KR100276858B1 - 향상된패드설계를갖는전자패키지 - Google Patents

향상된패드설계를갖는전자패키지 Download PDF

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Publication number
KR100276858B1
KR100276858B1 KR1019980702478A KR19980702478A KR100276858B1 KR 100276858 B1 KR100276858 B1 KR 100276858B1 KR 1019980702478 A KR1019980702478 A KR 1019980702478A KR 19980702478 A KR19980702478 A KR 19980702478A KR 100276858 B1 KR100276858 B1 KR 100276858B1
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South Korea
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substrate
portions
conductive pad
electronic package
divided
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Korean (ko)
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KR19990064001A (ko
Inventor
프란체스코 갈벨리
스테파노 오기오니
Original Assignee
포만 제프리 엘
인터내셔널 비지네스 머신즈 코포레이션
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Publication of KR19990064001A publication Critical patent/KR19990064001A/ko
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Publication of KR100276858B1 publication Critical patent/KR100276858B1/ko
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    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
KR1019980702478A 1995-10-04 1996-10-03 향상된패드설계를갖는전자패키지 Expired - Fee Related KR100276858B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
WOPCT/IT95/00161 1995-10-04
IT9500161 1995-10-04
PCT/GB1996/002420 WO1997013275A1 (en) 1995-10-04 1996-10-03 Electronic package with enhanced pad design

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Publication Number Publication Date
KR19990064001A KR19990064001A (ko) 1999-07-26
KR100276858B1 true KR100276858B1 (ko) 2001-01-15

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KR1019980702478A Expired - Fee Related KR100276858B1 (ko) 1995-10-04 1996-10-03 향상된패드설계를갖는전자패키지

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EP (1) EP0853817A1 (enExample)
JP (1) JP3093278B2 (enExample)
KR (1) KR100276858B1 (enExample)
TW (1) TW299564B (enExample)
WO (1) WO1997013275A1 (enExample)

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JPH09175399A (ja) * 1995-12-28 1997-07-08 Motohiro Seisakusho:Kk コンテナなどの運搬車
KR100469911B1 (ko) * 1997-12-31 2005-07-07 주식회사 하이닉스반도체 레저바르커패시터의배열방법
JP2004214657A (ja) 2003-01-07 2004-07-29 Internatl Business Mach Corp <Ibm> プリント回路板製造用水溶性保護ペースト
JP5954013B2 (ja) 2012-07-18 2016-07-20 日亜化学工業株式会社 半導体素子実装部材及び半導体装置
CN120637354B (zh) * 2025-08-12 2025-12-05 长沙金维集成电路股份有限公司 芯片封装结构及方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1985001835A1 (en) * 1983-10-21 1985-04-25 American Telephone & Telegraph Company Semiconductor integrated circuit including a lead frame chip support
EP0623956A2 (en) * 1993-05-04 1994-11-09 Motorola, Inc. A semiconductor device having no die supporting surface and method for making the same

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Also Published As

Publication number Publication date
TW299564B (enExample) 1997-03-01
WO1997013275A1 (en) 1997-04-10
JPH11508409A (ja) 1999-07-21
KR19990064001A (ko) 1999-07-26
EP0853817A1 (en) 1998-07-22
JP3093278B2 (ja) 2000-10-03

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