JP3175433U7 - - Google Patents
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- Publication number
- JP3175433U7 JP3175433U7 JP2012000976U JP2012000976U JP3175433U7 JP 3175433 U7 JP3175433 U7 JP 3175433U7 JP 2012000976 U JP2012000976 U JP 2012000976U JP 2012000976 U JP2012000976 U JP 2012000976U JP 3175433 U7 JP3175433 U7 JP 3175433U7
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- frame
- diode package
- side wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 238000005452 bending Methods 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- 239000011135 tin Substances 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 239000011701 zinc Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020070038279A KR100901618B1 (ko) | 2007-04-19 | 2007-04-19 | 발광 다이오드 패키지 및 제조방법 |
| KR10-2007-0038279 | 2007-04-19 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012037168 Continuation | 2008-04-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP3175433U JP3175433U (ja) | 2012-05-10 |
| JP3175433U7 true JP3175433U7 (enExample) | 2012-10-11 |
Family
ID=39875630
Family Applications (7)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010503977A Withdrawn JP2010525569A (ja) | 2007-04-19 | 2008-04-17 | 発光デバイスパッケージ及びこれを備えるライトユニット |
| JP2012037166A Withdrawn JP2012109611A (ja) | 2007-04-19 | 2012-02-23 | 半導体ダイオードパッケージ及びその製造方法 |
| JP2012000976U Expired - Lifetime JP3175433U (ja) | 2007-04-19 | 2012-02-23 | 半導体ダイオードパッケージ |
| JP2012037167A Withdrawn JP2012109612A (ja) | 2007-04-19 | 2012-02-23 | 半導体ダイオードパッケージ及びその製造方法 |
| JP2013066840A Pending JP2013128154A (ja) | 2007-04-19 | 2013-03-27 | 発光デバイスパッケージ及びこれを備えるライトユニット |
| JP2015027327A Pending JP2015092639A (ja) | 2007-04-19 | 2015-02-16 | 発光デバイスパッケージ及びこれを備えるライトユニット |
| JP2016197934A Pending JP2017011307A (ja) | 2007-04-19 | 2016-10-06 | 発光デバイスパッケージ |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010503977A Withdrawn JP2010525569A (ja) | 2007-04-19 | 2008-04-17 | 発光デバイスパッケージ及びこれを備えるライトユニット |
| JP2012037166A Withdrawn JP2012109611A (ja) | 2007-04-19 | 2012-02-23 | 半導体ダイオードパッケージ及びその製造方法 |
Family Applications After (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012037167A Withdrawn JP2012109612A (ja) | 2007-04-19 | 2012-02-23 | 半導体ダイオードパッケージ及びその製造方法 |
| JP2013066840A Pending JP2013128154A (ja) | 2007-04-19 | 2013-03-27 | 発光デバイスパッケージ及びこれを備えるライトユニット |
| JP2015027327A Pending JP2015092639A (ja) | 2007-04-19 | 2015-02-16 | 発光デバイスパッケージ及びこれを備えるライトユニット |
| JP2016197934A Pending JP2017011307A (ja) | 2007-04-19 | 2016-10-06 | 発光デバイスパッケージ |
Country Status (4)
| Country | Link |
|---|---|
| US (12) | US7858993B2 (enExample) |
| JP (7) | JP2010525569A (enExample) |
| KR (1) | KR100901618B1 (enExample) |
| WO (1) | WO2008130140A1 (enExample) |
Families Citing this family (59)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100901618B1 (ko) | 2007-04-19 | 2009-06-08 | 엘지이노텍 주식회사 | 발광 다이오드 패키지 및 제조방법 |
| KR101360732B1 (ko) * | 2007-06-27 | 2014-02-07 | 엘지이노텍 주식회사 | 발광 다이오드 패키지 |
| JP5186930B2 (ja) * | 2008-01-24 | 2013-04-24 | 豊田合成株式会社 | 発光装置 |
| US20110260192A1 (en) * | 2008-10-01 | 2011-10-27 | Chang Hoon Kwak | Light-emitting diode package using a liquid crystal polymer |
| US7923739B2 (en) | 2009-06-05 | 2011-04-12 | Cree, Inc. | Solid state lighting device |
| US8598602B2 (en) | 2009-01-12 | 2013-12-03 | Cree, Inc. | Light emitting device packages with improved heat transfer |
| US9685592B2 (en) * | 2009-01-14 | 2017-06-20 | Cree Huizhou Solid State Lighting Company Limited | Miniature surface mount device with large pin pads |
| US8860043B2 (en) * | 2009-06-05 | 2014-10-14 | Cree, Inc. | Light emitting device packages, systems and methods |
| US8686445B1 (en) | 2009-06-05 | 2014-04-01 | Cree, Inc. | Solid state lighting devices and methods |
| US9111778B2 (en) | 2009-06-05 | 2015-08-18 | Cree, Inc. | Light emitting diode (LED) devices, systems, and methods |
| TWI394299B (zh) * | 2009-11-06 | 2013-04-21 | 旭明光電股份有限公司 | 具有外移式電極之垂直發光二極體 |
| TW201135989A (en) * | 2010-01-25 | 2011-10-16 | Vishay Sprague Inc | Metal based electronic component package and the method of manufacturing the same |
| US8525213B2 (en) * | 2010-03-30 | 2013-09-03 | Lg Innotek Co., Ltd. | Light emitting device having multiple cavities and light unit having the same |
| KR101081169B1 (ko) * | 2010-04-05 | 2011-11-07 | 엘지이노텍 주식회사 | 발광 소자 및 그 제조방법, 발광 소자 패키지, 조명 시스템 |
| KR101103674B1 (ko) | 2010-06-01 | 2012-01-11 | 엘지이노텍 주식회사 | 발광 소자 |
| JP2011253910A (ja) * | 2010-06-01 | 2011-12-15 | Toshiba Corp | 発光装置 |
| KR101859149B1 (ko) | 2011-04-14 | 2018-05-17 | 엘지이노텍 주식회사 | 발광 소자 패키지 |
| US20110303940A1 (en) * | 2010-06-14 | 2011-12-15 | Hyo Jin Lee | Light emitting device package using quantum dot, illumination apparatus and display apparatus |
| US8269244B2 (en) | 2010-06-28 | 2012-09-18 | Cree, Inc. | LED package with efficient, isolated thermal path |
| US8648359B2 (en) | 2010-06-28 | 2014-02-11 | Cree, Inc. | Light emitting devices and methods |
| KR101798231B1 (ko) * | 2010-07-05 | 2017-11-15 | 엘지이노텍 주식회사 | 발광 소자 |
| USD643819S1 (en) | 2010-07-16 | 2011-08-23 | Cree, Inc. | Package for light emitting diode (LED) lighting |
| MY170920A (en) | 2010-11-02 | 2019-09-17 | Carsem M Sdn Bhd | Leadframe package with recessed cavity for led |
| CN102456818A (zh) * | 2010-11-03 | 2012-05-16 | 富士康(昆山)电脑接插件有限公司 | 发光二极管导线架 |
| TWI609508B (zh) * | 2010-11-03 | 2017-12-21 | 惠州科銳半導體照明有限公司 | 具有大型接腳墊片的微型表面安裝元件 |
| US10267506B2 (en) | 2010-11-22 | 2019-04-23 | Cree, Inc. | Solid state lighting apparatuses with non-uniformly spaced emitters for improved heat distribution, system having the same, and methods having the same |
| US11101408B2 (en) | 2011-02-07 | 2021-08-24 | Creeled, Inc. | Components and methods for light emitting diode (LED) lighting |
| US8610140B2 (en) | 2010-12-15 | 2013-12-17 | Cree, Inc. | Light emitting diode (LED) packages, systems, devices and related methods |
| USD679842S1 (en) | 2011-01-03 | 2013-04-09 | Cree, Inc. | High brightness LED package |
| TW201251140A (en) | 2011-01-31 | 2012-12-16 | Cree Inc | High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion |
| WO2012116470A1 (en) | 2011-03-02 | 2012-09-07 | Cree Huizhou Solid State Lighting Company Limited | Miniature surface mount device |
| WO2012151270A1 (en) * | 2011-05-03 | 2012-11-08 | Cree, Inc. | Light emitting diode (led) packages, systems, devices and related methods |
| US9397274B2 (en) * | 2011-08-24 | 2016-07-19 | Lg Innotek Co., Ltd. | Light emitting device package |
| JP5978572B2 (ja) * | 2011-09-02 | 2016-08-24 | 日亜化学工業株式会社 | 発光装置 |
| MY156107A (en) | 2011-11-01 | 2016-01-15 | Carsem M Sdn Bhd | Large panel leadframe |
| KR101459555B1 (ko) * | 2011-11-02 | 2014-11-07 | 엘지이노텍 주식회사 | 발광 소자 |
| JP5914933B2 (ja) * | 2011-12-21 | 2016-05-11 | 住友化学株式会社 | 半導体用パッケージの製造方法、半導体用パッケージ及び半導体発光装置 |
| JP2013143520A (ja) * | 2012-01-12 | 2013-07-22 | Sony Corp | 撮像装置および撮像装置の製造方法 |
| KR20140004881A (ko) * | 2012-07-03 | 2014-01-14 | 삼성디스플레이 주식회사 | 백라이트 유닛 |
| TWI485962B (zh) * | 2012-12-22 | 2015-05-21 | Univ Kun Shan | Zero Current Switching Parallel Load Resonant Converter |
| KR20150019828A (ko) * | 2013-08-16 | 2015-02-25 | 삼성전자주식회사 | 발광소자 패키지 및 그 제조방법 |
| DE102013110355A1 (de) * | 2013-09-19 | 2015-03-19 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Verfahren zum Herstellen eines Leiterrahmenverbunds |
| JP2017063066A (ja) * | 2014-01-30 | 2017-03-30 | パナソニックIpマネジメント株式会社 | 半導体装置及び半導体パッケージ |
| KR101501020B1 (ko) * | 2014-02-17 | 2015-03-13 | 주식회사 루멘스 | 발광 소자 패키지, 백라이트 유닛, 조명 장치 및 발광 소자 패키지의 제조 방법 |
| KR101583561B1 (ko) * | 2014-05-29 | 2016-01-08 | 엘지이노텍 주식회사 | 발광 소자 |
| WO2016035508A1 (ja) * | 2014-09-01 | 2016-03-10 | シャープ株式会社 | 発光装置 |
| JP6156402B2 (ja) | 2015-02-13 | 2017-07-05 | 日亜化学工業株式会社 | 発光装置 |
| JP6206442B2 (ja) * | 2015-04-30 | 2017-10-04 | 日亜化学工業株式会社 | パッケージ及びその製造方法、並びに発光装置 |
| JP6862141B2 (ja) * | 2015-10-14 | 2021-04-21 | エルジー イノテック カンパニー リミテッド | 発光素子パッケージ及び照明装置 |
| US10024492B1 (en) | 2016-04-07 | 2018-07-17 | Pelco Products, Inc. | Cable-mounted traffic control device support bracket with strut member adapter |
| US10193320B1 (en) | 2016-10-10 | 2019-01-29 | Pelco Products, Inc. | Integral terminal compartment with deployable terminal block |
| KR102674066B1 (ko) * | 2016-11-11 | 2024-06-13 | 삼성전자주식회사 | 발광 소자 패키지 |
| US10401000B1 (en) | 2017-03-01 | 2019-09-03 | Pelco Products, Inc. | Traffic control device with wind dampening backplate assembly |
| CN108727813A (zh) * | 2018-05-25 | 2018-11-02 | 郑州智锦电子科技有限公司 | 一种led灯外壳材料 |
| DE102019106931A1 (de) | 2019-03-19 | 2020-09-24 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Halbleiterbauelement, optoelektronische Halbleitervorrichtung und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements |
| JP7349294B2 (ja) * | 2019-08-29 | 2023-09-22 | 株式会社ジャパンディスプレイ | Ledモジュール及び表示装置 |
| US11444227B2 (en) | 2019-10-01 | 2022-09-13 | Dominant Opto Technologies Sdn Bhd | Light emitting diode package with substrate configuration having enhanced structural integrity |
| US11444225B2 (en) | 2020-09-08 | 2022-09-13 | Dominant Opto Technologies Sdn Bhd | Light emitting diode package having a protective coating |
| US11329206B2 (en) | 2020-09-28 | 2022-05-10 | Dominant Opto Technologies Sdn Bhd | Lead frame and housing sub-assembly for use in a light emitting diode package and method for manufacturing the same |
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| JPS50133873U (enExample) * | 1975-04-18 | 1975-11-04 | ||
| JPS5396695A (en) * | 1977-02-03 | 1978-08-24 | Toyo Dengu Seisakushiyo Kk | Display |
| JPS53145476U (enExample) * | 1977-04-20 | 1978-11-16 | ||
| JPS5933265U (ja) * | 1982-08-26 | 1984-03-01 | シャープ株式会社 | 発光半導体表示装置 |
| JPS60180176A (ja) * | 1984-02-27 | 1985-09-13 | Oki Electric Ind Co Ltd | 光結合半導体装置 |
| JPH06204569A (ja) * | 1992-12-28 | 1994-07-22 | Casio Comput Co Ltd | 発光ダイオードの構造 |
| DE19829197C2 (de) * | 1998-06-30 | 2002-06-20 | Siemens Ag | Strahlungsaussendendes und/oder -empfangendes Bauelement |
| JP2000183407A (ja) | 1998-12-16 | 2000-06-30 | Rohm Co Ltd | 光半導体装置 |
| JP2002299698A (ja) | 2001-03-30 | 2002-10-11 | Sumitomo Electric Ind Ltd | 発光装置 |
| JP4101468B2 (ja) * | 2001-04-09 | 2008-06-18 | 豊田合成株式会社 | 発光装置の製造方法 |
| JP2003152228A (ja) | 2001-11-12 | 2003-05-23 | Sumitomo Bakelite Co Ltd | Led用ケース及びled発光体 |
| KR100439402B1 (ko) | 2001-12-24 | 2004-07-09 | 삼성전기주식회사 | 발광다이오드 패키지 |
| JP2004063494A (ja) * | 2002-07-24 | 2004-02-26 | Sumitomo Electric Ind Ltd | 発光装置およびその製造方法 |
| JP2004146815A (ja) * | 2002-09-30 | 2004-05-20 | Sanyo Electric Co Ltd | 発光素子 |
| WO2004034529A1 (ja) | 2002-09-30 | 2004-04-22 | Sanyo Electric Co., Ltd. | 発光素子 |
| JP4144498B2 (ja) | 2002-10-01 | 2008-09-03 | 松下電器産業株式会社 | 線状光源装置及びその製造方法、並びに、面発光装置 |
| JP4009208B2 (ja) | 2003-01-21 | 2007-11-14 | 京セラ株式会社 | 発光装置 |
| KR20040073869A (ko) | 2003-02-15 | 2004-08-21 | 엘지전자 주식회사 | 발광 소자의 광 반사체 구조 및 그를 이용한 발광 소자패키지 |
| JP4132039B2 (ja) * | 2003-03-24 | 2008-08-13 | 京セラ株式会社 | 発光素子収納用パッケージおよび発光装置 |
| KR100550856B1 (ko) * | 2003-06-03 | 2006-02-10 | 삼성전기주식회사 | 발광 다이오드(led) 소자의 제조 방법 |
| DE102004034166B4 (de) * | 2003-07-17 | 2015-08-20 | Toyoda Gosei Co., Ltd. | Lichtemittierende Vorrichtung |
| JP2005078937A (ja) | 2003-08-29 | 2005-03-24 | Ichikoh Ind Ltd | 薄型発光装置 |
| JP3906199B2 (ja) | 2003-11-27 | 2007-04-18 | 京セラ株式会社 | 発光装置 |
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| JP2006351773A (ja) * | 2005-06-15 | 2006-12-28 | Rohm Co Ltd | 半導体発光装置 |
| JP2007027535A (ja) | 2005-07-20 | 2007-02-01 | Stanley Electric Co Ltd | 光半導体装置 |
| JP2007042681A (ja) | 2005-07-29 | 2007-02-15 | Toshiba Lighting & Technology Corp | 発光ダイオード装置 |
| CN1932603A (zh) * | 2005-09-16 | 2007-03-21 | 鸿富锦精密工业(深圳)有限公司 | 直下式背光模组 |
| JP4715422B2 (ja) | 2005-09-27 | 2011-07-06 | 日亜化学工業株式会社 | 発光装置 |
| JP5214128B2 (ja) * | 2005-11-22 | 2013-06-19 | シャープ株式会社 | 発光素子及び発光素子を備えたバックライトユニット |
| KR100635981B1 (ko) | 2006-01-27 | 2006-10-18 | 알티전자 주식회사 | 측면발광 다이오드 패키지 |
| US9178121B2 (en) * | 2006-12-15 | 2015-11-03 | Cree, Inc. | Reflective mounting substrates for light emitting diodes |
| US8217414B2 (en) * | 2006-12-28 | 2012-07-10 | Nichia Corporation | Light emitting device, package, light emitting device manufacturing method, package manufacturing method and package manufacturing die |
| KR20090124906A (ko) * | 2007-03-12 | 2009-12-03 | 니치아 카가쿠 고교 가부시키가이샤 | 고출력 발광 장치 및 그것에 이용하는 패키지 |
| KR100901618B1 (ko) * | 2007-04-19 | 2009-06-08 | 엘지이노텍 주식회사 | 발광 다이오드 패키지 및 제조방법 |
| US8030674B2 (en) * | 2008-04-28 | 2011-10-04 | Lextar Electronics Corp. | Light-emitting diode package with roughened surface portions of the lead-frame |
-
2007
- 2007-04-19 KR KR1020070038279A patent/KR100901618B1/ko not_active Expired - Fee Related
-
2008
- 2008-04-17 WO PCT/KR2008/002183 patent/WO2008130140A1/en not_active Ceased
- 2008-04-17 JP JP2010503977A patent/JP2010525569A/ja not_active Withdrawn
- 2008-04-17 US US12/530,637 patent/US7858993B2/en active Active
-
2010
- 2010-11-16 US US12/947,645 patent/US8022415B2/en not_active Expired - Fee Related
-
2011
- 2011-05-24 US US13/115,028 patent/US8101956B2/en not_active Expired - Fee Related
- 2011-12-30 US US13/341,680 patent/US8299474B2/en active Active
-
2012
- 2012-02-23 JP JP2012037166A patent/JP2012109611A/ja not_active Withdrawn
- 2012-02-23 JP JP2012000976U patent/JP3175433U/ja not_active Expired - Lifetime
- 2012-02-23 JP JP2012037167A patent/JP2012109612A/ja not_active Withdrawn
- 2012-10-28 US US13/662,508 patent/US8536586B2/en not_active Expired - Fee Related
-
2013
- 2013-03-27 JP JP2013066840A patent/JP2013128154A/ja active Pending
- 2013-08-23 US US13/975,029 patent/US8692262B2/en active Active
-
2014
- 2014-01-31 US US14/169,581 patent/US8890176B2/en active Active
- 2014-10-06 US US14/507,488 patent/US9018644B2/en active Active
- 2014-10-08 US US14/509,321 patent/US8994038B2/en active Active
-
2015
- 2015-02-16 JP JP2015027327A patent/JP2015092639A/ja active Pending
- 2015-03-04 US US14/638,398 patent/US9252347B2/en not_active Expired - Fee Related
- 2015-12-29 US US14/983,294 patent/US9559275B2/en not_active Expired - Fee Related
-
2016
- 2016-10-06 JP JP2016197934A patent/JP2017011307A/ja active Pending
- 2016-12-16 US US15/382,553 patent/US9666775B2/en not_active Expired - Fee Related
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