JPS53145476U - - Google Patents
Info
- Publication number
- JPS53145476U JPS53145476U JP1977052033U JP5203377U JPS53145476U JP S53145476 U JPS53145476 U JP S53145476U JP 1977052033 U JP1977052033 U JP 1977052033U JP 5203377 U JP5203377 U JP 5203377U JP S53145476 U JPS53145476 U JP S53145476U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977052033U JPS53145476U (enExample) | 1977-04-20 | 1977-04-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977052033U JPS53145476U (enExample) | 1977-04-20 | 1977-04-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS53145476U true JPS53145476U (enExample) | 1978-11-16 |
Family
ID=28942485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977052033U Pending JPS53145476U (enExample) | 1977-04-20 | 1977-04-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS53145476U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010525569A (ja) * | 2007-04-19 | 2010-07-22 | エルジー イノテック カンパニー リミテッド | 発光デバイスパッケージ及びこれを備えるライトユニット |
| JP2010161139A (ja) * | 2009-01-07 | 2010-07-22 | Toshiba Corp | 発光装置 |
-
1977
- 1977-04-20 JP JP1977052033U patent/JPS53145476U/ja active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8536586B2 (en) | 2007-04-19 | 2013-09-17 | Lg Innotek Co., Ltd. | Light emitting device package and light unit having the same |
| US9559275B2 (en) | 2007-04-19 | 2017-01-31 | Lg Innotek Co., Ltd. | Light emitting device package and light unit having the same |
| JP2012109612A (ja) * | 2007-04-19 | 2012-06-07 | Lg Innotek Co Ltd | 半導体ダイオードパッケージ及びその製造方法 |
| JP2012109611A (ja) * | 2007-04-19 | 2012-06-07 | Lg Innotek Co Ltd | 半導体ダイオードパッケージ及びその製造方法 |
| US8299474B2 (en) | 2007-04-19 | 2012-10-30 | Lg Innotek Co., Ltd. | Light emitting device package and light unit having the same |
| JP2013128154A (ja) * | 2007-04-19 | 2013-06-27 | Lg Innotek Co Ltd | 発光デバイスパッケージ及びこれを備えるライトユニット |
| US8890176B2 (en) | 2007-04-19 | 2014-11-18 | Lg Innotek Co., Ltd. | Light emitting device package and light unit having the same |
| JP2010525569A (ja) * | 2007-04-19 | 2010-07-22 | エルジー イノテック カンパニー リミテッド | 発光デバイスパッケージ及びこれを備えるライトユニット |
| US9666775B2 (en) | 2007-04-19 | 2017-05-30 | Lg Innotek Co., Ltd. | Light emitting device package and light unit having the same |
| US8994038B2 (en) | 2007-04-19 | 2015-03-31 | Lg Innotek Co., Ltd. | Light emitting device package and light unit having the same |
| US9018644B2 (en) | 2007-04-19 | 2015-04-28 | Lg Innotek Co., Ltd. | Light emitting device package and light unit having the same |
| US9252347B2 (en) | 2007-04-19 | 2016-02-02 | Lg Innotek Co., Ltd. | Light emitting device package and light unit having the same |
| US8692262B2 (en) | 2007-04-19 | 2014-04-08 | Lg Innotek Co., Ltd. | Light emitting device package and light unit having the same |
| JP2010161139A (ja) * | 2009-01-07 | 2010-07-22 | Toshiba Corp | 発光装置 |