JP3093278B2 - 向上したパッド設計による電子パッケージ - Google Patents

向上したパッド設計による電子パッケージ

Info

Publication number
JP3093278B2
JP3093278B2 JP09514072A JP51407297A JP3093278B2 JP 3093278 B2 JP3093278 B2 JP 3093278B2 JP 09514072 A JP09514072 A JP 09514072A JP 51407297 A JP51407297 A JP 51407297A JP 3093278 B2 JP3093278 B2 JP 3093278B2
Authority
JP
Japan
Prior art keywords
parts
electronic package
substrate
layer
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP09514072A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11508409A (ja
Inventor
カルベッリ、フランチェスコ
オッジョーニ、ステファノ
Original Assignee
インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン filed Critical インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン
Publication of JPH11508409A publication Critical patent/JPH11508409A/ja
Application granted granted Critical
Publication of JP3093278B2 publication Critical patent/JP3093278B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W74/117—
    • H10W70/60—
    • H10W44/601—
    • H10W70/685—
    • H10W72/07353—
    • H10W72/334—
    • H10W72/352—
    • H10W72/884—
    • H10W72/931—
    • H10W74/00—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
JP09514072A 1995-10-04 1996-10-03 向上したパッド設計による電子パッケージ Expired - Fee Related JP3093278B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IT9500161 1995-10-04
IT95/00161 1995-10-04
PCT/GB1996/002420 WO1997013275A1 (en) 1995-10-04 1996-10-03 Electronic package with enhanced pad design

Publications (2)

Publication Number Publication Date
JPH11508409A JPH11508409A (ja) 1999-07-21
JP3093278B2 true JP3093278B2 (ja) 2000-10-03

Family

ID=11332480

Family Applications (1)

Application Number Title Priority Date Filing Date
JP09514072A Expired - Fee Related JP3093278B2 (ja) 1995-10-04 1996-10-03 向上したパッド設計による電子パッケージ

Country Status (5)

Country Link
EP (1) EP0853817A1 (enExample)
JP (1) JP3093278B2 (enExample)
KR (1) KR100276858B1 (enExample)
TW (1) TW299564B (enExample)
WO (1) WO1997013275A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09175399A (ja) * 1995-12-28 1997-07-08 Motohiro Seisakusho:Kk コンテナなどの運搬車

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100469911B1 (ko) * 1997-12-31 2005-07-07 주식회사 하이닉스반도체 레저바르커패시터의배열방법
JP2004214657A (ja) 2003-01-07 2004-07-29 Internatl Business Mach Corp <Ibm> プリント回路板製造用水溶性保護ペースト
JP5954013B2 (ja) * 2012-07-18 2016-07-20 日亜化学工業株式会社 半導体素子実装部材及び半導体装置
CN120637354B (zh) * 2025-08-12 2025-12-05 长沙金维集成电路股份有限公司 芯片封装结构及方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4595945A (en) * 1983-10-21 1986-06-17 At&T Bell Laboratories Plastic package with lead frame crossunder
JPS63245952A (ja) * 1987-04-01 1988-10-13 Hitachi Ltd マルチチップモジュ−ル構造体
DE69018846T2 (de) * 1989-02-10 1995-08-24 Fujitsu Ltd Keramische Packung vom Halbleiteranordnungstyp und Verfahren zum Zusammensetzen derselben.
JPH0422162A (ja) * 1990-05-17 1992-01-27 Hitachi Ltd リードフレームおよびそれを用いた半導体集積回路装置
JPH0494565A (ja) * 1990-08-10 1992-03-26 Toshiba Corp 半導体装置
JPH04139864A (ja) * 1990-10-01 1992-05-13 Seiko Epson Corp 半導体装置
JP2501953B2 (ja) * 1991-01-18 1996-05-29 株式会社東芝 半導体装置
US5258648A (en) * 1991-06-27 1993-11-02 Motorola, Inc. Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery
US5355283A (en) * 1993-04-14 1994-10-11 Amkor Electronics, Inc. Ball grid array with via interconnection
US5474958A (en) * 1993-05-04 1995-12-12 Motorola, Inc. Method for making semiconductor device having no die supporting surface

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09175399A (ja) * 1995-12-28 1997-07-08 Motohiro Seisakusho:Kk コンテナなどの運搬車

Also Published As

Publication number Publication date
KR100276858B1 (ko) 2001-01-15
EP0853817A1 (en) 1998-07-22
KR19990064001A (ko) 1999-07-26
TW299564B (enExample) 1997-03-01
WO1997013275A1 (en) 1997-04-10
JPH11508409A (ja) 1999-07-21

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees