2017-06-14 2020-03-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Uniform CMP polishing method
US10857647B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings High-rate CMP polishing method
US10857648B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Trapezoidal CMP groove pattern
US10777418B2 (en) 2017-06-14 2020-09-15 Rohm And Haas Electronic Materials Cmp Holdings, I Biased pulse CMP groove pattern
US10861702B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Controlled residence CMP polishing method
CN108044500A (en) * 2018-01-15 2018-05-18 华侨大学 A kind of abrasive disk and preparation method based on bionic plant train of thought
TWI679083B (en) * 2019-01-02 2019-12-11 力晶積成電子製造股份有限公司 Polishing pad

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW562716B (en) * 2002-08-23 2003-11-21 Applied Materials Inc A polishing pad for chemical mechanical polishing
KR100568258B1 (en) * 2004-07-01 2006-04-07 삼성전자주식회사 Polishing pad for chemical mechanical polishing and apparatus using the same
CN101987431B (en) * 2009-08-06 2015-08-19 智胜科技股份有限公司 Ginding process, grinding pad and grinding system
KR101091079B1 (en) * 2009-12-30 2011-12-09 세메스 주식회사 Disk unit for cleaning a substrate and cleaning apparatus having the same
CN102320031B (en) * 2011-08-25 2014-03-12 山东理工大学 Zirconia ceramic abrasive wheel and preparation method

Also Published As

Publication number Publication date
CN104227554A (en) 2014-12-24

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees