TW299564B - - Google Patents

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Publication number
TW299564B
TW299564B TW085105592A TW85105592A TW299564B TW 299564 B TW299564 B TW 299564B TW 085105592 A TW085105592 A TW 085105592A TW 85105592 A TW85105592 A TW 85105592A TW 299564 B TW299564 B TW 299564B
Authority
TW
Taiwan
Prior art keywords
objects
substrate
electronic package
patent application
pad
Prior art date
Application number
TW085105592A
Other languages
English (en)
Chinese (zh)
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of TW299564B publication Critical patent/TW299564B/zh

Links

Classifications

    • H10W74/117—
    • H10W70/60—
    • H10W44/601—
    • H10W70/685—
    • H10W72/07353—
    • H10W72/334—
    • H10W72/352—
    • H10W72/884—
    • H10W72/931—
    • H10W74/00—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
TW085105592A 1995-10-04 1996-05-11 TW299564B (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT9500161 1995-10-04

Publications (1)

Publication Number Publication Date
TW299564B true TW299564B (enExample) 1997-03-01

Family

ID=11332480

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085105592A TW299564B (enExample) 1995-10-04 1996-05-11

Country Status (5)

Country Link
EP (1) EP0853817A1 (enExample)
JP (1) JP3093278B2 (enExample)
KR (1) KR100276858B1 (enExample)
TW (1) TW299564B (enExample)
WO (1) WO1997013275A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09175399A (ja) * 1995-12-28 1997-07-08 Motohiro Seisakusho:Kk コンテナなどの運搬車
KR100469911B1 (ko) * 1997-12-31 2005-07-07 주식회사 하이닉스반도체 레저바르커패시터의배열방법
JP2004214657A (ja) 2003-01-07 2004-07-29 Internatl Business Mach Corp <Ibm> プリント回路板製造用水溶性保護ペースト
JP5954013B2 (ja) * 2012-07-18 2016-07-20 日亜化学工業株式会社 半導体素子実装部材及び半導体装置
CN120637354B (zh) * 2025-08-12 2025-12-05 长沙金维集成电路股份有限公司 芯片封装结构及方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4595945A (en) * 1983-10-21 1986-06-17 At&T Bell Laboratories Plastic package with lead frame crossunder
JPS63245952A (ja) * 1987-04-01 1988-10-13 Hitachi Ltd マルチチップモジュ−ル構造体
DE69018846T2 (de) * 1989-02-10 1995-08-24 Fujitsu Ltd Keramische Packung vom Halbleiteranordnungstyp und Verfahren zum Zusammensetzen derselben.
JPH0422162A (ja) * 1990-05-17 1992-01-27 Hitachi Ltd リードフレームおよびそれを用いた半導体集積回路装置
JPH0494565A (ja) * 1990-08-10 1992-03-26 Toshiba Corp 半導体装置
JPH04139864A (ja) * 1990-10-01 1992-05-13 Seiko Epson Corp 半導体装置
JP2501953B2 (ja) * 1991-01-18 1996-05-29 株式会社東芝 半導体装置
US5258648A (en) * 1991-06-27 1993-11-02 Motorola, Inc. Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery
US5355283A (en) * 1993-04-14 1994-10-11 Amkor Electronics, Inc. Ball grid array with via interconnection
US5474958A (en) * 1993-05-04 1995-12-12 Motorola, Inc. Method for making semiconductor device having no die supporting surface

Also Published As

Publication number Publication date
KR100276858B1 (ko) 2001-01-15
EP0853817A1 (en) 1998-07-22
KR19990064001A (ko) 1999-07-26
JP3093278B2 (ja) 2000-10-03
WO1997013275A1 (en) 1997-04-10
JPH11508409A (ja) 1999-07-21

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