SG11201507373VA - Polishing pad having polishing surface with continuous protrusions having tapered sidewalls - Google Patents

Polishing pad having polishing surface with continuous protrusions having tapered sidewalls

Info

Publication number
SG11201507373VA
SG11201507373VA SG11201507373VA SG11201507373VA SG11201507373VA SG 11201507373V A SG11201507373V A SG 11201507373VA SG 11201507373V A SG11201507373V A SG 11201507373VA SG 11201507373V A SG11201507373V A SG 11201507373VA SG 11201507373V A SG11201507373V A SG 11201507373VA
Authority
SG
Singapore
Prior art keywords
polishing
tapered sidewalls
continuous protrusions
polishing pad
polishing surface
Prior art date
Application number
SG11201507373VA
Inventor
Paul Andre Lefevre
William C Allison
Alexander William Simpson
Diane Scott
Ping Huang
Leslie M Charns
James Richard Rinehart
Robert Kerprich
Original Assignee
Nexplanar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nexplanar Corp filed Critical Nexplanar Corp
Publication of SG11201507373VA publication Critical patent/SG11201507373VA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
SG11201507373VA 2013-03-14 2014-03-05 Polishing pad having polishing surface with continuous protrusions having tapered sidewalls SG11201507373VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/829,990 US10160092B2 (en) 2013-03-14 2013-03-14 Polishing pad having polishing surface with continuous protrusions having tapered sidewalls
PCT/US2014/020754 WO2014158892A1 (en) 2013-03-14 2014-03-05 Polishing pad having polishing surface with continuous protrusions having tapered sidewalls

Publications (1)

Publication Number Publication Date
SG11201507373VA true SG11201507373VA (en) 2015-10-29

Family

ID=50346154

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201507373VA SG11201507373VA (en) 2013-03-14 2014-03-05 Polishing pad having polishing surface with continuous protrusions having tapered sidewalls

Country Status (9)

Country Link
US (1) US10160092B2 (en)
EP (1) EP2969392B1 (en)
JP (2) JP6085064B2 (en)
KR (2) KR101708744B1 (en)
CN (1) CN105228797B (en)
MY (1) MY178773A (en)
SG (1) SG11201507373VA (en)
TW (1) TWI667098B (en)
WO (1) WO2014158892A1 (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014018170A1 (en) * 2012-07-23 2014-01-30 Jh Rhodes Company, Inc. Non-planar glass polishing pad and method of manufacture
KR102347711B1 (en) * 2014-04-03 2022-01-06 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Polishing pads and systems and methods of making and using the same
US9849562B2 (en) * 2015-12-28 2017-12-26 Shine-File Llc And manufacture of an abrasive polishing tool
KR101698989B1 (en) * 2016-01-22 2017-01-24 주식회사 썬텍인더스트리 Embossed abrasive article and preparation method thereof
JP6979030B2 (en) * 2016-03-24 2021-12-08 アプライド マテリアルズ インコーポレイテッドApplied Materials, Incorporated Small textured pad for chemical mechanical polishing
USD854902S1 (en) * 2016-09-23 2019-07-30 Husqvarna Construction Products North America, Inc. Polishing or grinding pad
WO2018142623A1 (en) * 2017-02-06 2018-08-09 株式会社大輝 Polishing pad recess forming method and polishing pad
JP6884015B2 (en) * 2017-03-22 2021-06-09 株式会社荏原製作所 Substrate polishing equipment and polishing method
JP6990993B2 (en) * 2017-05-26 2022-01-12 富士紡ホールディングス株式会社 Polishing pad and its manufacturing method, and manufacturing method of polished products
KR20200014364A (en) * 2017-06-01 2020-02-10 도쿄엘렉트론가부시키가이샤 Gettering layer forming apparatus, gettering layer forming method and computer storage medium
KR20190014307A (en) * 2017-08-02 2019-02-12 새솔다이아몬드공업 주식회사 Polishing pad dresser with rounded edge and polishing apparatus having the same
WO2019026021A1 (en) * 2017-08-04 2019-02-07 3M Innovative Properties Company Microreplicated polishing surface with enhanced co-planarity
USD958626S1 (en) * 2017-08-30 2022-07-26 Husqvarna Ab Polishing or grinding pad assembly with abrasive disks, reinforcement and pad
USD927952S1 (en) * 2017-08-30 2021-08-17 Husqvarna Ab Polishing or grinding pad assembly with abrasive disk, spacer, reinforcement and pad
MX2020013349A (en) * 2018-06-15 2021-03-09 Mirka Ltd Abrading with an abrading plate.
CN113661031A (en) * 2019-04-09 2021-11-16 恩特格里斯公司 Sector design of a disc
KR102221514B1 (en) * 2019-05-29 2021-03-03 한국생산기술연구원 Polishing pad having flow resistance structure of polishing liquid
US11524385B2 (en) * 2019-06-07 2022-12-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad with lobed protruding structures
US20210299816A1 (en) * 2020-03-25 2021-09-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cmp polishing pad with protruding structures having engineered open void space
US11833638B2 (en) 2020-03-25 2023-12-05 Rohm and Haas Electronic Materials Holding, Inc. CMP polishing pad with polishing elements on supports
KR102570825B1 (en) * 2020-07-16 2023-08-28 한국생산기술연구원 Polishing pad including porous protruding pattern and polishing apparatus including the same
KR102572960B1 (en) * 2021-06-10 2023-09-01 에프엔에스테크 주식회사 Polishing pad including a plurality of pattern structures
CN115056137A (en) * 2022-06-20 2022-09-16 万华化学集团电子材料有限公司 Polishing pad with grinding consistency end point detection window and application thereof

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5632790A (en) * 1990-05-21 1997-05-27 Wiand; Ronald C. Injection molded abrasive article and process
CA2201156A1 (en) * 1994-09-30 1996-04-11 The Minnesota Mining & Manufacturing Company Coated abrasive article, method for preparing the same, and method of using
US5876268A (en) * 1997-01-03 1999-03-02 Minnesota Mining And Manufacturing Company Method and article for the production of optical quality surfaces on glass
US5882251A (en) 1997-08-19 1999-03-16 Lsi Logic Corporation Chemical mechanical polishing pad slurry distribution grooves
US6121143A (en) * 1997-09-19 2000-09-19 3M Innovative Properties Company Abrasive articles comprising a fluorochemical agent for wafer surface modification
JP2000158327A (en) * 1998-12-02 2000-06-13 Rohm Co Ltd Polishing cloth for chemimechanical polishing and chemimechanical polisher using same
US6749714B1 (en) * 1999-03-30 2004-06-15 Nikon Corporation Polishing body, polisher, polishing method, and method for producing semiconductor device
JP2001079755A (en) * 1999-09-08 2001-03-27 Nikon Corp Abrasive body and polishing method
JP2000301450A (en) * 1999-04-19 2000-10-31 Rohm Co Ltd Cmp polishing pad and cmp processing device using it
US6458018B1 (en) 1999-04-23 2002-10-01 3M Innovative Properties Company Abrasive article suitable for abrading glass and glass ceramic workpieces
KR100387954B1 (en) * 1999-10-12 2003-06-19 (주) 휴네텍 Conditioner for polishing pad and method of manufacturing the same
US6439986B1 (en) * 1999-10-12 2002-08-27 Hunatech Co., Ltd. Conditioner for polishing pad and method for manufacturing the same
US6776699B2 (en) * 2000-08-14 2004-08-17 3M Innovative Properties Company Abrasive pad for CMP
JP2002057130A (en) * 2000-08-14 2002-02-22 Three M Innovative Properties Co Polishing pad for cmp
US6821189B1 (en) * 2000-10-13 2004-11-23 3M Innovative Properties Company Abrasive article comprising a structured diamond-like carbon coating and method of using same to mechanically treat a substrate
JP2002346927A (en) 2001-03-22 2002-12-04 Mitsubishi Materials Corp Cmp conditioner
US7070480B2 (en) 2001-10-11 2006-07-04 Applied Materials, Inc. Method and apparatus for polishing substrates
JP2005183707A (en) * 2003-12-19 2005-07-07 Toyo Tire & Rubber Co Ltd Polishing pad for cmp and polishing method using same
JP4227008B2 (en) 2003-12-22 2009-02-18 株式会社東芝 Printed circuit board
US7204742B2 (en) * 2004-03-25 2007-04-17 Cabot Microelectronics Corporation Polishing pad comprising hydrophobic region and endpoint detection port
US7150677B2 (en) * 2004-09-22 2006-12-19 Mitsubishi Materials Corporation CMP conditioner
US7182677B2 (en) * 2005-01-14 2007-02-27 Applied Materials, Inc. Chemical mechanical polishing pad for controlling polishing slurry distribution
US7594845B2 (en) * 2005-10-20 2009-09-29 3M Innovative Properties Company Abrasive article and method of modifying the surface of a workpiece
US20080271384A1 (en) * 2006-09-22 2008-11-06 Saint-Gobain Ceramics & Plastics, Inc. Conditioning tools and techniques for chemical mechanical planarization
US9180570B2 (en) * 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
CN101327577B (en) 2008-07-25 2010-04-21 南京航空航天大学 Fixed abrasive polishing pad with self-finishing function and even wear
JP2010045306A (en) 2008-08-18 2010-02-25 Kuraray Co Ltd Polishing pad
TWM352126U (en) * 2008-10-23 2009-03-01 Bestac Advanced Material Co Ltd Polishing pad
US9017140B2 (en) * 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US8439994B2 (en) * 2010-09-30 2013-05-14 Nexplanar Corporation Method of fabricating a polishing pad with an end-point detection region for eddy current end-point detection
CN102601747B (en) * 2011-01-20 2015-12-09 中芯国际集成电路制造(上海)有限公司 A kind of grinding pad and preparation method thereof, using method
US8968058B2 (en) 2011-05-05 2015-03-03 Nexplanar Corporation Polishing pad with alignment feature
US20120302148A1 (en) 2011-05-23 2012-11-29 Rajeev Bajaj Polishing pad with homogeneous body having discrete protrusions thereon
US8920219B2 (en) 2011-07-15 2014-12-30 Nexplanar Corporation Polishing pad with alignment aperture
US9649742B2 (en) 2013-01-22 2017-05-16 Nexplanar Corporation Polishing pad having polishing surface with continuous protrusions

Also Published As

Publication number Publication date
TW201505759A (en) 2015-02-16
KR101708744B1 (en) 2017-02-21
US20140273777A1 (en) 2014-09-18
KR20160056946A (en) 2016-05-20
US10160092B2 (en) 2018-12-25
CN105228797B (en) 2018-03-02
JP2017071053A (en) 2017-04-13
MY178773A (en) 2020-10-20
WO2014158892A1 (en) 2014-10-02
JP6085064B2 (en) 2017-02-22
KR20150127181A (en) 2015-11-16
TWI667098B (en) 2019-08-01
CN105228797A (en) 2016-01-06
EP2969392A1 (en) 2016-01-20
KR101669848B1 (en) 2016-10-27
JP2016511162A (en) 2016-04-14
EP2969392B1 (en) 2020-04-15

Similar Documents

Publication Publication Date Title
SG11201507373VA (en) Polishing pad having polishing surface with continuous protrusions having tapered sidewalls
SG11201600242PA (en) Low density polishing pad
SG11201508452VA (en) Low surface roughness polishing pad
SG11201705917PA (en) Low density polishing pad
HK1205959A1 (en) Bio-selective surface textures
EP2945521A4 (en) Cleaning pad
SI2976172T1 (en) Inoculant with surface particles
EP2956742A4 (en) Surface topography interferometer with surface color
EP2957270A4 (en) Disposable urine-absorption pad with bedsore-inhibition function
PT2983866T (en) Grinding body
SG11201510073UA (en) Surface modification
SG11201601847WA (en) Polishing composition
GB2514469B (en) Friction surface
SG11201601941SA (en) Polishing composition
AU354694S (en) Surface treatment pad
AU355851S (en) Surface treatment and cleaning pad
SG11201505900XA (en) Polishing pad
HUE036683T2 (en) Resin-bonded grinding disk
SG11201505490RA (en) Surface selective polishing compositions
SG11201505923QA (en) Polishing pad
GB2514153B (en) Hard surface cleaning device
HK1207921A1 (en) Battery with structured surface
EP2968855A4 (en) Multiconductor guidewire with chordal surface
HK1193309A2 (en) The handle used on the smooth surface
GB201320505D0 (en) Body support surface