JPS6250981B2 - - Google Patents

Info

Publication number
JPS6250981B2
JPS6250981B2 JP56011594A JP1159481A JPS6250981B2 JP S6250981 B2 JPS6250981 B2 JP S6250981B2 JP 56011594 A JP56011594 A JP 56011594A JP 1159481 A JP1159481 A JP 1159481A JP S6250981 B2 JPS6250981 B2 JP S6250981B2
Authority
JP
Japan
Prior art keywords
wiring
ceramic substrate
lsi
chip
insulator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56011594A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57126154A (en
Inventor
Akihiro Dotani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP56011594A priority Critical patent/JPS57126154A/ja
Publication of JPS57126154A publication Critical patent/JPS57126154A/ja
Publication of JPS6250981B2 publication Critical patent/JPS6250981B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/611—
    • H10W70/685—
    • H10W72/5363—
    • H10W72/884—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP56011594A 1981-01-30 1981-01-30 Lsi package Granted JPS57126154A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56011594A JPS57126154A (en) 1981-01-30 1981-01-30 Lsi package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56011594A JPS57126154A (en) 1981-01-30 1981-01-30 Lsi package

Publications (2)

Publication Number Publication Date
JPS57126154A JPS57126154A (en) 1982-08-05
JPS6250981B2 true JPS6250981B2 (enExample) 1987-10-28

Family

ID=11782228

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56011594A Granted JPS57126154A (en) 1981-01-30 1981-01-30 Lsi package

Country Status (1)

Country Link
JP (1) JPS57126154A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01125678U (enExample) * 1988-02-12 1989-08-28
JPH02133374U (enExample) * 1989-04-12 1990-11-06

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5936949A (ja) * 1982-08-25 1984-02-29 Nec Corp マルチチツプパツケ−ジ
JPS6047496A (ja) * 1983-08-26 1985-03-14 日立化成工業株式会社 セラミツク基板
JPS60154596A (ja) * 1984-01-23 1985-08-14 日本電気株式会社 多層配線基板
JPH067578B2 (ja) * 1985-01-28 1994-01-26 日本電気株式会社 セラミツク多層基板
JP3309492B2 (ja) * 1993-05-28 2002-07-29 住友電気工業株式会社 半導体装置用基板
CH690806A5 (de) * 1997-03-27 2001-01-15 Ppc Electronic Ag Mehrlagiger Leiterplattenkörper für hohe Spannungen und hohe Ströme sowie Verfahren zur Herstellung eines solchen Leiterplattenkörpers.
US9159670B2 (en) * 2013-08-29 2015-10-13 Qualcomm Incorporated Ultra fine pitch and spacing interconnects for substrate

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS548976A (en) * 1977-06-22 1979-01-23 Nec Corp Lsi package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01125678U (enExample) * 1988-02-12 1989-08-28
JPH02133374U (enExample) * 1989-04-12 1990-11-06

Also Published As

Publication number Publication date
JPS57126154A (en) 1982-08-05

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