JP3587788B2 - 昇降式基板処理装置及びこれを備えた基板処理システム - Google Patents

昇降式基板処理装置及びこれを備えた基板処理システム Download PDF

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Publication number
JP3587788B2
JP3587788B2 JP2001052572A JP2001052572A JP3587788B2 JP 3587788 B2 JP3587788 B2 JP 3587788B2 JP 2001052572 A JP2001052572 A JP 2001052572A JP 2001052572 A JP2001052572 A JP 2001052572A JP 3587788 B2 JP3587788 B2 JP 3587788B2
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JP
Japan
Prior art keywords
substrate
processing apparatus
substrate processing
winding
shaft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001052572A
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English (en)
Japanese (ja)
Other versions
JP2002261143A (ja
Inventor
茂 水川
勝利 中田
俊二 松元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Precision Products Co Ltd
Original Assignee
Sumitomo Precision Products Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Precision Products Co Ltd filed Critical Sumitomo Precision Products Co Ltd
Priority to JP2001052572A priority Critical patent/JP3587788B2/ja
Priority to TW091102877A priority patent/TW529072B/zh
Priority to PCT/JP2002/001583 priority patent/WO2002069392A1/ja
Priority to KR1020027011885A priority patent/KR20020093837A/ko
Priority to CNB028000315A priority patent/CN1246895C/zh
Publication of JP2002261143A publication Critical patent/JP2002261143A/ja
Application granted granted Critical
Publication of JP3587788B2 publication Critical patent/JP3587788B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
JP2001052572A 2001-02-27 2001-02-27 昇降式基板処理装置及びこれを備えた基板処理システム Expired - Fee Related JP3587788B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2001052572A JP3587788B2 (ja) 2001-02-27 2001-02-27 昇降式基板処理装置及びこれを備えた基板処理システム
TW091102877A TW529072B (en) 2001-02-27 2002-02-20 Lift-type substrate treatment device, and substrate treatment system with the substrate treatment device
PCT/JP2002/001583 WO2002069392A1 (fr) 2001-02-27 2002-02-21 Appareil de traitement de substrat de type leve et systeme de traitement du substrat avec l'appareil de traitement du substrat
KR1020027011885A KR20020093837A (ko) 2001-02-27 2002-02-21 승강식 기판 처리 장치 및 이것을 구비한 기판 처리시스템
CNB028000315A CN1246895C (zh) 2001-02-27 2002-02-21 升降式基板处理装置及具备其的基板处理系统

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001052572A JP3587788B2 (ja) 2001-02-27 2001-02-27 昇降式基板処理装置及びこれを備えた基板処理システム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2004003159A Division JP4627992B2 (ja) 2004-01-08 2004-01-08 基板処理システム

Publications (2)

Publication Number Publication Date
JP2002261143A JP2002261143A (ja) 2002-09-13
JP3587788B2 true JP3587788B2 (ja) 2004-11-10

Family

ID=18913183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001052572A Expired - Fee Related JP3587788B2 (ja) 2001-02-27 2001-02-27 昇降式基板処理装置及びこれを備えた基板処理システム

Country Status (5)

Country Link
JP (1) JP3587788B2 (zh)
KR (1) KR20020093837A (zh)
CN (1) CN1246895C (zh)
TW (1) TW529072B (zh)
WO (1) WO2002069392A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100454084C (zh) * 2003-12-20 2009-01-21 鸿富锦精密工业（深圳）有限公司 面板翻转机构
JP4515165B2 (ja) * 2004-06-21 2010-07-28 大日本スクリーン製造株式会社 基板搬送装置および基板処理装置
KR101177561B1 (ko) * 2004-12-06 2012-08-28 주식회사 케이씨텍 기판 이송 장치용 샤프트
JP4745040B2 (ja) * 2005-12-05 2011-08-10 東京エレクトロン株式会社 基板搬送装置及び基板処理装置
US8245663B2 (en) * 2006-08-22 2012-08-21 Nordson Corporation Apparatus and methods for handling workpieces in a processing system
CN102064126B (zh) * 2010-11-04 2013-04-17 友达光电股份有限公司 基板运输处理方法
CN104471697B (zh) * 2011-12-27 2018-03-16 因特瓦克公司 用于组合式静态和经过处理的系统体系结构
KR101298220B1 (ko) * 2012-01-20 2013-08-22 주식회사 엠엠테크 콤팩트한 기판 표면처리 시스템 및 기판 표면처리 방법
WO2017037785A1 (ja) * 2015-08-28 2017-03-09 株式会社日立国際電気 基板処理装置および半導体装置の製造方法
JP6297660B1 (ja) * 2016-11-22 2018-03-20 株式会社荏原製作所 処理装置、これを備えためっき装置、搬送装置、及び処理方法
CN117457549B (zh) * 2023-12-25 2024-04-12 富芯微电子有限公司 一种用于晶闸管管芯生产的表面腐蚀设备

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01137453U (zh) * 1988-03-16 1989-09-20
JP2000031239A (ja) * 1998-07-13 2000-01-28 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2000183019A (ja) * 1998-12-21 2000-06-30 Dainippon Screen Mfg Co Ltd 多段基板処理装置

Also Published As

Publication number Publication date
WO2002069392A1 (fr) 2002-09-06
KR20020093837A (ko) 2002-12-16
JP2002261143A (ja) 2002-09-13
CN1246895C (zh) 2006-03-22
CN1455951A (zh) 2003-11-12
TW529072B (en) 2003-04-21

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