JP2553342Y2 - 発光ダイオードランプ - Google Patents
発光ダイオードランプInfo
- Publication number
- JP2553342Y2 JP2553342Y2 JP1989142390U JP14239089U JP2553342Y2 JP 2553342 Y2 JP2553342 Y2 JP 2553342Y2 JP 1989142390 U JP1989142390 U JP 1989142390U JP 14239089 U JP14239089 U JP 14239089U JP 2553342 Y2 JP2553342 Y2 JP 2553342Y2
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- lead frame
- light
- mold resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989142390U JP2553342Y2 (ja) | 1989-12-08 | 1989-12-08 | 発光ダイオードランプ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989142390U JP2553342Y2 (ja) | 1989-12-08 | 1989-12-08 | 発光ダイオードランプ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0381652U JPH0381652U (hr) | 1991-08-21 |
JP2553342Y2 true JP2553342Y2 (ja) | 1997-11-05 |
Family
ID=31689220
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989142390U Expired - Lifetime JP2553342Y2 (ja) | 1989-12-08 | 1989-12-08 | 発光ダイオードランプ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2553342Y2 (hr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3614776B2 (ja) * | 2000-12-19 | 2005-01-26 | シャープ株式会社 | チップ部品型ledとその製造方法 |
JP3724498B2 (ja) * | 2004-09-27 | 2005-12-07 | 日亜化学工業株式会社 | 発光ダイオード |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5855652Y2 (ja) * | 1977-03-14 | 1983-12-20 | 株式会社東芝 | 光半導体装置 |
JPS53151376U (hr) * | 1977-05-04 | 1978-11-29 | ||
JPS59767Y2 (ja) * | 1978-04-27 | 1984-01-10 | サンケン電気株式会社 | 発光素子のリ−ドフレ−ム |
JPS61156779A (ja) * | 1984-12-28 | 1986-07-16 | Toshiba Corp | 発光表示装置用電極部材の製造方法 |
-
1989
- 1989-12-08 JP JP1989142390U patent/JP2553342Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0381652U (hr) | 1991-08-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2005512331A (ja) | オプトエレクトロニクスデバイス | |
US5226723A (en) | Light emitting diode display | |
JP2003017751A (ja) | 発光ダイオード | |
JPS61147585A (ja) | 発光ダイオ−ド | |
JP2553342Y2 (ja) | 発光ダイオードランプ | |
JP2606025Y2 (ja) | 発光ダイオード素子 | |
JPH0432775Y2 (hr) | ||
JPH0334924Y2 (hr) | ||
JPS59151478A (ja) | 面発光装置の製造方法 | |
JPH0736459U (ja) | 発光ダイオード | |
JPH0726853Y2 (ja) | Led表示装置 | |
US6494597B1 (en) | Bowl on lead frame in light emitting diode | |
JPH06216411A (ja) | Ledランプ | |
JP2003249693A (ja) | Ledランプ | |
JPS61198692A (ja) | 発光ダイオ−ド | |
JPH0639467Y2 (ja) | Led表示素子 | |
JP2001284656A (ja) | Ledランプ | |
JPH01266771A (ja) | 発光ダイオードランプ | |
JPS603794B2 (ja) | 発光表示装置 | |
JP2579289Y2 (ja) | 発光体 | |
JP2510317Y2 (ja) | Led車両用灯具のレンズ | |
JPS6236312Y2 (hr) | ||
JP2544236Y2 (ja) | 発光ダイオードランプ | |
JPS6023991Y2 (ja) | 光半導体表示装置 | |
JPS61110475A (ja) | 発光ダイオ−ドランプ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |