JP3827858B2 - ポリイミド−金属積層体及びその製造方法 - Google Patents

ポリイミド−金属積層体及びその製造方法 Download PDF

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Publication number
JP3827858B2
JP3827858B2 JP10085998A JP10085998A JP3827858B2 JP 3827858 B2 JP3827858 B2 JP 3827858B2 JP 10085998 A JP10085998 A JP 10085998A JP 10085998 A JP10085998 A JP 10085998A JP 3827858 B2 JP3827858 B2 JP 3827858B2
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Japan
Prior art keywords
layer
polyimide
thermoplastic polyimide
metal
dianhydride
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP10085998A
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English (en)
Japanese (ja)
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JPH11291391A (ja
JPH11291391A5 (enExample
Inventor
公照 田川
英二 大坪
純 中島
正尚 小林
貴雄 木村
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Mitsui Chemicals Inc
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Mitsui Chemicals Inc
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Priority to JP10085998A priority Critical patent/JP3827858B2/ja
Publication of JPH11291391A publication Critical patent/JPH11291391A/ja
Publication of JPH11291391A5 publication Critical patent/JPH11291391A5/ja
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Publication of JP3827858B2 publication Critical patent/JP3827858B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP10085998A 1998-04-13 1998-04-13 ポリイミド−金属積層体及びその製造方法 Expired - Lifetime JP3827858B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10085998A JP3827858B2 (ja) 1998-04-13 1998-04-13 ポリイミド−金属積層体及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10085998A JP3827858B2 (ja) 1998-04-13 1998-04-13 ポリイミド−金属積層体及びその製造方法

Publications (3)

Publication Number Publication Date
JPH11291391A JPH11291391A (ja) 1999-10-26
JPH11291391A5 JPH11291391A5 (enExample) 2005-04-07
JP3827858B2 true JP3827858B2 (ja) 2006-09-27

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ID=14285049

Family Applications (1)

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JP10085998A Expired - Lifetime JP3827858B2 (ja) 1998-04-13 1998-04-13 ポリイミド−金属積層体及びその製造方法

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JP (1) JP3827858B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001032418A1 (fr) * 1999-11-01 2001-05-10 Kaneka Corporation Procede et dispositif de fabrication de plaques laminees
US6700185B1 (en) 1999-11-10 2004-03-02 Hitachi Chemical Co., Ltd. Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method for manufacturing semiconductor device
JP4936729B2 (ja) * 2006-01-12 2012-05-23 ユニチカ株式会社 フレキシブルプリント配線板用基板及びその製造方法
KR101064816B1 (ko) * 2009-04-03 2011-09-14 주식회사 두산 폴리아믹산 용액, 폴리이미드 수지 및 이를 이용한 연성 금속박 적층판

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Publication number Publication date
JPH11291391A (ja) 1999-10-26

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