EP3007858A4 - Low surface roughness polishing pad - Google Patents

Low surface roughness polishing pad Download PDF

Info

Publication number
EP3007858A4
EP3007858A4 EP14811299.8A EP14811299A EP3007858A4 EP 3007858 A4 EP3007858 A4 EP 3007858A4 EP 14811299 A EP14811299 A EP 14811299A EP 3007858 A4 EP3007858 A4 EP 3007858A4
Authority
EP
European Patent Office
Prior art keywords
surface roughness
polishing pad
low surface
roughness polishing
low
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14811299.8A
Other languages
German (de)
French (fr)
Other versions
EP3007858A1 (en
Inventor
Jayakrishnan NAIR
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials Inc
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of EP3007858A1 publication Critical patent/EP3007858A1/en
Publication of EP3007858A4 publication Critical patent/EP3007858A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
EP14811299.8A 2013-06-13 2014-05-30 Low surface roughness polishing pad Withdrawn EP3007858A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/917,422 US20140370788A1 (en) 2013-06-13 2013-06-13 Low surface roughness polishing pad
PCT/US2014/040226 WO2014200726A1 (en) 2013-06-13 2014-05-30 Low surface roughness polishing pad

Publications (2)

Publication Number Publication Date
EP3007858A1 EP3007858A1 (en) 2016-04-20
EP3007858A4 true EP3007858A4 (en) 2017-03-08

Family

ID=52019618

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14811299.8A Withdrawn EP3007858A4 (en) 2013-06-13 2014-05-30 Low surface roughness polishing pad

Country Status (8)

Country Link
US (1) US20140370788A1 (en)
EP (1) EP3007858A4 (en)
JP (1) JP2016524549A (en)
KR (1) KR20160019465A (en)
CN (1) CN105163907B (en)
SG (1) SG11201508452VA (en)
TW (1) TWI542442B (en)
WO (1) WO2014200726A1 (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
JP6545261B2 (en) 2014-10-17 2019-07-17 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ CMP pad structure with composite properties using an additive manufacturing process
CN108290267B (en) 2015-10-30 2021-04-20 应用材料公司 Apparatus and method for forming polishing article having desired zeta potential
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
CN108698206B (en) 2016-01-19 2021-04-02 应用材料公司 Porous chemical mechanical polishing pad
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
KR101835087B1 (en) * 2017-05-29 2018-03-06 에스케이씨 주식회사 Porous polyurethane polishing pad and method preparing semiconductor device by using the same
KR101835090B1 (en) 2017-05-29 2018-03-06 에스케이씨 주식회사 Porous polyurethane polishing pad and method preparing semiconductor device by using the same
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. Abrasive delivery polishing pads and manufacturing methods thereof
CN112654655A (en) 2018-09-04 2021-04-13 应用材料公司 Advanced polishing pad formulations
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001091972A1 (en) * 2000-05-27 2001-12-06 Rodel Holdings, Inc. Grooved polishing pads for chemical mechanical planarization
US20090075568A1 (en) * 2005-05-18 2009-03-19 Toyo Tire & Rubber Co., Ltd. Polishing pad, method of producing the same and method of producing semiconductor device by using the same
WO2012068428A2 (en) * 2010-11-18 2012-05-24 Cabot Microelectronics Corporation Polishing pad comprising transmissive region

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2334205B (en) * 1998-02-12 2001-11-28 Shinetsu Handotai Kk Polishing method for semiconductor wafer and polishing pad used therein
WO2003043071A1 (en) * 2001-11-13 2003-05-22 Toyo Boseki Kabushiki Kaisha Grinding pad and method of producing the same
US6852020B2 (en) * 2003-01-22 2005-02-08 Raytech Innovative Solutions, Inc. Polishing pad for use in chemical—mechanical planarization of semiconductor wafers and method of making same
US20050276967A1 (en) * 2002-05-23 2005-12-15 Cabot Microelectronics Corporation Surface textured microporous polishing pads
US20040171339A1 (en) * 2002-10-28 2004-09-02 Cabot Microelectronics Corporation Microporous polishing pads
JP3910921B2 (en) * 2003-02-06 2007-04-25 株式会社東芝 Polishing cloth and method for manufacturing semiconductor device
US7435161B2 (en) * 2003-06-17 2008-10-14 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
KR100627202B1 (en) * 2003-07-17 2006-09-25 제이에스알 가부시끼가이샤 Chemical Mechanical Polishing Pad and Chemical Mechanical Polishing Method
US6899602B2 (en) * 2003-07-30 2005-05-31 Rohm And Haas Electronic Materials Cmp Holdings, Nc Porous polyurethane polishing pads
JP2005212055A (en) * 2004-01-30 2005-08-11 Kanebo Ltd Polishing cloth for nonwoven fabric base, and its fablication method
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
KR100774824B1 (en) * 2006-12-08 2007-11-07 동부일렉트로닉스 주식회사 Polishing pad to prevent scratch in cmp process
US20090061743A1 (en) * 2007-08-29 2009-03-05 Stephen Jew Method of soft pad preparation to reduce removal rate ramp-up effect and to stabilize defect rate
JP2009220265A (en) * 2008-02-18 2009-10-01 Jsr Corp Chemical machinery polishing pad
JP2009256473A (en) * 2008-04-17 2009-11-05 Nitta Haas Inc Manufacturing method of expanded polyurethane, and abrasive pad
US8585790B2 (en) * 2009-04-23 2013-11-19 Applied Materials, Inc. Treatment of polishing pad window
JP5184448B2 (en) * 2009-06-23 2013-04-17 富士紡ホールディングス株式会社 Polishing pad, method for producing the same, and polishing method
JP2012012957A (en) * 2010-06-29 2012-01-19 Toyota Motor Corp Cylinder block made of aluminum alloy, and method of manufacturing the same
US9067297B2 (en) * 2011-11-29 2015-06-30 Nexplanar Corporation Polishing pad with foundation layer and polishing surface layer
US9156125B2 (en) * 2012-04-11 2015-10-13 Cabot Microelectronics Corporation Polishing pad with light-stable light-transmitting region
US9597769B2 (en) * 2012-06-04 2017-03-21 Nexplanar Corporation Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001091972A1 (en) * 2000-05-27 2001-12-06 Rodel Holdings, Inc. Grooved polishing pads for chemical mechanical planarization
US20090075568A1 (en) * 2005-05-18 2009-03-19 Toyo Tire & Rubber Co., Ltd. Polishing pad, method of producing the same and method of producing semiconductor device by using the same
WO2012068428A2 (en) * 2010-11-18 2012-05-24 Cabot Microelectronics Corporation Polishing pad comprising transmissive region

Also Published As

Publication number Publication date
TWI542442B (en) 2016-07-21
CN105163907A (en) 2015-12-16
CN105163907B (en) 2017-11-28
US20140370788A1 (en) 2014-12-18
WO2014200726A1 (en) 2014-12-18
EP3007858A1 (en) 2016-04-20
SG11201508452VA (en) 2015-12-30
TW201501865A (en) 2015-01-16
KR20160019465A (en) 2016-02-19
JP2016524549A (en) 2016-08-18

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Effective date: 20170207

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Effective date: 20181201