JP2010525569A - 発光デバイスパッケージ及びこれを備えるライトユニット - Google Patents

発光デバイスパッケージ及びこれを備えるライトユニット Download PDF

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Publication number
JP2010525569A
JP2010525569A JP2010503977A JP2010503977A JP2010525569A JP 2010525569 A JP2010525569 A JP 2010525569A JP 2010503977 A JP2010503977 A JP 2010503977A JP 2010503977 A JP2010503977 A JP 2010503977A JP 2010525569 A JP2010525569 A JP 2010525569A
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JP
Japan
Prior art keywords
light emitting
emitting device
device package
lead frame
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2010503977A
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English (en)
Japanese (ja)
Inventor
ミン コン、ソン
ヨル キム、チョン
ソク チェ、ヒ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
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LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of JP2010525569A publication Critical patent/JP2010525569A/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/822—Materials of the light-emitting regions
    • H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/822—Materials of the light-emitting regions
    • H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
JP2010503977A 2007-04-19 2008-04-17 発光デバイスパッケージ及びこれを備えるライトユニット Withdrawn JP2010525569A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020070038279A KR100901618B1 (ko) 2007-04-19 2007-04-19 발광 다이오드 패키지 및 제조방법
PCT/KR2008/002183 WO2008130140A1 (en) 2007-04-19 2008-04-17 Light emitting device package and light unit having the same

Related Child Applications (3)

Application Number Title Priority Date Filing Date
JP2012037166A Division JP2012109611A (ja) 2007-04-19 2012-02-23 半導体ダイオードパッケージ及びその製造方法
JP2012037167A Division JP2012109612A (ja) 2007-04-19 2012-02-23 半導体ダイオードパッケージ及びその製造方法
JP2013066840A Division JP2013128154A (ja) 2007-04-19 2013-03-27 発光デバイスパッケージ及びこれを備えるライトユニット

Publications (1)

Publication Number Publication Date
JP2010525569A true JP2010525569A (ja) 2010-07-22

Family

ID=39875630

Family Applications (7)

Application Number Title Priority Date Filing Date
JP2010503977A Withdrawn JP2010525569A (ja) 2007-04-19 2008-04-17 発光デバイスパッケージ及びこれを備えるライトユニット
JP2012037166A Withdrawn JP2012109611A (ja) 2007-04-19 2012-02-23 半導体ダイオードパッケージ及びその製造方法
JP2012000976U Expired - Lifetime JP3175433U (ja) 2007-04-19 2012-02-23 半導体ダイオードパッケージ
JP2012037167A Withdrawn JP2012109612A (ja) 2007-04-19 2012-02-23 半導体ダイオードパッケージ及びその製造方法
JP2013066840A Pending JP2013128154A (ja) 2007-04-19 2013-03-27 発光デバイスパッケージ及びこれを備えるライトユニット
JP2015027327A Pending JP2015092639A (ja) 2007-04-19 2015-02-16 発光デバイスパッケージ及びこれを備えるライトユニット
JP2016197934A Pending JP2017011307A (ja) 2007-04-19 2016-10-06 発光デバイスパッケージ

Family Applications After (6)

Application Number Title Priority Date Filing Date
JP2012037166A Withdrawn JP2012109611A (ja) 2007-04-19 2012-02-23 半導体ダイオードパッケージ及びその製造方法
JP2012000976U Expired - Lifetime JP3175433U (ja) 2007-04-19 2012-02-23 半導体ダイオードパッケージ
JP2012037167A Withdrawn JP2012109612A (ja) 2007-04-19 2012-02-23 半導体ダイオードパッケージ及びその製造方法
JP2013066840A Pending JP2013128154A (ja) 2007-04-19 2013-03-27 発光デバイスパッケージ及びこれを備えるライトユニット
JP2015027327A Pending JP2015092639A (ja) 2007-04-19 2015-02-16 発光デバイスパッケージ及びこれを備えるライトユニット
JP2016197934A Pending JP2017011307A (ja) 2007-04-19 2016-10-06 発光デバイスパッケージ

Country Status (4)

Country Link
US (12) US7858993B2 (enExample)
JP (7) JP2010525569A (enExample)
KR (1) KR100901618B1 (enExample)
WO (1) WO2008130140A1 (enExample)

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JP2009176962A (ja) * 2008-01-24 2009-08-06 Toyoda Gosei Co Ltd 発光装置
JP2013055190A (ja) * 2011-09-02 2013-03-21 Nichia Chem Ind Ltd 発光装置
JP2013131639A (ja) * 2011-12-21 2013-07-04 Sumitomo Chemical Co Ltd 半導体用パッケージの製造方法、半導体用パッケージ及び半導体発光装置
WO2015115026A1 (ja) * 2014-01-30 2015-08-06 パナソニックＩｐマネジメント株式会社 半導体装置及び半導体パッケージ
JP2021034687A (ja) * 2019-08-29 2021-03-01 株式会社ジャパンディスプレイ Ｌｅｄモジュール及び表示装置、並びにｌｅｄモジュールの作製方法及び表示装置の作製方法

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US8994038B2 (en) 2015-03-31
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US8890176B2 (en) 2014-11-18
US20110133240A1 (en) 2011-06-09
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US8022415B2 (en) 2011-09-20
US20130049057A1 (en) 2013-02-28
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US9666775B2 (en) 2017-05-30
US8299474B2 (en) 2012-10-30
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US9252347B2 (en) 2016-02-02
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US8101956B2 (en) 2012-01-24
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US20130341654A1 (en) 2013-12-26
US20150021651A1 (en) 2015-01-22

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