JP3226650B2 - 横型二重拡散絶縁ゲート電界効果トランジスタ及びその製造方法 - Google Patents
横型二重拡散絶縁ゲート電界効果トランジスタ及びその製造方法Info
- Publication number
- JP3226650B2 JP3226650B2 JP02957593A JP2957593A JP3226650B2 JP 3226650 B2 JP3226650 B2 JP 3226650B2 JP 02957593 A JP02957593 A JP 02957593A JP 2957593 A JP2957593 A JP 2957593A JP 3226650 B2 JP3226650 B2 JP 3226650B2
- Authority
- JP
- Japan
- Prior art keywords
- region
- conductivity type
- drift region
- layer
- thin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/028—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs
- H10D30/0281—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of lateral DMOS [LDMOS] FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/601—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs
- H10D30/603—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs having asymmetry in the channel direction, e.g. lateral high-voltage MISFETs having drain offset region or extended drain IGFETs [EDMOS]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/65—Lateral DMOS [LDMOS] FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/149—Source or drain regions of field-effect devices
- H10D62/151—Source or drain regions of field-effect devices of IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/149—Source or drain regions of field-effect devices
- H10D62/151—Source or drain regions of field-effect devices of IGFETs
- H10D62/156—Drain regions of DMOS transistors
- H10D62/157—Impurity concentrations or distributions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
- H10D64/514—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the insulating layers
- H10D64/516—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the insulating layers the thicknesses being non-uniform
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/096—Lateral transistor
Landscapes
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US815732 | 1991-12-30 | ||
| US07/815,732 US5306652A (en) | 1991-12-30 | 1991-12-30 | Lateral double diffused insulated gate field effect transistor fabrication process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05343675A JPH05343675A (ja) | 1993-12-24 |
| JP3226650B2 true JP3226650B2 (ja) | 2001-11-05 |
Family
ID=25218688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP02957593A Expired - Fee Related JP3226650B2 (ja) | 1991-12-30 | 1993-01-04 | 横型二重拡散絶縁ゲート電界効果トランジスタ及びその製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US5306652A (cs) |
| EP (1) | EP0550015B1 (cs) |
| JP (1) | JP3226650B2 (cs) |
| KR (1) | KR100292567B1 (cs) |
| DE (1) | DE69218747T2 (cs) |
| TW (1) | TW273040B (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022138544A1 (ja) | 2020-12-21 | 2022-06-30 | 凸版印刷株式会社 | 簡易組み立てベッド、多目的テーブルおよび搬送軽量ボード |
Families Citing this family (77)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5306652A (en) * | 1991-12-30 | 1994-04-26 | Texas Instruments Incorporated | Lateral double diffused insulated gate field effect transistor fabrication process |
| US5631177A (en) * | 1992-12-07 | 1997-05-20 | Sgs-Thomson Microelectronics, S.R.L. | Process for manufacturing integrated circuit with power field effect transistors |
| US5517046A (en) * | 1993-11-19 | 1996-05-14 | Micrel, Incorporated | High voltage lateral DMOS device with enhanced drift region |
| US5510275A (en) * | 1993-11-29 | 1996-04-23 | Texas Instruments Incorporated | Method of making a semiconductor device with a composite drift region composed of a substrate and a second semiconductor material |
| US5777363A (en) * | 1993-11-29 | 1998-07-07 | Texas Instruments Incorporated | Semiconductor device with composite drift region |
| US5466616A (en) * | 1994-04-06 | 1995-11-14 | United Microelectronics Corp. | Method of producing an LDMOS transistor having reduced dimensions, reduced leakage, and a reduced propensity to latch-up |
| US5512495A (en) * | 1994-04-08 | 1996-04-30 | Texas Instruments Incorporated | Method of manufacturing extended drain resurf lateral DMOS devices |
| US5498554A (en) * | 1994-04-08 | 1996-03-12 | Texas Instruments Incorporated | Method of making extended drain resurf lateral DMOS devices |
| JP3275569B2 (ja) * | 1994-10-03 | 2002-04-15 | 富士電機株式会社 | 横型高耐圧電界効果トランジスタおよびその製造方法 |
| JPH08241985A (ja) * | 1995-03-06 | 1996-09-17 | Nippon Motorola Ltd | Ld−mosトランジスタ |
| KR970706614A (ko) * | 1995-07-19 | 1997-11-03 | 롤페스 제이 지 에이 | Hv-ldmost 형의 반도체 소자(semiconductor device of hv-ldmost type) |
| US5569937A (en) * | 1995-08-28 | 1996-10-29 | Motorola | High breakdown voltage silicon carbide transistor |
| US5719423A (en) * | 1995-08-31 | 1998-02-17 | Texas Instruments Incorporated | Isolated power transistor |
| KR0167273B1 (ko) * | 1995-12-02 | 1998-12-15 | 문정환 | 고전압 모스전계효과트렌지스터의 구조 및 그 제조방법 |
| JP3917211B2 (ja) * | 1996-04-15 | 2007-05-23 | 三菱電機株式会社 | 半導体装置 |
| KR100468342B1 (ko) * | 1996-05-15 | 2005-06-02 | 텍사스 인스트루먼츠 인코포레이티드 | 자기-정렬resurf영역을가진ldmos장치및그제조방법 |
| SE513283C2 (sv) * | 1996-07-26 | 2000-08-14 | Ericsson Telefon Ab L M | MOS-transistorstruktur med utsträckt driftregion |
| JP3315356B2 (ja) | 1997-10-15 | 2002-08-19 | 株式会社東芝 | 高耐圧半導体装置 |
| US6506648B1 (en) * | 1998-09-02 | 2003-01-14 | Cree Microwave, Inc. | Method of fabricating a high power RF field effect transistor with reduced hot electron injection and resulting structure |
| US6063674A (en) * | 1998-10-28 | 2000-05-16 | United Microelectronics Corp. | Method for forming high voltage device |
| US6117738A (en) * | 1998-11-20 | 2000-09-12 | United Microelectronics Corp. | Method for fabricating a high-bias semiconductor device |
| US6051456A (en) * | 1998-12-21 | 2000-04-18 | Motorola, Inc. | Semiconductor component and method of manufacture |
| US6531355B2 (en) * | 1999-01-25 | 2003-03-11 | Texas Instruments Incorporated | LDMOS device with self-aligned RESURF region and method of fabrication |
| JP3443355B2 (ja) * | 1999-03-12 | 2003-09-02 | 三洋電機株式会社 | 半導体装置の製造方法 |
| SE9901575L (sv) | 1999-05-03 | 2000-11-04 | Eklund Klas Haakan | Halvledarelement |
| TW408472B (en) * | 1999-05-06 | 2000-10-11 | United Microelectronics Corp | The manufacture method for increasing CMOS breakdown voltage |
| US6144069A (en) * | 1999-08-03 | 2000-11-07 | United Microelectronics Corp. | LDMOS transistor |
| US6429077B1 (en) * | 1999-12-02 | 2002-08-06 | United Microelectronics Corp. | Method of forming a lateral diffused metal-oxide semiconductor transistor |
| JP2003529939A (ja) * | 2000-03-31 | 2003-10-07 | イーハーペー ゲーエムベーハー−イノヴェイションズ フォー ハイ パフォーマンス マイクロエレクトロニクス/インスティチュート フュア イノヴァティーヴェ ミクロエレクトローニク | Cmos互換ラテラルdmosトランジスタおよび該トランジスタの作製方法 |
| TW512533B (en) | 2000-04-26 | 2002-12-01 | Sanyo Electric Co | Semiconductor device and its manufacturing process |
| US6521946B2 (en) | 2000-11-30 | 2003-02-18 | Texas Instruments Incorporated | Electrostatic discharge resistant extended drain metal oxide semiconductor transistor |
| JP3831615B2 (ja) * | 2001-01-16 | 2006-10-11 | 三洋電機株式会社 | 半導体装置とその製造方法 |
| JP4030269B2 (ja) * | 2001-03-06 | 2008-01-09 | 三洋電機株式会社 | 半導体装置とその製造方法 |
| GB0107405D0 (en) * | 2001-03-23 | 2001-05-16 | Koninkl Philips Electronics Nv | Field effect transistor structure and method of manufacture |
| US6822292B2 (en) * | 2001-11-21 | 2004-11-23 | Intersil Americas Inc. | Lateral MOSFET structure of an integrated circuit having separated device regions |
| US6730962B2 (en) * | 2001-12-07 | 2004-05-04 | Texas Instruments Incorporated | Method of manufacturing and structure of semiconductor device with field oxide structure |
| KR100867574B1 (ko) * | 2002-05-09 | 2008-11-10 | 페어차일드코리아반도체 주식회사 | 고전압 디바이스 및 그 제조방법 |
| KR100958421B1 (ko) * | 2002-09-14 | 2010-05-18 | 페어차일드코리아반도체 주식회사 | 전력 소자 및 그 제조방법 |
| US6833586B2 (en) * | 2003-01-02 | 2004-12-21 | Micrel, Inc. | LDMOS transistor with high voltage source and drain terminals |
| US7235451B2 (en) * | 2003-03-03 | 2007-06-26 | Texas Instruments Incorporated | Drain extended MOS devices with self-aligned floating region and fabrication methods therefor |
| US6900101B2 (en) * | 2003-06-13 | 2005-05-31 | Texas Instruments Incorporated | LDMOS transistors and methods for making the same |
| US7005354B2 (en) * | 2003-09-23 | 2006-02-28 | Texas Instruments Incorporated | Depletion drain-extended MOS transistors and methods for making the same |
| JP4707947B2 (ja) * | 2003-11-14 | 2011-06-22 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| US7180140B1 (en) * | 2004-04-16 | 2007-02-20 | National Semiconductor Corporation | PMOS device with drain junction breakdown point located for reduced drain breakdown voltage walk-in and method for designing and manufacturing such device |
| US7238986B2 (en) * | 2004-05-03 | 2007-07-03 | Texas Instruments Incorporated | Robust DEMOS transistors and method for making the same |
| US7192834B2 (en) * | 2005-02-23 | 2007-03-20 | Macronix International Co., Ltd | LDMOS device and method of fabrication of LDMOS device |
| JP4890773B2 (ja) | 2005-03-07 | 2012-03-07 | ラピスセミコンダクタ株式会社 | 半導体装置及びその製造方法 |
| US7868378B1 (en) | 2005-07-18 | 2011-01-11 | Volterra Semiconductor Corporation | Methods and apparatus for LDMOS transistors |
| JP3897801B2 (ja) * | 2005-08-31 | 2007-03-28 | シャープ株式会社 | 横型二重拡散型電界効果トランジスタおよびそれを備えた集積回路 |
| US7375408B2 (en) * | 2005-10-11 | 2008-05-20 | United Microelectronics Corp. | Fabricating method of a high voltage metal oxide semiconductor device |
| JP2007227775A (ja) * | 2006-02-24 | 2007-09-06 | Sanyo Electric Co Ltd | 半導体装置及びその製造方法 |
| US7476591B2 (en) | 2006-10-13 | 2009-01-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lateral power MOSFET with high breakdown voltage and low on-resistance |
| US7989890B2 (en) | 2006-10-13 | 2011-08-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lateral power MOSFET with high breakdown voltage and low on-resistance |
| JP2009206492A (ja) * | 2008-01-31 | 2009-09-10 | Toshiba Corp | 半導体装置 |
| JP5420854B2 (ja) * | 2008-04-28 | 2014-02-19 | パナソニック株式会社 | 半導体装置およびその製造方法 |
| US7851314B2 (en) * | 2008-04-30 | 2010-12-14 | Alpha And Omega Semiconductor Incorporated | Short channel lateral MOSFET and method |
| US8174071B2 (en) * | 2008-05-02 | 2012-05-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | High voltage LDMOS transistor |
| US8163621B2 (en) | 2008-06-06 | 2012-04-24 | Globalfoundries Singapore Pte. Ltd. | High performance LDMOS device having enhanced dielectric strain layer |
| JP2010010408A (ja) * | 2008-06-27 | 2010-01-14 | Sanyo Electric Co Ltd | 半導体装置及びその製造方法 |
| US7960786B2 (en) * | 2008-07-09 | 2011-06-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Breakdown voltages of ultra-high voltage devices by forming tunnels |
| US7768071B2 (en) * | 2008-07-09 | 2010-08-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Stabilizing breakdown voltages by forming tunnels for ultra-high voltage devices |
| US8097930B2 (en) * | 2008-08-08 | 2012-01-17 | Infineon Technologies Ag | Semiconductor devices with trench isolations |
| KR101049876B1 (ko) * | 2008-11-19 | 2011-07-19 | 주식회사 동부하이텍 | 횡형 디모스 소자 및 그의 제조 방법 |
| KR101578931B1 (ko) * | 2008-12-05 | 2015-12-21 | 주식회사 동부하이텍 | 반도체 소자 및 반도체 소자의 제조 방법 |
| TWI503893B (zh) * | 2008-12-30 | 2015-10-11 | Vanguard Int Semiconduct Corp | 半導體結構及其製作方法 |
| US8643090B2 (en) * | 2009-03-23 | 2014-02-04 | Infineon Technologies Ag | Semiconductor devices and methods for manufacturing a semiconductor device |
| EP2244299A1 (en) * | 2009-04-22 | 2010-10-27 | STMicroelectronics S.r.l. | MOS transistor for power applications and corresponding integrated circuit and manufacturing method |
| CN102130165B (zh) * | 2010-01-18 | 2013-03-13 | 上海华虹Nec电子有限公司 | Ldmos器件的源区及其制造方法 |
| CN102130168B (zh) * | 2010-01-20 | 2013-04-24 | 上海华虹Nec电子有限公司 | 隔离型ldnmos器件及其制造方法 |
| JP2011181709A (ja) * | 2010-03-02 | 2011-09-15 | Hitachi Ltd | 半導体装置およびその製造方法 |
| US9214457B2 (en) | 2011-09-20 | 2015-12-15 | Alpha & Omega Semiconductor Incorporated | Method of integrating high voltage devices |
| CN103035678B (zh) * | 2012-06-08 | 2015-04-08 | 上海华虹宏力半导体制造有限公司 | Rf ldmos器件及制造方法 |
| US9117845B2 (en) * | 2013-01-25 | 2015-08-25 | Fairchild Semiconductor Corporation | Production of laterally diffused oxide semiconductor (LDMOS) device and a bipolar junction transistor (BJT) device using a semiconductor process |
| US8987107B2 (en) | 2013-02-19 | 2015-03-24 | Fairchild Semiconductor Corporation | Production of high-performance passive devices using existing operations of a semiconductor process |
| WO2015008550A1 (ja) * | 2013-07-19 | 2015-01-22 | 日産自動車株式会社 | 半導体装置及びその製造方法 |
| JP6723775B2 (ja) * | 2016-03-16 | 2020-07-15 | エイブリック株式会社 | 半導体装置および半導体装置の製造方法 |
| US10672903B2 (en) | 2018-07-25 | 2020-06-02 | Nxp Usa, Inc. | Semiconductor device with drain active area |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4333225A (en) * | 1978-12-18 | 1982-06-08 | Xerox Corporation | Method of making a circular high voltage field effect transistor |
| US4330150A (en) * | 1980-05-19 | 1982-05-18 | Dunchock Richard S | Removable roof panel for vehicles |
| US4300150A (en) * | 1980-06-16 | 1981-11-10 | North American Philips Corporation | Lateral double-diffused MOS transistor device |
| NL8003612A (nl) * | 1980-06-23 | 1982-01-18 | Philips Nv | Werkwijze ter vervaardiging van een halfgeleider- inrichting en halfgeleiderinrichting vervaardigd door toepassing van deze werkwijze. |
| US4716126A (en) * | 1986-06-05 | 1987-12-29 | Siliconix Incorporated | Fabrication of double diffused metal oxide semiconductor transistor |
| JP2916158B2 (ja) * | 1989-01-27 | 1999-07-05 | 株式会社東芝 | 導電変調型mosfet |
| US4748134A (en) * | 1987-05-26 | 1988-05-31 | Motorola, Inc. | Isolation process for semiconductor devices |
| GB2206993A (en) * | 1987-06-08 | 1989-01-18 | Philips Electronic Associated | A method of manufacturing a semiconductor device |
| US4795716A (en) * | 1987-06-19 | 1989-01-03 | General Electric Company | Method of making a power IC structure with enhancement and/or CMOS logic |
| FR2616966B1 (fr) * | 1987-06-22 | 1989-10-27 | Thomson Semiconducteurs | Structure de transistors mos de puissance |
| US4839704A (en) * | 1987-09-16 | 1989-06-13 | National Semiconductor Corporation | Application of deep-junction non-self-aligned transistors for suppressing hot carriers |
| US4922327A (en) * | 1987-12-24 | 1990-05-01 | University Of Toronto Innovations Foundation | Semiconductor LDMOS device with upper and lower passages |
| JP2622721B2 (ja) * | 1988-06-09 | 1997-06-18 | 富士通株式会社 | 半導体装置およびその製造方法 |
| US5237193A (en) * | 1988-06-24 | 1993-08-17 | Siliconix Incorporated | Lightly doped drain MOSFET with reduced on-resistance |
| JPH0817234B2 (ja) * | 1988-07-20 | 1996-02-21 | 富士電機株式会社 | 半導体集積回路 |
| US5055896A (en) * | 1988-12-15 | 1991-10-08 | Siliconix Incorporated | Self-aligned LDD lateral DMOS transistor with high-voltage interconnect capability |
| US4868135A (en) * | 1988-12-21 | 1989-09-19 | International Business Machines Corporation | Method for manufacturing a Bi-CMOS device |
| US4918026A (en) * | 1989-03-17 | 1990-04-17 | Delco Electronics Corporation | Process for forming vertical bipolar transistors and high voltage CMOS in a single integrated circuit chip |
| US5045492A (en) * | 1989-09-25 | 1991-09-03 | Allegro Microsystems, Inc. | Method of making integrated circuit with high current transistor and CMOS transistors |
| JPH07110766B2 (ja) * | 1989-12-11 | 1995-11-29 | 財団法人国際超電導産業技術研究センター | 酸化物超電導体の製造方法 |
| US5179032A (en) * | 1990-02-01 | 1993-01-12 | Quigg Fred L | Mosfet structure having reduced capacitance and method of forming same |
| US5110756A (en) * | 1991-07-03 | 1992-05-05 | At&T Bell Laboratories | Method of semiconductor integrated circuit manufacturing which includes processing for reducing defect density |
| DE69225552T2 (de) * | 1991-10-15 | 1999-01-07 | Texas Instruments Inc., Dallas, Tex. | Lateraler doppel-diffundierter MOS-Transistor und Verfahren zu seiner Herstellung |
| US5306652A (en) * | 1991-12-30 | 1994-04-26 | Texas Instruments Incorporated | Lateral double diffused insulated gate field effect transistor fabrication process |
| US5322804A (en) * | 1992-05-12 | 1994-06-21 | Harris Corporation | Integration of high voltage lateral MOS devices in low voltage CMOS architecture using CMOS-compatible process steps |
| US5273922A (en) * | 1992-09-11 | 1993-12-28 | Motorola, Inc. | High speed, low gate/drain capacitance DMOS device |
-
1991
- 1991-12-30 US US07/815,732 patent/US5306652A/en not_active Expired - Lifetime
-
1992
- 1992-12-23 EP EP92121916A patent/EP0550015B1/en not_active Expired - Lifetime
- 1992-12-23 DE DE69218747T patent/DE69218747T2/de not_active Expired - Fee Related
- 1992-12-30 KR KR1019920026428A patent/KR100292567B1/ko not_active Expired - Fee Related
-
1993
- 1993-01-04 JP JP02957593A patent/JP3226650B2/ja not_active Expired - Fee Related
- 1993-07-10 TW TW082105497A patent/TW273040B/zh not_active IP Right Cessation
-
1994
- 1994-02-01 US US08/191,228 patent/US5406110A/en not_active Expired - Lifetime
- 1994-05-12 US US08/241,543 patent/US5578514A/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022138544A1 (ja) | 2020-12-21 | 2022-06-30 | 凸版印刷株式会社 | 簡易組み立てベッド、多目的テーブルおよび搬送軽量ボード |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100292567B1 (ko) | 2001-09-17 |
| US5578514A (en) | 1996-11-26 |
| EP0550015A1 (en) | 1993-07-07 |
| DE69218747T2 (de) | 1997-07-10 |
| JPH05343675A (ja) | 1993-12-24 |
| DE69218747D1 (de) | 1997-05-07 |
| KR930015099A (ko) | 1993-07-23 |
| US5406110A (en) | 1995-04-11 |
| US5306652A (en) | 1994-04-26 |
| EP0550015B1 (en) | 1997-04-02 |
| TW273040B (cs) | 1996-03-21 |
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