KR100276858B1 - 향상된패드설계를갖는전자패키지 - Google Patents
향상된패드설계를갖는전자패키지 Download PDFInfo
- Publication number
- KR100276858B1 KR100276858B1 KR1019980702478A KR19980702478A KR100276858B1 KR 100276858 B1 KR100276858 B1 KR 100276858B1 KR 1019980702478 A KR1019980702478 A KR 1019980702478A KR 19980702478 A KR19980702478 A KR 19980702478A KR 100276858 B1 KR100276858 B1 KR 100276858B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- portions
- conductive pad
- electronic package
- divided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| WOPCT/IT95/00161 | 1995-10-04 | ||
| IT9500161 | 1995-10-04 | ||
| PCT/GB1996/002420 WO1997013275A1 (en) | 1995-10-04 | 1996-10-03 | Electronic package with enhanced pad design |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19990064001A KR19990064001A (ko) | 1999-07-26 |
| KR100276858B1 true KR100276858B1 (ko) | 2001-01-15 |
Family
ID=11332480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019980702478A Expired - Fee Related KR100276858B1 (ko) | 1995-10-04 | 1996-10-03 | 향상된패드설계를갖는전자패키지 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0853817A1 (enExample) |
| JP (1) | JP3093278B2 (enExample) |
| KR (1) | KR100276858B1 (enExample) |
| TW (1) | TW299564B (enExample) |
| WO (1) | WO1997013275A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09175399A (ja) * | 1995-12-28 | 1997-07-08 | Motohiro Seisakusho:Kk | コンテナなどの運搬車 |
| KR100469911B1 (ko) * | 1997-12-31 | 2005-07-07 | 주식회사 하이닉스반도체 | 레저바르커패시터의배열방법 |
| JP2004214657A (ja) | 2003-01-07 | 2004-07-29 | Internatl Business Mach Corp <Ibm> | プリント回路板製造用水溶性保護ペースト |
| JP5954013B2 (ja) | 2012-07-18 | 2016-07-20 | 日亜化学工業株式会社 | 半導体素子実装部材及び半導体装置 |
| CN120637354B (zh) * | 2025-08-12 | 2025-12-05 | 长沙金维集成电路股份有限公司 | 芯片封装结构及方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1985001835A1 (en) * | 1983-10-21 | 1985-04-25 | American Telephone & Telegraph Company | Semiconductor integrated circuit including a lead frame chip support |
| EP0623956A2 (en) * | 1993-05-04 | 1994-11-09 | Motorola, Inc. | A semiconductor device having no die supporting surface and method for making the same |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63245952A (ja) * | 1987-04-01 | 1988-10-13 | Hitachi Ltd | マルチチップモジュ−ル構造体 |
| EP0382203B1 (en) * | 1989-02-10 | 1995-04-26 | Fujitsu Limited | Ceramic package type semiconductor device and method of assembling the same |
| JPH0422162A (ja) * | 1990-05-17 | 1992-01-27 | Hitachi Ltd | リードフレームおよびそれを用いた半導体集積回路装置 |
| JPH0494565A (ja) * | 1990-08-10 | 1992-03-26 | Toshiba Corp | 半導体装置 |
| JPH04139864A (ja) * | 1990-10-01 | 1992-05-13 | Seiko Epson Corp | 半導体装置 |
| JP2501953B2 (ja) * | 1991-01-18 | 1996-05-29 | 株式会社東芝 | 半導体装置 |
| US5258648A (en) * | 1991-06-27 | 1993-11-02 | Motorola, Inc. | Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery |
| US5355283A (en) * | 1993-04-14 | 1994-10-11 | Amkor Electronics, Inc. | Ball grid array with via interconnection |
-
1996
- 1996-05-11 TW TW085105592A patent/TW299564B/zh active
- 1996-10-03 EP EP96932706A patent/EP0853817A1/en not_active Ceased
- 1996-10-03 WO PCT/GB1996/002420 patent/WO1997013275A1/en not_active Ceased
- 1996-10-03 KR KR1019980702478A patent/KR100276858B1/ko not_active Expired - Fee Related
- 1996-10-03 JP JP09514072A patent/JP3093278B2/ja not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1985001835A1 (en) * | 1983-10-21 | 1985-04-25 | American Telephone & Telegraph Company | Semiconductor integrated circuit including a lead frame chip support |
| EP0623956A2 (en) * | 1993-05-04 | 1994-11-09 | Motorola, Inc. | A semiconductor device having no die supporting surface and method for making the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW299564B (enExample) | 1997-03-01 |
| WO1997013275A1 (en) | 1997-04-10 |
| JPH11508409A (ja) | 1999-07-21 |
| KR19990064001A (ko) | 1999-07-26 |
| EP0853817A1 (en) | 1998-07-22 |
| JP3093278B2 (ja) | 2000-10-03 |
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