JP2544701B2 - プレ―ト形ヒ―トパイプ - Google Patents

プレ―ト形ヒ―トパイプ

Info

Publication number
JP2544701B2
JP2544701B2 JP5241918A JP24191893A JP2544701B2 JP 2544701 B2 JP2544701 B2 JP 2544701B2 JP 5241918 A JP5241918 A JP 5241918A JP 24191893 A JP24191893 A JP 24191893A JP 2544701 B2 JP2544701 B2 JP 2544701B2
Authority
JP
Japan
Prior art keywords
heat pipe
plate
meandering
thin
tunnel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP5241918A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0763487A (ja
Inventor
久輝 赤地
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AKUTORONIKUSU KK
Original Assignee
AKUTORONIKUSU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AKUTORONIKUSU KK filed Critical AKUTORONIKUSU KK
Priority to JP5241918A priority Critical patent/JP2544701B2/ja
Priority to GB9406246A priority patent/GB2281388B/en
Priority to DE4419564A priority patent/DE4419564B4/de
Priority to US08/352,217 priority patent/US5697428A/en
Publication of JPH0763487A publication Critical patent/JPH0763487A/ja
Application granted granted Critical
Publication of JP2544701B2 publication Critical patent/JP2544701B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rigid Pipes And Flexible Pipes (AREA)
JP5241918A 1993-08-24 1993-08-24 プレ―ト形ヒ―トパイプ Expired - Lifetime JP2544701B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP5241918A JP2544701B2 (ja) 1993-08-24 1993-08-24 プレ―ト形ヒ―トパイプ
GB9406246A GB2281388B (en) 1993-08-24 1994-03-29 Heat transfer device with serpentine heat pipes
DE4419564A DE4419564B4 (de) 1993-08-24 1994-06-03 Plattenwärmerohr
US08/352,217 US5697428A (en) 1993-08-24 1994-12-02 Tunnel-plate type heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5241918A JP2544701B2 (ja) 1993-08-24 1993-08-24 プレ―ト形ヒ―トパイプ

Publications (2)

Publication Number Publication Date
JPH0763487A JPH0763487A (ja) 1995-03-10
JP2544701B2 true JP2544701B2 (ja) 1996-10-16

Family

ID=17081495

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5241918A Expired - Lifetime JP2544701B2 (ja) 1993-08-24 1993-08-24 プレ―ト形ヒ―トパイプ

Country Status (3)

Country Link
JP (1) JP2544701B2 (de)
DE (1) DE4419564B4 (de)
GB (1) GB2281388B (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002014772A1 (fr) * 2000-08-14 2002-02-21 Ts Heatronics, Co., Ltd. Plaque metallique a conductibilite thermique elevee, plaque d'acier inoxydable a conductibilite thermique elevee, miroir de desembuage, appareils medicaux et sanitaires et appareil de cuisson
JP2011089660A (ja) * 2009-10-20 2011-05-06 Chubu Electric Power Co Inc 自励振動式ヒートパイプが組み込まれた超電導マグネット

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0914875A (ja) * 1995-06-29 1997-01-17 Akutoronikusu Kk 多孔扁平金属管ヒートパイプ式熱交換器
JP3932518B2 (ja) * 1995-08-09 2007-06-20 アクトロニクス株式会社 細径トンネルプレートヒートパイプの製造方法
JP3713633B2 (ja) * 1995-08-25 2005-11-09 アクトロニクス株式会社 クローズド温度制御システム
JPH0972680A (ja) * 1995-09-05 1997-03-18 Akutoronikusu Kk 多孔扁平管の構造とその製造方法
JP3694351B2 (ja) * 1995-10-25 2005-09-14 昭和電工株式会社 放熱器及びその製造方法
JPH09138083A (ja) * 1995-11-14 1997-05-27 Furukawa Electric Co Ltd:The 熱導波路型ヒートプレート
JP3959428B2 (ja) * 1996-05-09 2007-08-15 アクトロニクス株式会社 ステレオ型ヒートパイプ放熱器
DE19628545A1 (de) * 1996-07-16 1998-01-22 Abb Patent Gmbh Hochleistungs-Kühler für ein luftgekühltes Stromrichtergerät
JPH10185465A (ja) * 1996-12-24 1998-07-14 Showa Alum Corp プレート型ヒートパイプ
WO1998057111A1 (en) * 1997-06-10 1998-12-17 Komatsu, Ltd. Temperature control device comprising heat pipe
JPH10339591A (ja) * 1997-06-10 1998-12-22 Komatsu Ltd ヒートパイプを利用した温度制御装置
JPH11183068A (ja) * 1997-12-18 1999-07-06 Fujikura Ltd 平板状ヒートパイプ
JP2000253538A (ja) * 1999-03-04 2000-09-14 Furukawa Electric Co Ltd:The 電気接続箱
JP4223628B2 (ja) 1999-05-20 2009-02-12 ティーエス ヒートロニクス 株式会社 電子機器冷却装置
JP4584413B2 (ja) * 2000-05-31 2010-11-24 ティーエス ヒートロニクス 株式会社 プレート型ヒートパイプ及びその製造方法
JP4514910B2 (ja) * 2000-07-13 2010-07-28 ナブテスコ株式会社 中空状ヒートパイプ
JP4769386B2 (ja) * 2000-08-09 2011-09-07 ティーエス ヒートロニクス 株式会社 熱拡散板
JP2002168578A (ja) * 2000-11-30 2002-06-14 Ntt Advanced Technology Corp ヒートパイプの製造方法
JP2001280868A (ja) * 2001-02-09 2001-10-10 Actronics Co Ltd 多孔扁平金属管ヒートパイプ
JP3896840B2 (ja) 2001-12-13 2007-03-22 ソニー株式会社 冷却装置、電子機器装置及び冷却装置の製造方法
US20040035555A1 (en) 2002-08-07 2004-02-26 Kenichi Nara Counter-stream-mode oscillating-flow heat transport apparatus
JP2005282951A (ja) * 2004-03-30 2005-10-13 Institute Of Tsukuba Liaison Co Ltd 一体型積層構造熱交換器
JP2005337691A (ja) * 2004-05-27 2005-12-08 Ts Heatronics Co Ltd 細孔トンネル型ヒートパイプ
DE102005062590A1 (de) * 2005-12-27 2007-06-28 Robert Bosch Gmbh Schaltungsanordnung mit einer Wärmetransfereinrichtung
DE102007017623B4 (de) * 2007-04-12 2009-05-14 Rittal Gmbh & Co. Kg Montageplatte für elektrische oder elektronische Bauteile
DE102007053090B4 (de) * 2007-11-07 2011-12-15 Rohde & Schwarz Gmbh & Co. Kg Kühlkörper und Kühlanordnung für elektrische Komponenten und Verfahren zur Herstellung eines Kühlkörpers und einer Kühlanordnung für elektrische Komponenten
DE102008052145B4 (de) * 2008-10-20 2011-01-20 Sew-Eurodrive Gmbh & Co. Kg Anordnung zum Temperieren einer elektrischen Komponente und Elektrogerät damit
JP4775428B2 (ja) * 2008-11-20 2011-09-21 日本軽金属株式会社 ヒートプレートの製造方法
JP4775431B2 (ja) * 2008-12-09 2011-09-21 日本軽金属株式会社 ヒートプレートの製造方法
DE102009051864B4 (de) * 2009-11-04 2023-07-13 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Kühlvorrichtung für eine elektrische Einrichtung
DE102013109962A1 (de) 2013-09-11 2015-04-09 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Sicherheitsvorrichtung für ein Fahrzeug, insbesondere für ein Kraftfahrzeug
JP2018009717A (ja) * 2016-07-12 2018-01-18 株式会社フジクラ 振動型ヒートパイプ
JP6396533B1 (ja) * 2017-04-26 2018-09-26 レノボ・シンガポール・プライベート・リミテッド プレート型熱輸送装置、電子機器及びプレート型熱輸送装置の製造方法
JP7015197B2 (ja) * 2018-03-26 2022-02-02 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
JP2020020566A (ja) * 2018-07-23 2020-02-06 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
US11570411B2 (en) * 2019-01-10 2023-01-31 Hisense Laser Display Co., Ltd. Laser light source and laser projection device
US11592145B2 (en) 2019-01-10 2023-02-28 Hisense Laser Display Co., Ltd. Laser light source and laser projection device
TWI738179B (zh) * 2019-01-18 2021-09-01 李克勤 薄形散熱裝置及其製造方法
US11137214B2 (en) * 2019-03-26 2021-10-05 Raytheon Company Oscillating heat pipe using ultrasonic additive manufacturing
JP7450125B2 (ja) * 2022-03-29 2024-03-14 古河電気工業株式会社 ヒートシンク

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT321518B (de) * 1971-09-17 1975-04-10 Beteiligungs A G Fuer Haustech Vorrichtung zur Beheizung oder Kühlung von Räumen unter Ausnutzung solarer Strahlung
DE3329325A1 (de) * 1982-09-03 1984-03-08 Peter 2563 Ipsach Herren Kuehlkoerper zur fluessigkeitskuehlung wenigstens eines elektrischen leistungselementes
DE3402003A1 (de) * 1984-01-21 1985-07-25 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul
JPH063354B2 (ja) * 1987-06-23 1994-01-12 アクトロニクス株式会社 ル−プ型細管ヒ−トパイプ
JPH02103957A (ja) * 1988-10-13 1990-04-17 Furukawa Electric Co Ltd:The ヒートパイプ式冷却装置
JP2741255B2 (ja) * 1989-08-18 1998-04-15 株式会社日立製作所 沸騰冷却用伝熱体
US5179500A (en) * 1990-02-27 1993-01-12 Grumman Aerospace Corporation Vapor chamber cooled electronic circuit card
US5219020A (en) * 1990-11-22 1993-06-15 Actronics Kabushiki Kaisha Structure of micro-heat pipe

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002014772A1 (fr) * 2000-08-14 2002-02-21 Ts Heatronics, Co., Ltd. Plaque metallique a conductibilite thermique elevee, plaque d'acier inoxydable a conductibilite thermique elevee, miroir de desembuage, appareils medicaux et sanitaires et appareil de cuisson
JP2011089660A (ja) * 2009-10-20 2011-05-06 Chubu Electric Power Co Inc 自励振動式ヒートパイプが組み込まれた超電導マグネット

Also Published As

Publication number Publication date
DE4419564B4 (de) 2006-12-07
JPH0763487A (ja) 1995-03-10
GB2281388B (en) 1997-05-14
GB2281388A8 (en) 1996-10-28
GB2281388A (en) 1995-03-01
GB9406246D0 (en) 1994-05-18
DE4419564A1 (de) 1995-03-02

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