JP2646994B2 - ヒートシンク付ピングリッドアレイ - Google Patents

ヒートシンク付ピングリッドアレイ

Info

Publication number
JP2646994B2
JP2646994B2 JP5352435A JP35243593A JP2646994B2 JP 2646994 B2 JP2646994 B2 JP 2646994B2 JP 5352435 A JP5352435 A JP 5352435A JP 35243593 A JP35243593 A JP 35243593A JP 2646994 B2 JP2646994 B2 JP 2646994B2
Authority
JP
Japan
Prior art keywords
lsi
sealing cap
heat sink
heat
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP5352435A
Other languages
English (en)
Japanese (ja)
Other versions
JPH07202067A (ja
Inventor
陽史 工藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP5352435A priority Critical patent/JP2646994B2/ja
Priority to EP94120819A priority patent/EP0661739A2/en
Publication of JPH07202067A publication Critical patent/JPH07202067A/ja
Application granted granted Critical
Publication of JP2646994B2 publication Critical patent/JP2646994B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W40/22—
    • H10W40/70—
    • H10W76/60—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/884—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP5352435A 1993-12-29 1993-12-29 ヒートシンク付ピングリッドアレイ Expired - Lifetime JP2646994B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP5352435A JP2646994B2 (ja) 1993-12-29 1993-12-29 ヒートシンク付ピングリッドアレイ
EP94120819A EP0661739A2 (en) 1993-12-29 1994-12-28 Pin-grid array with a cooling structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5352435A JP2646994B2 (ja) 1993-12-29 1993-12-29 ヒートシンク付ピングリッドアレイ

Publications (2)

Publication Number Publication Date
JPH07202067A JPH07202067A (ja) 1995-08-04
JP2646994B2 true JP2646994B2 (ja) 1997-08-27

Family

ID=18424062

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5352435A Expired - Lifetime JP2646994B2 (ja) 1993-12-29 1993-12-29 ヒートシンク付ピングリッドアレイ

Country Status (2)

Country Link
EP (1) EP0661739A2 (enExample)
JP (1) JP2646994B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0786806A1 (en) * 1996-01-23 1997-07-30 Montpellier Technologies High I/O density package for high power wire-bonded IC chips and method for making the same
JP2914342B2 (ja) * 1997-03-28 1999-06-28 日本電気株式会社 集積回路装置の冷却構造
US6257327B1 (en) * 1997-08-15 2001-07-10 Intel Corporation Heat sink including pedestal

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2570383B1 (fr) * 1984-09-20 1988-03-18 Nec Corp Composition stable conductrice de la chaleur et bloc de dispositif semi-conducteur dans lequel cette composition est utilisee
JPS61125053A (ja) * 1984-11-22 1986-06-12 Hitachi Ltd 半導体装置
JPH0346260A (ja) * 1989-07-14 1991-02-27 Sumitomo Bakelite Co Ltd 半導体搭載用基板の製造方法
JPH04155853A (ja) * 1990-10-19 1992-05-28 Hitachi Ltd 半導体集積回路装置
JP2765242B2 (ja) * 1991-01-28 1998-06-11 日本電気株式会社 集積回路装置

Also Published As

Publication number Publication date
JPH07202067A (ja) 1995-08-04
EP0661739A2 (en) 1995-07-05
EP0661739A3 (enExample) 1995-08-16

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Legal Events

Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 19970408