JP3643600B2 - 半導体ウェーハ処理接着剤およびテープ - Google Patents

半導体ウェーハ処理接着剤およびテープ Download PDF

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Publication number
JP3643600B2
JP3643600B2 JP53601196A JP53601196A JP3643600B2 JP 3643600 B2 JP3643600 B2 JP 3643600B2 JP 53601196 A JP53601196 A JP 53601196A JP 53601196 A JP53601196 A JP 53601196A JP 3643600 B2 JP3643600 B2 JP 3643600B2
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JP
Japan
Prior art keywords
tape
adhesive
wafer
semiconductor wafer
wafer processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP53601196A
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English (en)
Japanese (ja)
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JPH11508924A5 (https=
JPH11508924A (ja
Inventor
ベネット，リチャード・イー
バード，ギアルド・シー
ネステガード，マーク・ケイ
ルディン，エリナー
Original Assignee
ミネソタ・マイニング・アンド・マニュファクチャリング・カンパニー
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Publication of JPH11508924A publication Critical patent/JPH11508924A/ja
Publication of JPH11508924A5 publication Critical patent/JPH11508924A5/ja
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Publication of JP3643600B2 publication Critical patent/JP3643600B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2857—Adhesive compositions including metal or compound thereof or natural rubber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2883—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer of diene monomer [e.g., SBR, SIS, etc.]

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP53601196A 1995-07-11 1996-06-13 半導体ウェーハ処理接着剤およびテープ Expired - Fee Related JP3643600B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US49989695A 1995-07-11 1995-07-11
US08/499,896 1995-07-11
PCT/US1996/010336 WO1997003461A1 (en) 1995-07-11 1996-06-13 Semiconductor wafer processing adhesives and tapes

Publications (3)

Publication Number Publication Date
JPH11508924A JPH11508924A (ja) 1999-08-03
JPH11508924A5 JPH11508924A5 (https=) 2004-07-08
JP3643600B2 true JP3643600B2 (ja) 2005-04-27

Family

ID=23987198

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53601196A Expired - Fee Related JP3643600B2 (ja) 1995-07-11 1996-06-13 半導体ウェーハ処理接着剤およびテープ

Country Status (11)

Country Link
US (1) US5851664A (https=)
EP (1) EP0838086B1 (https=)
JP (1) JP3643600B2 (https=)
KR (1) KR100430350B1 (https=)
CN (1) CN1195424A (https=)
AU (1) AU703233B2 (https=)
CA (1) CA2224774A1 (https=)
DE (1) DE69601942T2 (https=)
MY (1) MY123743A (https=)
TW (1) TW311927B (https=)
WO (1) WO1997003461A1 (https=)

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US5851664A (en) 1998-12-22
MX9800319A (es) 1998-07-31
WO1997003461A1 (en) 1997-01-30
EP0838086B1 (en) 1999-03-31
KR100430350B1 (ko) 2004-06-16
AU6177596A (en) 1997-02-10
AU703233B2 (en) 1999-03-18
EP0838086A1 (en) 1998-04-29
TW311927B (https=) 1997-08-01
DE69601942T2 (de) 1999-11-11
KR19990028881A (ko) 1999-04-15
CA2224774A1 (en) 1997-01-30
CN1195424A (zh) 1998-10-07
JPH11508924A (ja) 1999-08-03
DE69601942D1 (de) 1999-05-06

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