JPH0422162A - Lead frame and semiconductor integrated circuit device using it - Google Patents

Lead frame and semiconductor integrated circuit device using it

Info

Publication number
JPH0422162A
JPH0422162A JP12791490A JP12791490A JPH0422162A JP H0422162 A JPH0422162 A JP H0422162A JP 12791490 A JP12791490 A JP 12791490A JP 12791490 A JP12791490 A JP 12791490A JP H0422162 A JPH0422162 A JP H0422162A
Authority
JP
Japan
Prior art keywords
die pad
parts
restrain
cutout
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12791490A
Other languages
English (en)
Inventor
Yasuhisa Hagiwara
Fujio Ito
Hiromichi Suzuki
Kazunari Suzuki
Original Assignee
Hitachi Ltd
Hitachi Micro Comput Eng Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Micro Comput Eng Ltd filed Critical Hitachi Ltd
Priority to JP12791490A priority Critical patent/JPH0422162A/ja
Publication of JPH0422162A publication Critical patent/JPH0422162A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP12791490A 1990-05-17 1990-05-17 Lead frame and semiconductor integrated circuit device using it Pending JPH0422162A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12791490A JPH0422162A (en) 1990-05-17 1990-05-17 Lead frame and semiconductor integrated circuit device using it

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12791490A JPH0422162A (en) 1990-05-17 1990-05-17 Lead frame and semiconductor integrated circuit device using it

Publications (1)

Publication Number Publication Date
JPH0422162A true JPH0422162A (en) 1992-01-27

Family

ID=14971767

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12791490A Pending JPH0422162A (en) 1990-05-17 1990-05-17 Lead frame and semiconductor integrated circuit device using it

Country Status (1)

Country Link
JP (1) JPH0422162A (ja)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997012387A2 (de) * 1995-09-29 1997-04-03 Siemens Aktiengesellschaft Leiterrahmen für integrierte schaltungen
US5773878A (en) * 1995-10-28 1998-06-30 Institute Of Microelectronics National University Of Singapore IC packaging lead frame for reducing chip stress and deformation
EP0853817A1 (en) * 1995-10-04 1998-07-22 International Business Machines Corporation Electronic package with enhanced pad design
US5825628A (en) * 1996-10-03 1998-10-20 International Business Machines Corporation Electronic package with enhanced pad design
US5874773A (en) * 1994-09-01 1999-02-23 Hitachi, Ltd. Lead frame having a supporting pad with a plurality of slits arranged to permit the flow of resin so as to prevent the occurrence of voids
WO2002007490A2 (de) * 2000-07-18 2002-01-24 Robert Bosch Gmbh Baugruppe mit einem strukturierten trägerelement und einem mit diesem wirkverbundenen substrat
JP2003031753A (ja) * 2001-07-19 2003-01-31 Sony Corp 半導体装置及びその製造方法
US6583501B2 (en) * 1999-02-09 2003-06-24 Institute Of Microelectronics Lead frame for an integrated circuit chip (integrated circuit peripheral support)
EP1662565A2 (en) * 2000-09-04 2006-05-31 Dainippon Printing Co., Ltd. Semiconductor package
JP2007311579A (ja) * 2006-05-19 2007-11-29 Matsushita Electric Ind Co Ltd リードフレームおよびこれを使用した半導体装置
JP2009060093A (ja) * 2007-08-06 2009-03-19 Seiko Instruments Inc 半導体装置

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5874773A (en) * 1994-09-01 1999-02-23 Hitachi, Ltd. Lead frame having a supporting pad with a plurality of slits arranged to permit the flow of resin so as to prevent the occurrence of voids
WO1997012387A3 (de) * 1995-09-29 1997-06-12 Siemens Ag Leiterrahmen für integrierte schaltungen
WO1997012387A2 (de) * 1995-09-29 1997-04-03 Siemens Aktiengesellschaft Leiterrahmen für integrierte schaltungen
DE19536525B4 (de) * 1995-09-29 2005-11-17 Infineon Technologies Ag Leiterrahmen für integrierte Schaltungen
EP0853817A1 (en) * 1995-10-04 1998-07-22 International Business Machines Corporation Electronic package with enhanced pad design
US5773878A (en) * 1995-10-28 1998-06-30 Institute Of Microelectronics National University Of Singapore IC packaging lead frame for reducing chip stress and deformation
US5825628A (en) * 1996-10-03 1998-10-20 International Business Machines Corporation Electronic package with enhanced pad design
US6583501B2 (en) * 1999-02-09 2003-06-24 Institute Of Microelectronics Lead frame for an integrated circuit chip (integrated circuit peripheral support)
WO2002007490A2 (de) * 2000-07-18 2002-01-24 Robert Bosch Gmbh Baugruppe mit einem strukturierten trägerelement und einem mit diesem wirkverbundenen substrat
WO2002007490A3 (de) * 2000-07-18 2002-06-27 Bosch Gmbh Robert Baugruppe mit einem strukturierten trägerelement und einem mit diesem wirkverbundenen substrat
EP1662565A3 (en) * 2000-09-04 2008-02-27 Dainippon Printing Co., Ltd. Semiconductor package
EP1662565A2 (en) * 2000-09-04 2006-05-31 Dainippon Printing Co., Ltd. Semiconductor package
JP2003031753A (ja) * 2001-07-19 2003-01-31 Sony Corp 半導体装置及びその製造方法
JP2007311579A (ja) * 2006-05-19 2007-11-29 Matsushita Electric Ind Co Ltd リードフレームおよびこれを使用した半導体装置
JP4738250B2 (ja) * 2006-05-19 2011-08-03 パナソニック株式会社 半導体装置
JP2009060093A (ja) * 2007-08-06 2009-03-19 Seiko Instruments Inc 半導体装置

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