JPH0381652U - - Google Patents
Info
- Publication number
- JPH0381652U JPH0381652U JP1989142390U JP14239089U JPH0381652U JP H0381652 U JPH0381652 U JP H0381652U JP 1989142390 U JP1989142390 U JP 1989142390U JP 14239089 U JP14239089 U JP 14239089U JP H0381652 U JPH0381652 U JP H0381652U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- diode chip
- lead frame
- reflector plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989142390U JP2553342Y2 (ja) | 1989-12-08 | 1989-12-08 | 発光ダイオードランプ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989142390U JP2553342Y2 (ja) | 1989-12-08 | 1989-12-08 | 発光ダイオードランプ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0381652U true JPH0381652U (hr) | 1991-08-21 |
JP2553342Y2 JP2553342Y2 (ja) | 1997-11-05 |
Family
ID=31689220
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989142390U Expired - Lifetime JP2553342Y2 (ja) | 1989-12-08 | 1989-12-08 | 発光ダイオードランプ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2553342Y2 (hr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002185046A (ja) * | 2000-12-19 | 2002-06-28 | Sharp Corp | チップ部品型ledとその製造方法 |
JP2004363635A (ja) * | 2004-09-27 | 2004-12-24 | Nichia Chem Ind Ltd | 発光ダイオード |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53124654U (hr) * | 1977-03-14 | 1978-10-04 | ||
JPS53151376U (hr) * | 1977-05-04 | 1978-11-29 | ||
JPS54159977U (hr) * | 1978-04-27 | 1979-11-08 | ||
JPS61156779A (ja) * | 1984-12-28 | 1986-07-16 | Toshiba Corp | 発光表示装置用電極部材の製造方法 |
-
1989
- 1989-12-08 JP JP1989142390U patent/JP2553342Y2/ja not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53124654U (hr) * | 1977-03-14 | 1978-10-04 | ||
JPS53151376U (hr) * | 1977-05-04 | 1978-11-29 | ||
JPS54159977U (hr) * | 1978-04-27 | 1979-11-08 | ||
JPS61156779A (ja) * | 1984-12-28 | 1986-07-16 | Toshiba Corp | 発光表示装置用電極部材の製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002185046A (ja) * | 2000-12-19 | 2002-06-28 | Sharp Corp | チップ部品型ledとその製造方法 |
JP2004363635A (ja) * | 2004-09-27 | 2004-12-24 | Nichia Chem Ind Ltd | 発光ダイオード |
Also Published As
Publication number | Publication date |
---|---|
JP2553342Y2 (ja) | 1997-11-05 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |