SG11201600242PA - Low density polishing pad - Google Patents

Low density polishing pad

Info

Publication number
SG11201600242PA
SG11201600242PA SG11201600242PA SG11201600242PA SG11201600242PA SG 11201600242P A SG11201600242P A SG 11201600242PA SG 11201600242P A SG11201600242P A SG 11201600242PA SG 11201600242P A SG11201600242P A SG 11201600242PA SG 11201600242P A SG11201600242P A SG 11201600242PA
Authority
SG
Singapore
Prior art keywords
low density
polishing pad
density polishing
pad
low
Prior art date
Application number
SG11201600242PA
Inventor
Ping Huang
William C Allison
Richard Frentzel
Paul Andre Lefevre
Robert Kerprich
Diane Scott
Original Assignee
Nexplanar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nexplanar Corp filed Critical Nexplanar Corp
Publication of SG11201600242PA publication Critical patent/SG11201600242PA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/04—Zonally-graded surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B24D11/005—Making abrasive webs
    • B24D11/006—Making abrasive webs without embedded abrasive particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
SG11201600242PA 2013-07-31 2014-07-17 Low density polishing pad SG11201600242PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/955,398 US20150038066A1 (en) 2013-07-31 2013-07-31 Low density polishing pad
PCT/US2014/047065 WO2015017138A1 (en) 2013-07-31 2014-07-17 Low density polishing pad

Publications (1)

Publication Number Publication Date
SG11201600242PA true SG11201600242PA (en) 2016-02-26

Family

ID=51263570

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201600242PA SG11201600242PA (en) 2013-07-31 2014-07-17 Low density polishing pad

Country Status (8)

Country Link
US (1) US20150038066A1 (en)
EP (1) EP3027363B1 (en)
JP (3) JP6517802B2 (en)
KR (1) KR101801693B1 (en)
CN (1) CN105408063B (en)
SG (1) SG11201600242PA (en)
TW (1) TWI579106B (en)
WO (1) WO2015017138A1 (en)

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KR102283399B1 (en) 2018-12-26 2021-07-30 에스케이씨솔믹스 주식회사 Composition for polishing pad, polishing pad and preparation method thereof
KR102185265B1 (en) 2018-12-26 2020-12-01 에스케이씨 주식회사 Composition for polishing pad, polishing pad and preparation method thereof
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KR102237351B1 (en) 2019-06-17 2021-04-07 에스케이씨솔믹스 주식회사 Composition for polishing pad, polishing pad and preparation method of semiconductor device
KR102237362B1 (en) 2019-06-17 2021-04-07 에스케이씨솔믹스 주식회사 Composition for polishing pad, polishing pad and preparation method of semiconductor device
KR102197481B1 (en) 2019-06-27 2020-12-31 에스케이씨 주식회사 Polishing pad and preparation method thereof
KR102273097B1 (en) 2019-10-23 2021-07-05 에스케이씨솔믹스 주식회사 Composition for polishing pad, polishing pad and preparation method thereof
KR102304965B1 (en) 2019-10-30 2021-09-24 에스케이씨솔믹스 주식회사 Polishing pad, preparation method thereof, and preparation method of semiconductor device using same
TWI741753B (en) 2019-10-29 2021-10-01 南韓商Ｓｋｃ索密思股份有限公司 Polishing pad, process for preparing the same, and process for preparing a semiconductor device using the same
KR102188525B1 (en) 2019-10-29 2020-12-08 에스케이씨 주식회사 Polishing pad, preparation method thereof, and preparation method of semiconductor device using same
KR102287235B1 (en) 2019-10-30 2021-08-06 에스케이씨솔믹스 주식회사 Polishing pad with controlled crosslinking and preparation method thereof
KR102298114B1 (en) 2019-11-05 2021-09-03 에스케이씨솔믹스 주식회사 Polishing pad, preparation method thereof, and preparation method of semiconductor device using same
KR102287923B1 (en) 2019-10-30 2021-08-09 에스케이씨솔믹스 주식회사 Polishing pad, preparation method thereof, and preparation method of semiconductor device using same
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KR102300050B1 (en) 2019-11-15 2021-09-08 에스케이씨솔믹스 주식회사 Polyol recycled from polishing pad and preparation method thereof
KR102293765B1 (en) * 2019-11-21 2021-08-26 에스케이씨솔믹스 주식회사 Polishing pad, preparation method thereof, and preparation method of semiconductor device using same
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CN112091817B (en) * 2020-09-08 2022-06-17 中国航发贵州黎阳航空动力有限公司 Thin wall annular part terminal surface grinding tool
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Also Published As

Publication number Publication date
EP3027363A1 (en) 2016-06-08
KR20160027075A (en) 2016-03-09
EP3027363B1 (en) 2020-01-15
CN105408063B (en) 2018-01-30
JP2016525459A (en) 2016-08-25
KR101801693B1 (en) 2017-11-27
US20150038066A1 (en) 2015-02-05
JP2019077036A (en) 2019-05-23
JP2017042910A (en) 2017-03-02
TW201509595A (en) 2015-03-16
TWI579106B (en) 2017-04-21
JP6517802B2 (en) 2019-05-22
WO2015017138A1 (en) 2015-02-05
CN105408063A (en) 2016-03-16
JP6415521B2 (en) 2018-10-31

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