JP3601529B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP3601529B2
JP3601529B2 JP2002223933A JP2002223933A JP3601529B2 JP 3601529 B2 JP3601529 B2 JP 3601529B2 JP 2002223933 A JP2002223933 A JP 2002223933A JP 2002223933 A JP2002223933 A JP 2002223933A JP 3601529 B2 JP3601529 B2 JP 3601529B2
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JP
Japan
Prior art keywords
electrode layer
semiconductor element
bonding material
conductive bonding
thermal expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2002223933A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003133329A (ja
JP2003133329A5 (enExample
Inventor
康嗣 大倉
真光　　邦明
尚彦 平野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2002223933A priority Critical patent/JP3601529B2/ja
Publication of JP2003133329A publication Critical patent/JP2003133329A/ja
Application granted granted Critical
Publication of JP3601529B2 publication Critical patent/JP3601529B2/ja
Publication of JP2003133329A5 publication Critical patent/JP2003133329A5/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2002223933A 2001-08-09 2002-07-31 半導体装置 Expired - Lifetime JP3601529B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002223933A JP3601529B2 (ja) 2001-08-09 2002-07-31 半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001242077 2001-08-09
JP2001-242077 2001-08-09
JP2002223933A JP3601529B2 (ja) 2001-08-09 2002-07-31 半導体装置

Publications (3)

Publication Number Publication Date
JP2003133329A JP2003133329A (ja) 2003-05-09
JP3601529B2 true JP3601529B2 (ja) 2004-12-15
JP2003133329A5 JP2003133329A5 (enExample) 2005-04-07

Family

ID=26620269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002223933A Expired - Lifetime JP3601529B2 (ja) 2001-08-09 2002-07-31 半導体装置

Country Status (1)

Country Link
JP (1) JP3601529B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3750680B2 (ja) * 2003-10-10 2006-03-01 株式会社デンソー パッケージ型半導体装置
JP2006066464A (ja) * 2004-08-24 2006-03-09 Toyota Industries Corp 半導体装置
JP2006303290A (ja) * 2005-04-22 2006-11-02 Mitsubishi Electric Corp 半導体装置
JP2006310508A (ja) 2005-04-28 2006-11-09 Sanyo Electric Co Ltd 半導体装置およびその製造方法
JP4967277B2 (ja) * 2005-08-09 2012-07-04 富士電機株式会社 半導体装置およびその製造方法
JP2007142138A (ja) * 2005-11-18 2007-06-07 Mitsubishi Electric Corp 半導体装置
JP5073992B2 (ja) 2006-08-28 2012-11-14 オンセミコンダクター・トレーディング・リミテッド 半導体装置
JP5627499B2 (ja) * 2010-03-30 2014-11-19 株式会社デンソー 半導体モジュールを備えた半導体装置
JP5720647B2 (ja) * 2012-09-03 2015-05-20 トヨタ自動車株式会社 半導体装置及びその製造方法
JP5765324B2 (ja) 2012-12-10 2015-08-19 トヨタ自動車株式会社 半導体装置

Also Published As

Publication number Publication date
JP2003133329A (ja) 2003-05-09

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