GB2281388B - Heat transfer device with serpentine heat pipes - Google Patents

Heat transfer device with serpentine heat pipes

Info

Publication number
GB2281388B
GB2281388B GB9406246A GB9406246A GB2281388B GB 2281388 B GB2281388 B GB 2281388B GB 9406246 A GB9406246 A GB 9406246A GB 9406246 A GB9406246 A GB 9406246A GB 2281388 B GB2281388 B GB 2281388B
Authority
GB
United Kingdom
Prior art keywords
transfer device
serpentine
heat
heat transfer
pipes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9406246A
Other versions
GB2281388A (en
GB2281388A8 (en
GB9406246D0 (en
Inventor
Hisateru Akachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Actronics KK
Original Assignee
Actronics KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Actronics KK filed Critical Actronics KK
Publication of GB9406246D0 publication Critical patent/GB9406246D0/en
Publication of GB2281388A publication Critical patent/GB2281388A/en
Publication of GB2281388A8 publication Critical patent/GB2281388A8/en
Application granted granted Critical
Publication of GB2281388B publication Critical patent/GB2281388B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rigid Pipes And Flexible Pipes (AREA)
GB9406246A 1993-08-24 1994-03-29 Heat transfer device with serpentine heat pipes Expired - Fee Related GB2281388B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5241918A JP2544701B2 (en) 1993-08-24 1993-08-24 Plate type heat pipe

Publications (4)

Publication Number Publication Date
GB9406246D0 GB9406246D0 (en) 1994-05-18
GB2281388A GB2281388A (en) 1995-03-01
GB2281388A8 GB2281388A8 (en) 1996-10-28
GB2281388B true GB2281388B (en) 1997-05-14

Family

ID=17081495

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9406246A Expired - Fee Related GB2281388B (en) 1993-08-24 1994-03-29 Heat transfer device with serpentine heat pipes

Country Status (3)

Country Link
JP (1) JP2544701B2 (en)
DE (1) DE4419564B4 (en)
GB (1) GB2281388B (en)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
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JPH0914875A (en) * 1995-06-29 1997-01-17 Akutoronikusu Kk Porous flat metal tube heat pipe type heat exchanger
JP3932518B2 (en) * 1995-08-09 2007-06-20 アクトロニクス株式会社 Manufacturing method of small diameter tunnel plate heat pipe
JP3713633B2 (en) * 1995-08-25 2005-11-09 アクトロニクス株式会社 Closed temperature control system
JPH0972680A (en) * 1995-09-05 1997-03-18 Akutoronikusu Kk Structure of porous flat tube and manufacture thereof
JP3694351B2 (en) * 1995-10-25 2005-09-14 昭和電工株式会社 Radiator and manufacturing method thereof
JPH09138083A (en) * 1995-11-14 1997-05-27 Furukawa Electric Co Ltd:The Heat guide type heat plate
JP3959428B2 (en) * 1996-05-09 2007-08-15 アクトロニクス株式会社 Stereo heat pipe radiator
DE19628545A1 (en) * 1996-07-16 1998-01-22 Abb Patent Gmbh Intensive cooling device for air-cooled current regulator
JPH10185465A (en) * 1996-12-24 1998-07-14 Showa Alum Corp Plate type heat pipe
WO1998057111A1 (en) * 1997-06-10 1998-12-17 Komatsu, Ltd. Temperature control device comprising heat pipe
JPH10339591A (en) * 1997-06-10 1998-12-22 Komatsu Ltd Temperature controller utilizing heat pipe
JPH11183068A (en) * 1997-12-18 1999-07-06 Fujikura Ltd Plate-shaped heat pipe
JP2000253538A (en) * 1999-03-04 2000-09-14 Furukawa Electric Co Ltd:The Electric junction box
JP4223628B2 (en) 1999-05-20 2009-02-12 ティーエス ヒートロニクス 株式会社 Electronic equipment cooling device
JP4584413B2 (en) * 2000-05-31 2010-11-24 ティーエス ヒートロニクス 株式会社 Plate type heat pipe and manufacturing method thereof
JP4514910B2 (en) * 2000-07-13 2010-07-28 ナブテスコ株式会社 Hollow heat pipe
JP4769386B2 (en) * 2000-08-09 2011-09-07 ティーエス ヒートロニクス 株式会社 Heat diffusion plate
WO2002014772A1 (en) * 2000-08-14 2002-02-21 Ts Heatronics, Co., Ltd. High thermal conductive metal plate, high thermal conductive stainless steel plate, defogging mirror, medical and sanitary apparatuses, and cooking appliance
JP2002168578A (en) * 2000-11-30 2002-06-14 Ntt Advanced Technology Corp Method for manufacturing heat pipe
JP2001280868A (en) * 2001-02-09 2001-10-10 Actronics Co Ltd Perforated flat metal heat pipe
JP3896840B2 (en) 2001-12-13 2007-03-22 ソニー株式会社 COOLING DEVICE, ELECTRONIC DEVICE DEVICE, AND COOLING DEVICE MANUFACTURING METHOD
FR2843450B1 (en) 2002-08-07 2006-05-12 Denso Corp OSCILLATING FLOW HEAT TRANSPORT DEVICE IN COUNTER-CURRENT MODE
JP2005282951A (en) * 2004-03-30 2005-10-13 Institute Of Tsukuba Liaison Co Ltd Heat exchanger having integrated laminate structure
JP2005337691A (en) * 2004-05-27 2005-12-08 Ts Heatronics Co Ltd Fine pore tunnel type heat pipe
DE102005062590A1 (en) * 2005-12-27 2007-06-28 Robert Bosch Gmbh Circuit arrangement e.g. control device circuit arrangement, for motor vehicle, has heat pipes for heat transfer taking place within arrangement and thermally connected with heat transport channel for heat treatment of electronic component
DE102007017623B4 (en) * 2007-04-12 2009-05-14 Rittal Gmbh & Co. Kg Mounting plate for electrical or electronic components
DE102007053090B4 (en) * 2007-11-07 2011-12-15 Rohde & Schwarz Gmbh & Co. Kg Heat sink and cooling arrangement for electrical components and method for producing a heat sink and a cooling arrangement for electrical components
DE102008052145B4 (en) * 2008-10-20 2011-01-20 Sew-Eurodrive Gmbh & Co. Kg Arrangement for tempering an electrical component and electrical appliance with it
JP4775428B2 (en) * 2008-11-20 2011-09-21 日本軽金属株式会社 Manufacturing method of heat plate
JP4775431B2 (en) * 2008-12-09 2011-09-21 日本軽金属株式会社 Manufacturing method of heat plate
JP5424107B2 (en) * 2009-10-20 2014-02-26 中部電力株式会社 Superconducting magnet with self-excited vibration heat pipe
DE102009051864B4 (en) * 2009-11-04 2023-07-13 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Cooling device for electrical equipment
DE102013109962A1 (en) 2013-09-11 2015-04-09 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Safety device for a vehicle, in particular for a motor vehicle
JP2018009717A (en) * 2016-07-12 2018-01-18 株式会社フジクラ Oscillation type heat pipe
JP6396533B1 (en) * 2017-04-26 2018-09-26 レノボ・シンガポール・プライベート・リミテッド Plate-type heat transport device, electronic apparatus, and plate-type heat transport device manufacturing method
JP7015197B2 (en) * 2018-03-26 2022-02-02 新光電気工業株式会社 Loop type heat pipe and its manufacturing method
JP2020020566A (en) * 2018-07-23 2020-02-06 新光電気工業株式会社 Loop type heat pipe and method of manufacturing the same
US11570411B2 (en) * 2019-01-10 2023-01-31 Hisense Laser Display Co., Ltd. Laser light source and laser projection device
US11592145B2 (en) 2019-01-10 2023-02-28 Hisense Laser Display Co., Ltd. Laser light source and laser projection device
TWI738179B (en) 2019-01-18 2021-09-01 李克勤 Thin heat dissipation device and manufacturing method thereof
US11137214B2 (en) * 2019-03-26 2021-10-05 Raytheon Company Oscillating heat pipe using ultrasonic additive manufacturing
JP7450125B2 (en) * 2022-03-29 2024-03-14 古河電気工業株式会社 heat sink

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1388937A (en) * 1971-09-17 1975-03-26 Beteiligungs Ag Haustechnik Structure with high-heat surface
GB2226125A (en) * 1987-06-23 1990-06-20 Actronics Kk Loop-type heat pipes
GB2250087A (en) * 1990-11-22 1992-05-27 Actronics Kk Heat pipe

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3329325A1 (en) * 1982-09-03 1984-03-08 Peter 2563 Ipsach Herren Heat sink for liquid cooling of at least one electrical power element
DE3402003A1 (en) * 1984-01-21 1985-07-25 Brown, Boveri & Cie Ag, 6800 Mannheim PERFORMANCE SEMICONDUCTOR MODULE
JPH02103957A (en) * 1988-10-13 1990-04-17 Furukawa Electric Co Ltd:The Heat pipe type cooling apparatus
JP2741255B2 (en) * 1989-08-18 1998-04-15 株式会社日立製作所 Heat transfer material for boiling cooling
US5179500A (en) * 1990-02-27 1993-01-12 Grumman Aerospace Corporation Vapor chamber cooled electronic circuit card

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1388937A (en) * 1971-09-17 1975-03-26 Beteiligungs Ag Haustechnik Structure with high-heat surface
GB2226125A (en) * 1987-06-23 1990-06-20 Actronics Kk Loop-type heat pipes
GB2250087A (en) * 1990-11-22 1992-05-27 Actronics Kk Heat pipe

Also Published As

Publication number Publication date
JPH0763487A (en) 1995-03-10
GB2281388A (en) 1995-03-01
GB2281388A8 (en) 1996-10-28
GB9406246D0 (en) 1994-05-18
DE4419564A1 (en) 1995-03-02
DE4419564B4 (en) 2006-12-07
JP2544701B2 (en) 1996-10-16

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)

Free format text: REGISTERED BETWEEN 20110331 AND 20110406

PCNP Patent ceased through non-payment of renewal fee

Effective date: 20120329