WO1998057111A1

WO1998057111A1 - Temperature control device comprising heat pipe

Info

Publication number: WO1998057111A1
Application number: PCT/JP1998/002423
Authority: WO
Inventors: Kanichi Kadotani
Original assignee: Komatsu, Ltd.
Priority date: 1997-06-10
Filing date: 1998-06-02
Publication date: 1998-12-17

Abstract

A temperature control device capable of heating or cooling flat plates, such as semiconductor wafers, highly uniformly and efficiently. A circular flow passage (81) is linked to the lower surface (2A) of a circular plate-shaped heat pipe (2), on whose upper surface is mounted a semiconductor wafer (1). The lower surface (2A) of the plate-shaped heat pipe (2) constitutes the top plate of the cicular flow passage (81), and all over it are installed a large number of upright pin-shaped fins (95). A plurality of fluid inlets (87) are arranged around the periphery of the circular flow passage (81), at whose central part is one fluid oulet (93). A heating fluid and a cooling fluid are selectively supplied into the ciruclar flow passage (81) through the fluid inlets (87). Within the ciruclar flow passage (81), the fluid flowing in contact with the fins (95) and the plate-shaped heat pipe (2) effectively exchange heat with the fins (95). The flow of the fluid is turbulent due to the fins (95), thereby enhancing the efficiency of heatexchange, reducing the temperature unevenness, and increasing the uniformity of heat distribution.

Description

Description Leg device using heat pipes Technical field

TECHNICAL FIELD The present invention relates to a ^^ l willow device for harboring a flat book such as a semiconductor wafer or a flat surface such as a wall using a heat pipe. Technology background

As a prior art, there is a substrate cooling apparatus disclosed in Japanese Patent Application Laid-Open No. Hei 7-222636. This device is for cooling semiconductor ware, glass substrates, magneto-optical disk substrates and the like to a predetermined temperature. The apparatus includes a substrate mounting plate on which a processing substrate is mounted, and a bent cooling pipe arranged in contact with a lower surface of the substrate mounting plate. In the substrate mounting plate, a number of independent heat pipes penetrating the plate up and down are laid all over the plate. When a hot processing substrate is placed on the substrate mounting plate, the heat of the processing substrate is transmitted to the lower surface of the substrate mounting plate by a number of heat pipes in the substrate mounting plate and absorbed by the cooling pipe. The higher the temperature of the processing substrate, the more the working fluid in the heat pipe that hits the position evaporates and takes latent heat, so that the entire processing substrate is cooled to a uniform temperature. As another prior art, there is a C support device disclosed in Japanese Patent Application Laid-Open No. Hei 5-2-1308. In this apparatus, a heat pipe, a Peltier element, and a cooling block are sequentially stacked on the back surface of a flat suction block for sucking a wafer. The action of the heat pipe, which has a very high thermal conductivity, allows the heat to diffuse quickly to the surface of the heat pipe, allowing efficient cooling.

All of the above prior arts take advantage of the extremely high thermal conductivity of heat pipes, It is intended to cool a substrate such as a semiconductor wafer to a uniform temperature. By the way, generally, the uniformity of temperature (hereinafter, referred to as uniform temperature) required for heating and cooling the substrate is extremely high. For example, in the case of a semiconductor wafer, if the temperature of the entire wafer is not made uniform within a temperature range of ± 0.1 degrees Celsius or less from the target temperature, the reliability as a product is lost. However, it is difficult to achieve the above-mentioned high thermal uniformity simply by utilizing the high thermal conductivity of the heat pipe as in the prior art.

It is also desired that both heating and cooling of the substrate can be performed efficiently and at high speed. However, the above prior art is aimed at cooling, and it is difficult to perform both heating and cooling efficiently.

Therefore, an object of the present invention is to provide a temperature control device using a heat pipe that can achieve high heat uniformity.

Another object of the present invention is to provide a temperature control device using a heat pipe capable of performing heating and cooling at high speed. Disclosure of the invention

A temperature control device according to a first aspect of the present invention includes a plate-shaped heat pipe having a front surface and a back surface, and a heat control device that is disposed away from the back surface of the heat pipe and injects a heat medium to the back surface of the heat pipe. And at least one type of non-contact type heat source device.

The non-contact type heat source device includes, for example, a fluid ejection mechanism for ejecting a cooling or heating fluid (for example, a liquid, a gas, or a mixture of a liquid and a gas) to the back of a heat pipe, and a heating electromagnetic wave. A lamp that irradiates (for example, infrared light) to the back of the heat pipe. (In this specification and the claims, the term "heat medium" is used in a broad sense including the above-mentioned cooling or heating fluid and heating electromagnetic waves.)

According to the temperature control device of the present invention, the plate-type heat pipe has higher uniformity. In both cases, the non-contact type heat source device can uniformly heat or cool the back surface of the heat pipe, so that both advantages are exhibited and an excellent soaking effect can be exhibited.

In the present invention, one of the cooling and the heating may be a non-contact type heat source device and the other may be a contact type heat source device (for example, a heating wire or a cooling pipe joined to the back of a heat pipe), Both cooling and heating can be a non-contact heat source device. In the latter case, the heat source for cooling and the heat source for heating, both of which are non-contact types, can be provided without interfering with each other, which is coupled with the high heat transfer speed of the plate-type heat pipe. Thus, both cooling and heating can be performed at high speed.

In order to enhance the soaking effect, the plate-type heat pipe has a large number of pipes filled with a working fluid, and the large number of pipes communicate with each other to form a pipe network. It is desirable that they are arranged at a substantially uniform density over almost the entire surface of the substrate. In that case, it is also preferable that each of the multiple pipes is a regular polygon or a circle. It is also preferred that the mesh of the pipe network is arranged at a substantially uniform density over substantially the entire area of the pipe network.

In order to increase the heat exchange rate between the heat medium and the plate-type heat pipe to increase the heating and cooling rates, it is desirable that the back surface of the plate-type heat pipe has moderate irregularities. When heating and cooling a flat object such as a semiconductor wafer, it is desirable that the front surface of the plate heat pipe on which the object is placed is flat.

According to another aspect of the present invention, there is provided a temperature control device in which a turbulent flow of a thermal fluid is applied to a back surface or a side surface of a plate-shaped heat pipe. Due to the turbulence effect, heat exchange between the heat fluid and the plate-type heat pipe is efficiently performed, and high-speed heating or cooling can be performed. In addition, compared with the case of using a laminar flow, the use of turbulent flow reduces the temperature unevenness and achieves higher uniformity. From the viewpoint of heat uniformity, it is desirable to apply the turbulent flow of the thermal fluid over almost the entire back or side surface of the plate-type heat pipe. One method for directing the turbulent flow of a thermal fluid onto a plate-type heat pipe is to inject a thermal fluid (or a mixture of thermal fluid and gas) from a fluid ejection mechanism such as a nozzle into the plate-type heat pipe. It is.

Another method is to form a flow path for flowing the thermal fluid on the back or side of the plate-type heat pipe, and to make the thermal fluid flow as a turbulent flow in this flow path. As a method of forming a turbulent flow in a flow path, there is a method of bending the flow path in a meandering or spiral shape, but another effective method is to use a large number of heat exchange fins (for example, pins) in the flow path. Type or needle type). Many fins disturb the flow of the fluid to form turbulence and efficiently exchange heat with the fluid. In order to enhance the heat exchange efficiency, it is desirable that the back or side surface of the plate-shaped heat pipe constitutes a part of the wall of the flow channel, and heat exchange fins are joined thereto. Furthermore, if the fin arrangement and shape are selected appropriately, the non-uniformity of heat exchange efficiency due to the temperature distribution and flow velocity distribution of the thermal fluid in the flow path will be compensated, and the possibility of achieving even higher uniformity Can also be expected. In a preferred embodiment, the flow path has a circular shape that spreads so as to cover almost the entire back surface of the plate-shaped heat pipe, and a thermal fluid inlet is provided at a peripheral portion of the circular flow path. (Or outlet), and has a discharge (or inlet) for hot fluid at the center of the flow path. The hot fluid, ie, the heating fluid or the cooling fluid, flows in the circular flow path from the periphery to the center (and in the opposite direction). Such a flow of the fluid is one of the suitable flow methods for making the inside of the wide flow channel have a uniform temperature, but the other flow method, for example, having a large number of inlets in a wide flow channel at various places. It is also considered effective to provide a large number of outlets for the flow. The side wall of this wide channel is the back (or side) of the plate-shaped heat pipe, where a number of heat exchange fins (for example, pin type or needle type) are set up over the whole area. I have. By the action of the fins, high heat uniformity and high heat exchange efficiency can be obtained. In addition, the height of the flow path is larger near the center than in the vicinity of the periphery, thereby reducing the difference in flow velocity between the vicinity of the periphery and the vicinity of the center to increase the uniformity of heat. ing. Alternatively, a mechanism is provided to control the flow of the fluid that has flowed in from the fluid inlet so that it is almost parallel to the surface of the plate-type heat pipe, thereby suppressing local temperature unevenness near the fluid inlet. To increase the heat uniformity. A heat fluid for heating and a heat fluid for cooling are selectively supplied to the flow path. The mechanism for supplying the hot fluid includes a pump for sending the hot fluid, and a heating device and a cooling device for heating and cooling the hot fluid, respectively. For each of the heating device and the cooling device, a bypass passage for circulating the heating fluid through the pump and each of the heating device and the cooling device by bypassing the flow channel when the hot fluid is not supplied to the flow channel is provided. Is provided. Due to the presence of this bypass, the pump can always be operated at a constant rotation speed even when hot fluid is not supplied to the flow path, and the hot fluid is always controlled to the target temperature. When the process is started, the thermal fluid at the target temperature can be immediately supplied at an appropriate flow rate, and thus the temperature controllability is good. Either heating or cooling may be performed with a heat fluid, or only one of them, especially cooling, may be performed with a heat fluid, and heating may be performed with a heating wire or an infrared lamp. In the case where a thermal fluid is ejected from a nozzle or the like to a panel-type heat pipe, it is relatively easy to combine with an infrared lamp and irradiate light from the infrared lamp to the panel-type heat pipe. When a heat fluid is applied to the panel-type heat pipe through the channel, it is relatively easy to arrange the heating wire on the front or back of the panel-type heat pipe, or on the surface, inside, or in the gap of the channel. .

Various other improvements and objects of the present invention will become apparent in the following description. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a configuration diagram showing a first embodiment of the present invention.

FIG. 2 is a plan view showing a planar arrangement of a fluid ejection nozzle and a halogen lamp.

FIG. 3 is a plan view of the heat panel 2 according to the first configuration example as viewed from the lower surface side.

FIG. 4 is a cross-sectional view of the heat panel 2 taken along line A—A in FIG. FIG. 5 is a cross-sectional plan view of the heat panel 2 according to the second configuration example.

FIG. 6 is a cross-sectional view of the heat panel 2 taken along line A—A and line B—B in FIG.

FIG. 7 is a plan view of the heat panel 2 according to the third configuration example as viewed from the lower surface side.

FIG. 8 is a cross-sectional view taken along line AA in FIG.

FIG. 9 is a plan view of a heat panel 2 according to a fourth configuration example.

FIG. 10 is a cross-sectional view taken along line AA of FIG.

FIG. 11 is a configuration diagram showing a second embodiment of the present invention.

FIG. 12 is a partial cross-sectional view of the third embodiment of the present invention as viewed from above.

FIG. 13 is a partial cross-sectional view of the same embodiment as viewed from below.

FIG. 14 is a perspective view showing a typical example of a fin.

FIG. 15 is a fluid circuit diagram showing a piping structure for flowing a fluid into the temperature control chamber 81.

FIG. 16 is a cross-sectional view showing a first modification of the structure of the temperature control chamber 81 for improving the temperature uniformity.

FIG. 17 is a cross-sectional view showing a second modification of the structure of the temperature control chamber 81 for improving the heat uniformity.

FIG. 18 is a cross-sectional view showing a third modification of the structure of the temperature control chamber 81 for improving the heat uniformity.

Fig. 19 is a cross-sectional view taken along line A-A of Fig. 18 (a plan view of the bottom wall 85 of the temperature control chamber 81). FIG. 20 is a cross-sectional view showing a fourth modification of the structure of the temperature control chamber 81 for improving the thermal uniformity.

FIG. 21 is a cross-sectional view showing a fifth modification of the structure of the temperature control chamber 81 for improving the heat uniformity.

FIG. 22 is a cross-sectional view showing a sixth modification of the structure of the temperature control chamber 81 for improving the temperature uniformity.

Fig. 23 shows a seventh modification of the structure of the temperature control chamber 81 for improving the temperature uniformity. FIG.

FIG. 24 is a cross-sectional view showing an eighth modified example manufactured by another method.

FIG. 25 is a partial cross-sectional view showing a ninth modified example using the heating wire.

FIG. 26 is a partial cross-sectional view showing a tenth modification using a heating wire.

FIG. 27 is a partial cross-sectional view showing a first modified example using a heating wire.

FIG. 28 is a partial cross-sectional view showing a 12th modified example using a heating wire.

FIG. 29 is a partial cross-sectional view showing a thirteenth modification using a heating wire.

FIG. 30 is a partial cross-sectional view showing a 14th modified example using a heating wire.

FIG. 31 is a cross-sectional view showing a fifteenth modification example in which heating and cooling channels are separated.

FIG. 32 is a cross-sectional view taken along line AA of FIG.

FIG. 33 is a sectional view showing a sixteenth modification.

FIG. 34 is a cross-sectional view taken along line A—A of FIG.

FIG. 35 is a cross-sectional view showing a 16th modified example in which the temperature control chamber 81 is provided on the side surface of the heat panel 2. Conditions for Invention

Hereinafter, an embodiment in which the present invention is applied to temperature control of a semiconductor device in a semiconductor manufacturing process will be described.

In a semiconductor manufacturing process, for example, a resist film is usually formed on a wafer surface through the following process.

(1) Cleaning

(Z) Resist coating

(3) Pre-vac + cooling

(4) Exposure

(5) Development (6) Rinse

(7) Bost bake + cooling

(8) Etching

Here, in the pre-baking, the baking temperature is set to 90 to 200 degrees Celsius (depending on the process), and in the cooling subsequent to this pre-baking, the target temperature is about 20 degrees Celsius. Is set to room temperature. In the post bake, the baking temperature is set at 100 to 250 degrees Celsius (depending on the process), and the cooling temperature following the host bake is set at 20 degrees Celsius. Room temperature is set. The next step after the pre-bake + cooling step is exposure, and the next step after the bot-bake + cooling step is etching. Quite severe conditions are required for the temperature distribution of the wafer so that the process can be immediately shifted to the next step.

The embodiment described below is used in a pre-bake + cooling step or a post-bake + cooling step, in which a wafer is first heated to a high temperature (baking), and then the wafer is brought to room temperature. The cycle of cooling (cooling) is repeated at intervals of several tens of seconds for each wafer. Therefore, heating and cooling are alternately repeated with two target temperatures, the target temperature for heating and the target for cooling.

FIG. 1 shows the overall configuration of this embodiment.

As shown in FIG. 1, a wafer 1 is placed on the upper surface of a plate-shaped heat pipe (hereinafter referred to as a heat panel) 2. At a plurality of positions of the heat panel 2, a plurality of vertically movable thin pins 3 are provided so as to penetrate the heat panel 2 from the lower surface to the upper surface (the drive mechanism is not shown). Actually, the wafer 1 is placed on the tips of the pins 3. At the time of baking or cooling, the pins 3 have descended to positions where the tips slightly protrude from the upper surface of the heat panel 2, so that the wafer 1 is placed on the upper surface of the heat panel 2 with a small air gap. I have.

As is well known, the basic structure of the heat panel 2 is composed of a number of series containing a predetermined working fluid. It is a plate with a space through which it passes, and has extremely high thermal conductivity, small size, and heat capacity. The role of the heat panel 2 is to perform heat exchange between the wafer 1 and a heat medium (fluid or light), which will be applied to the lower surface of the heat panel 2, uniformly and at high speed over the entire surface of the wafer 1. In order to effectively fulfill this function, the heat panel 2 of the present embodiment has a special structure described later.

A temperature control room 4 is provided below the heat panel 2, and the heat panel 2 forms a ceiling wall of the temperature control room 4. The wall 5 other than the heat panel 2 of the temperature control room 4 is made of a material having poor heat conductivity. In the temperature control chamber 4, a number of fluid ejection nozzles 6 are provided upright. As shown in the plan view of FIG. 2, these fluid ejection nozzles 6 are arranged vertically and horizontally at a substantially uniform density over the entire two-dimensional area covering the lower surface of the heat panel 2. A low-temperature (that is, wafer cooling) liquid 8 is supplied to these fluid ejection nozzles 6 through a fluid storage pipe 7. The fluid ejection nozzle 6 has one or many small ejection holes at its tip, and blows a high-speed shower of liquid 8 as indicated by an arrow from the ejection holes to the heat panel 2 on the ceiling. be able to. Since the liquid shear is turbulent, heat can be effectively exchanged with the heat panel 2. To ensure that the liquid shower is applied to the entire lower surface of the heat panel 2 as uniformly as possible, the pitch of the array of fluid ejection nozzles 6, the number and shape of the ejection holes, and the distance from the ejection holes to the lower surface of the heat panel 2 are optimal. Designed for

The distal end of the liquid supply path 10 is connected to the fluid storage pipe 7, and the base end of the liquid supply path 10 is connected to the liquid discharge port 14 on the bottom wall of the temperature control chamber 4, in the middle of the liquid supply path 10. Is provided with a valve 9, a pump 11 and a chiller 112. The liquid 8 that has fallen to the bottom of the temperature control chamber 4 is sent to the chiller 12, where it is adjusted to a predetermined low temperature, and then supplied to the fluid ejection nozzle 6 with the pressure of the pump 11, and the high-speed shower and As a result, it is blown to the lower surface of the heat panel 2 and again falls to the bottom of the temperature control chamber 4 to be circulated in the same manner.

The liquid 8 is a liquid having a light transmitting property and an insulating property, such as Florina Toga. Ruden (both registered trademarks) can be used. Water and ethylene glycol, which are easy to handle, can also be used if they meet the required temperature conditions.

The temperature control chamber 4 can be a closed type or an open type having an opening 13 to the outside air. In the closed type temperature control room 4, the liquid jet flow is ejected from the ejection nozzle 6 in the room filled with liquid, so that the fluid ejection nozzle 6 enters the room and the forced convection flows through the ceiling heat panel 2 → discharge port 14 Is generated, and the heat panel 2 can be cooled by the forced convection. Since this forced convection is turbulent, heat can be effectively exchanged with the heat panel 2. Further, in the open type temperature control room 4, since the liquid shear collides with the ceiling heat panel 2 through the space, only the new liquid always collides with the heat panel 2 and heat exchange can be performed promptly. it can.

The temperature control room 4 further includes a plurality of long cylindrical infrared lamps 23 for heating arranged between the arrays 15 of the jet nozzles 6 (see FIG. 2). The lamp 23 is, for example, a halogen lamp and emits much near-infrared light. Each of the halogen lamps 23 is housed in a reflection mirror 20 having an opening at an upper portion, and the upper opening of the reflection mirror 20 is closed with a cover 25 made of a light transmitting material. Further, a water cooling tube 24 for cooling the lamp 23 and the reflection mirror 20 is provided below each of the halogen lamps 23. Instead of the water cooling tube 24, a liquid storage tube 7 is provided. May be used as a cooling means for the lamp 23 and the reflection mirror 20. Further, depending on the conditions, the cooling means for the lamp 23 and the reflection mirror 20 may not be provided.

The radiated light from each of the halogen lamps 23 irradiates the lower surface of the heat panel 2 on the ceiling while spreading in a fan shape by the action of the reflection mirror 20, and gives radiant heat to the heat panel 2. The size of the halogen lamp 23, the arrangement pitch of the halogen lamps 23, the shape of the reflection mirror 20, the shape of the reflection mirror 20, the heat panel 2 to the heat panel 2, so that the entire lower surface of the heat panel 2 is irradiated with light as uniform as possible. The distance to is designed optimally I have.

As a heating means, instead of the halogen lamp 23 or in combination with the halogen lamp 23, a number of fluid ejection nozzles for ejecting a high-temperature liquid are provided in the same manner as the cooling fluid ejection nozzle 6. It may be provided. When the halogen lamp, 23 and the heating fluid injection nozzle are used in combination, a larger heating capacity can be obtained.

The heat panel 2 may have various configurations. The following are some examples of suitable configurations.

FIG. 3 is a plan view of the heat panel 2 according to the first configuration example viewed from the lower surface side, and FIG. 4 is a cross-sectional view of the heat panel 2 taken along line AA in FIG.

The outer shell of the heat panel 2 is roughly composed of, for example, two thin plates 31 and 32 made of a material having high thermal conductivity, such as aluminum and copper, superposed on each other, and a hydraulic fluid is provided in a predetermined region between the two plates. A space (that is, a pipe) 33 in which is enclosed is formed, and the two plates 31 and 32 are joined in an area other than the pipe 33. In FIG. 3, the hatched area is the joined portion, and the unhatched area is the pipe 33. The pipe 33 protrudes to one side of the heat panel as shown in FIG. 4A or to both sides as shown in FIG. 4B.The ridge of the protruded pipe 33 is shown in FIG. This is indicated by a dashed line. A predetermined amount of hydraulic fluid is sealed in the pipe 33 in an appropriate amount, and a wick 36 for transporting the hydraulic fluid by utilizing capillary action is provided on the inner wall of the pipe.

As shown in FIG. 3, the external shape of the heat panel 2 in a plan view is circular in conformity with that of the semiconductor wafer, but it is not necessarily required to be circular, as in other configuration examples described later. It may be square. In short, the planar shape of the heat panel 2 may be any shape that is convenient for design and manufacture and suitable for equalizing the temperature of the entire wafer. As can be seen from the shape of the ridge indicated by the dashed line, the pipes 33 of the heat panel 2 constitute a pipe network 35 formed by connecting a number of small regular hexagonal pipes like a honeycomb section. The heat panels 2 are arranged at a constant density over almost the entire surface. In addition, The eye of the Eve network 35 (the junction of the regular hexagons) 3 4 is only partially shown in FIG. 3, but actually exists at the center of all the regular hexagonal regions surrounded by the ridge. The eye 3 4 increases the mechanical strength of the heat panel 2, so the plates 3 1 and 3 2 are thinned to reduce the heat capacity of the heat panel 2 while maintaining the required mechanical strength. Contribute to enhance the effect.

A heat panel of the type in which the pipe 33 protrudes only on one side as shown in Fig. 4A or a heat panel of the type protruding on both sides as shown in Fig. B can be used. This is a single-sided swelling type shown in 4A. This is because the one-sided swelling type has better mechanical strength and also has better soaking degree for the following reasons. That is, in this embodiment, the single-sided swelling type heat panel 2 has a flat surface as an upper surface (a surface on which the wafer 1 is placed) and a pipe swelling surface as a lower surface (a surface to which a liquid shower or radiation is applied). To use. Then, the distance between the upper surface of the heat panel 2 and the wafer 1 is constant, and the heat diffusion along the upper surface of the heat panel 2 is uniform regardless of the direction and location. Heat exchange between wafers 1 tends to be uniform. The high strength of the heat panel 2 also contributes to suppressing the heat deformation of the heat panel 2 and keeping the distance from the wafer 1 constant. On the other hand, since the pipe 33 protrudes from the lower surface of the heat panel 2, the contact area with liquid or light is larger than the flat surface, and the same liquid is in contact with the liquid shower. The effect of suppressing the generation of the thermal boundary layer by shortening the time and the effect of promoting turbulence can be expected, and the Hall effect by repeating irregular reflection when light is applied can be expected, resulting in good heat exchange efficiency. As a result, a high soaking effect is obtained. By the way, the shape of the mesh 34 of the pipe network 35 of the heat panel 2 does not necessarily have to be a regular hexagon as shown in the figure, but may be a square, a regular triangle, a circle, or the like. However, in order to obtain a high soaking effect, it is desirable that the density of the pipes 33 and the meshes 34 be constant over the entire area of the pipe net 35 regardless of the direction and location. Also, the individual heat pipes are not independent as disclosed in Japanese Patent Application Laid-Open No. It is desirable that the pipes at each location 33 communicate with the pipes at surrounding locations. FIG. 5 is a cross-sectional plan view of the heat panel 2 according to the second configuration example, and FIGS. 6A and 6B are cross-sectional views of the same heat panel 2 taken along lines A-A and B-B in FIG. .

The heat panel 2 is formed by laminating and joining two plates 41 and 42 made of aluminum or copper. The upper plate 41 constituting the upper surface of the heat panel 2 is thicker than the lower plate 42, and the lower surface thereof is formed with a wide area concave portion 44 except for the peripheral edge thereof. A large number of thin pillars 43 are erected inside the recess 44. Although only some pillars 43 are shown in FIG. 5, the pillars 43 are actually arranged at a constant pitch over the entire area of the recess 44. The lower plate 42 is superimposed on the upper plate 41 so as to cover the concave portion 44, and the two plates 41, 42 are formed by the peripheral edge hatched in Fig. 5 and the tip of the pillar 43. Are joined. As a result, a net of fine pipes 45 having a uniform density and having the columns 43 as eyes is formed in the recesses 44. The pillars 4 3 contribute to increasing the mechanical strength of the heat panel 2. A wick 46 is provided in the pipe 45, and the working fluid is sealed therein.

With this structure, the cross-sectional area of the pillars 4 3, which are the meshes of the pipe network, can be designed to be very small as compared with the structures shown in FIGS. Can be increased. Therefore, it is possible to realize a heat panel having a high heat diffusion rate and exhibiting an excellent soaking effect. The cross-sectional shape of the pillar 43 is rectangular in FIG. 5, but may be other shapes such as a circle.

FIG. 7 is a plan view of the heat panel 2 according to the third configuration example viewed from the lower surface side, and FIG. 8 is a cross-sectional view taken along line AA of FIG.

The heat panel 2 has two plates 51 and 52 made of aluminum or copper which are superimposed on each other, the peripheral portions of the plates 51 and 52 are sealed with a sealing member 53, and a constant pitch is applied over the entire surface. The two plates 51 and 52 are joined together at a number of small points (spots) 54 arranged in. The upper plate 51 is a flat plate thicker than the lower plate 51, and the lower plate 52 is a spot 5 as shown in FIG. It is preformed into a shape that protrudes only in four places. Therefore, when the two plates 51 and 52 are joined, a net of fine-grained pipes 56 with a uniform density is formed over almost the entire surface, with the small spots 54 as eyes. A wick 57 is provided in the pipe 56, and the working fluid is sealed therein. The spots 54 serve to increase the mechanical strength of the heat panel 2. Since the area of the spot 54, which is the mesh of the pipe network, is small, the area ratio of the pipe 56 is large, so that heat diffusion is fast and an excellent soaking effect can be exhibited.

FIG. 9 is a plan view of the heat panel 2 according to the fourth configuration example, and FIG. 10 is a cross-sectional view taken along line AA of FIG.

This heat panel 2 is a type of application called a loop-shaped meandering thin tube heat pipe (LCHP), and no wick is required. As shown, two plates 61 and 62 made of aluminum or copper are joined with a thin partition plate 63 interposed therebetween. At the joint surface of each of the two plates 61, 62, a number of extremely narrow grooves 64, 65 running parallel to each other at a constant small pitch over almost the entire surface are cut. It is rare. The many grooves 64 of the plate 61 are adjacent to each other and are sequentially connected at different ends, thereby forming one meandering groove 68 as a whole. A large number of grooves 65 of the plate 62 are similarly connected to form one meandering groove 69 as a whole. The two plates 61 and 62 are joined in a direction in which the meandering grooves 68 and 69 are orthogonal. Since the openings of the meandering grooves 68 and 69 are covered by the partition plate 63, each forms an extremely fine meandering pipe. The two meandering pipes 68 and 69 pass through the partition plate 63 at both ends 66 and 67 and are connected to each other to form a closed loop meandering pipe as a whole. The meandering pipes 68 and 69 that are orthogonal and communicate with each other can also be referred to as a kind of pipe network. As can be seen from FIG. 9, pipes are arranged at a uniform density over the entire panel surface. The hydraulic fluid is sealed in the meandering pipes 68 and 69. The inner diameter of the meandering pipes 68, 69 (grooves 64, 65) is such that the hydraulic fluid closes the meandering pipes 68, 69 like a plug due to its surface tension. As thin as possible (about 0.1 mm to several mm Degrees).

The heat panel 2 of the LCHP type has a different principle from the heat panels of the types shown in Fig. 3 to Fig. 8, that is, heat is transferred at high speed by circulating hydraulic fluid and its vapor bubbles in meandering pipes or by axial vibration. I do.

In the heat panel shown in Figs. 9 and 10, two meandering pipes 68, 69 with a small arrangement pitch are overlapped so as to be orthogonal to each other, and the pipes are finely arranged at a uniform density over the entire panel surface. The pipe network is formed and heat transport can be performed in both directions perpendicular to each other, so that an excellent soaking effect can be exhibited.

In the various heat panels 2 described above, in order to increase the heat exchange rate on the lower surface, unevenness is provided on the lower surface, projections are provided, pins are formed, the surface is roughened by shaving, and light absorption is performed. Processing such as coating a material may be added.

The operation of the present embodiment under the above configuration will be described below.

Baking at a temperature of the wafer 1 of, for example, 150 degrees Celsius and cooling for cooling the temperature of the wafer 1 to, for example, 20 degrees Celsius are alternately performed. First, the wafer 1 coated with the resist is placed on the pins 3 from the upper surface of the heat panel 2 via a minute gap, and the halogen lamp 23 is turned on to start baking. The radiant heat from each lamp 23 is absorbed by the lower surface of the heat panel 2, transported at high speed from the lower surface to the upper surface in the pipe 33 of the heat panel 2, and transmitted to the wafer 1 from the upper surface of the heat panel 2. The temperature of the heat panel 2 is detected by a temperature sensor (not shown), and the light amount of the lamp 23 is adjusted based on the detected temperature, and the temperature of the wafer 1 is controlled to the target temperature of 150 degrees Celsius.

When baking is completed, lamps 2 and 3 are turned off, and then cooling is started. First, the valve 9 is opened, the pump 11 is started, and the liquid 8 having a temperature of about 20 degrees Celsius is supplied from the chiller 12 to the liquid storage pipe 7. The liquid 8 supplied to the storage pipe 7 is jetted out of the nozzle 6 as a high-speed shower, and collides with the lower surface of the heat panel 2 so that the lower surface of the heat panel 2 Take away the heat of. In the pipe 3 3 of the heat panel 2, heat is rapidly transmitted from the upper surface to the lower surface, and the heat of the wafer 1 is taken by the heat panel 2. The ejection amount of the liquid 8 is adjusted based on the temperature detected by the temperature sensor described above, and the temperature of the wafer 1 is controlled to the target temperature of 20 degrees Celsius.

Wafer 1 after cleaning is removed from heat panel 2 and wafer 1 coated with the next resist is similarly placed on heat panel 2 and subjected to baking and cooling processing. .

In the present embodiment, both heating and cooling of the wafer 1 can be performed at high speed with a high degree of uniformity. The reason is as follows.

(1) The heat source devices for heating and cooling are the lamps 23 and the liquid jet nozzles 6.Each of them is a shower of heat medium such as infrared light or low-temperature liquid from a location far away from the lower surface of the heat panel 2. Is a non-contact type heat source. Therefore, as compared with the cooling pipe disclosed in Japanese Patent Application Laid-Open No. Hei 7-226713, the heat medium is transferred to the lower surface of the heat pipe as compared with a contact-type heat source such as a Peltier element disclosed in Japanese Patent Application Laid-Open No. 5-218308. It is easy to perform uniform heating and cooling by applying a uniform density to the whole.

(2) Since both the heating heat source and the cooling heat source are non-contact types, one does not interfere with the other. For example, if a contact-type cooling heat source such as the cooling pipe of Japanese Patent Application Laid-Open No. Hei 7-222671 is used, heating needs to be performed including the cooling pipe, and the heat capacity increases. Decrease. In this embodiment, since there is no such a problem, heating and cooling can be performed at high speed.

(3) In the heat panel 2, the pipes filled with the hydraulic fluid are arranged with a substantially uniform density and a fine grain throughout almost the entire surface of the panel, and are connected to each other to form a pipe net. . Therefore, thermal diffusivity in the surface direction is good, and a good soaking effect can be exhibited.

(4) Good heat uniformity of the heat source described in (1) and good heat uniformity of the heat panel 2 itself described in (3) Combined with good soaking properties, an excellent soaking effect as a whole is obtained.

(5) The good thermal uniformity of the heat source described in (1) and the favorable thermal uniformity of the heat panel 2 itself described in (3) also have an effect of reducing thermal deformation of the heat panel 2. If the heat deformation of the heat panel 2 is reduced, the unevenness of the gap between the heat panel 1 and the heat panel 2 is reduced, which also contributes to the improvement of the soaking effect.

(6) The fine mesh distribution of the pipe mesh of the heat panel 2 also contributes to reducing the thermal deformation of the heat panel 2 and increasing the soaking effect.

(7) The upper surface of the heat panel 2 may be flat, and the gap between the wafer 1 and the heat panel 2 may be kept constant, and the heat diffusion on the upper surface may be improved to enhance the soaking effect. Contribute to

(8) Since the fluid is turbulent and impinges on the lower surface of the heat panel 2, a high heat exchange rate and a high heat uniformity can be obtained.

(9) When processing such as making the lower surface of the heat panel 2 uneven, providing projections, setting up pins, shaving to roughen the surface, or coating the light absorbing material, the turbulence of the fluid The effect is promoted, and the Hall effect of light is obtained, the heat exchange rate on the lower surface is increased, and the effect of increasing the speed of heating and cooling is obtained.

(10) Direct application of heat medium to the heat panel also contributes to increasing the speed of heating and cooling.

(11) Placing a wafer on the heat panel 2 via only a small air gap also contributes to increasing the speed of heating and cooling.

FIG. 11 shows another embodiment of the present invention. Note that components having the same functions as those of the above-described embodiment are denoted by the same reference numerals, and redundant description will be omitted.

In this embodiment, the liquid in which the gas is mixed is formed into a mist and is sprayed on the lower surface of the heat panel 2. The high-temperature liquid is supplied to a number of heating mist nozzles 71 via a high-temperature liquid supply path 70. High temperature gas such as N2 or He It is supplied from the body supply source 72 and mixed with the high-temperature liquid in the middle of the high-temperature liquid supply path 70 by the pump 73. Further, the low-temperature liquid is supplied to many cooling mist nozzles 75 through the low-temperature liquid supply path 74. A low-temperature gas such as air or N2 is supplied from a low-temperature gas supply source 76 and is mixed with the low-temperature liquid in the middle of the low-temperature liquid supply path 74 by a pump 77.

A perforated plate 79 is provided above the mist nozzles 71 and 75 in the temperature control chamber 4 to improve the turbulent flow effect. The mist-like fluid jetted from the mist nozzles 71 and 75 obtains a turbulent flow effect to increase the heat transfer capability, and uniformly hits the lower surface of the heat panel 2. In addition, a protector may be applied to the area excluding the ejection holes of the nozzles 71 and 79 so that the fluid flowing down from the lower surface of the heat panel 2 does not remove the heat of the nozzles 71 and 75.

FIG. 12 is a partial cross-sectional view of the third embodiment of the present invention as viewed from above, and FIG. 13 is a partial cross-sectional view of the same embodiment as viewed from below. Note that components having the same functions as those of the above-described embodiment are denoted by the same reference numerals, and redundant description will be omitted.

In this embodiment, a circular temperature control room 81 is provided below the disk-shaped heat panel 2, and the heat panel 2 forms a ceiling wall of the temperature control room 81. The peripheral wall 83 and the bottom wall 85 of the temperature control room 81 may be made of the same material as the heat panel 2 (typically, aluminum), or may be made of a material having a lower thermal conductivity than the heat panel 2 (for example, , Stainless steel and ceramics). The temperature control chamber 81 is of a closed type, and functions as a flow path through which a high-temperature heating fluid or a low-temperature cooling fluid is filled.

The bottom wall 85 of the temperature control chamber 81 has a plurality of fluid inlets 87 at regular intervals along its periphery, to which a plurality of external fluid supply pipes 89 are connected. Has been done. One fluid discharge port 91 is open in the center of the bottom wall 85, and one fluid discharge pipe 93 from the outside is connected to it. Flow to multiple fluid inlets 8 7 Since there is one body outlet 91, the diameter of the fluid outlet 91 is larger than the diameter of each fluid inlet 87.

On the lower surface 2 A of the heat panel 2, a large number of heat exchange fins 95 are erected throughout the entire surface thereof, and the heat exchange fins 95 extend over almost the entire flow path in the temperature control chamber 81. Are distributed. Fins 95 are made of a material with good heat conductivity (aluminum or copper). These fins 95 are joined to the lower surface 2A of the heat panel 2 by brazing or the like, but do not need to be in contact with the bottom wall 85 and are separated from the bottom wall 85 by a small distance. May be.

In the present embodiment, the fins 95 are pin-shaped fins, but this is not necessary, and various other types of fins can be used. Fig. 14 shows a typical example of such a fin, as shown in Figs. (A) to (F), of a thin plate bent type, a pin-shaped fin as shown in (G), and (H). ) Or needle-shaped fins closely planted like a brush can also be used. Alternatively, porous aluminum materials such as those used in the moisture absorbing and releasing members shown in FIGS. 6, 7, 9 and 11 of Japanese Utility Model Application No. 1-501, aluminum foam Materials such as materials, metal fibers and metal membranes can also be used as fins in the present invention. Further, not only one type of fin but also a combination of plural types of fins can be used.

FIG. 15 shows a piping structure for flowing a fluid into the temperature control chamber 81.

The plurality of fluid supply pipes 89 are connected to the fluid outlet of the fluid heating device 105 via the solenoid valve 101 and the pump 103, and via the solenoid valve 109 and the pump 111. It is connected to the fluid outlet of the fluid cooling device 113. Further, the fluid discharge pipe 93 is connected to the fluid inlet of the fluid heating device 105 via the solenoid valve 119, and to the fluid inlet of the fluid cooling device 113 via the solenoid valve 117. It is connected. The fluid outlet and fluid inlet of the fluid heating device 105 are connected via a bypass solenoid valve 107, and similarly, the fluid outlet and fluid inlet of the fluid cooling device 113 are connected to the bypass solenoid valve 111. Connected via 5 You.

The pumps 103 and 111 always send fluid at a constant speed.When the fluid is not flowing to the temperature control chamber 81, the bypass solenoid valves 107 and 115 are open. The fluid is circulated through it. When the solenoid valves 101 and 119 are opened and the bypass solenoid valve 107 is closed from this state, the heating fluid from the fluid heating device 105 is supplied to the temperature control chamber 81 and heating is performed. Be started. When switching from heating to cooling, the solenoid valve 101 is closed and the bypass solenoid valve 107 is opened, and at the same time, the solenoid valve 109 is opened and the bypass solenoid valve 115 is closed. Thus, the supply of the heating fluid to the temperature control chamber 81 is stopped, and the supply of the cooling fluid from the fluid cooling device 113 is started instead, and the cooling is started. Immediately after the start of cooling, the solenoid valve 1 19 opens on the side of the fluid discharge pipe 93 for a short period of time during which the heating fluid remaining in the temperature control chamber 81 comes out of the fluid discharge pipe 93. The same state as during heating with 1 1 7 closed is maintained, and after that time, solenoid valve 1 1 9 is closed and solenoid valve 1 1 7 is opened, and full-scale cooling is started . When switching from cooling to heating, perform the opposite valve opening and closing operation. In this way, the heating fluid and the cooling fluid are selectively supplied to the temperature control chamber 81.

In the temperature control chamber 81, the fluid flowing from the fluid inlet 87 at the peripheral part flows toward the fluid outlet 91 at the center. Heat exchange. In addition, the flow of the fluid is mixed and disturbed by a large number of fins 95 everywhere and becomes a turbulent flow, so that the heat exchange can be performed with higher efficiency as compared with the case where the fluid flows as a simple laminar flow, And the temperature of the heat panel 2 becomes more uniform. Thus, the fins 95 contribute to both the purpose of increasing the heat exchange efficiency to achieve high-speed heating and cooling, and the purpose of reducing unevenness in the temperature distribution to achieve uniform heating and cooling.

Further, by appropriately selecting the arrangement of the fins 95 and the like, the temperature of the heat panel 2 can be made more uniform. That is, without the fins 9 5 In other words, the heat exchange efficiency is inevitably different between the vicinity of the fluid inlet 87 and the vicinity of the fluid outlet 91 because the fluid temperature and flow velocity are different. Therefore, by changing the arrangement position, density, shape, and the like of the fins 95 depending on the location so as to compensate for this difference, heat exchange can be performed more uniformly at all locations. Thus, the fins 95 play an important role in achieving high heat uniformity.

By the way, in the present embodiment, the fluid is supplied from the peripheral portion into the temperature control chamber 81 and flows toward the central portion. On the contrary, the fluid is supplied from the central portion and flows to the peripheral portion. It is also possible. However, from the viewpoint of good heat uniformity, it is considered preferable to flow from the periphery to the center as in the present embodiment. Since the flow velocity is higher in the central part than in the peripheral part, the heat exchange efficiency is higher accordingly. This is because the distribution of the heat exchange efficiency due to the difference in the temperature and the distribution of the heat exchange efficiency due to the difference in the flow velocity are reduced and uniformized.

FIG. 16 and FIG. 17 show two modifications of the structure of the temperature control chamber 81 for improving the temperature uniformity.

In the case of FIG. 16, the bottom wall 85 is inclined so that the height 81H of the temperature control chamber 81 becomes larger as approaching the center. In the case of Fig. 17, the bottom wall 85 is stepped down at a place somewhat near the center, and again, the height 81H of the temperature control chamber 81 is larger than the periphery at the center. ing. In these two modified examples, the cross-sectional area of the fluid flow path near the center is increased by the height 81 1 H of the temperature control chamber 81 near the center, so the flow velocity at the center is increased. Increase is suppressed, and as a result, the temperature uniformity is increased.

FIG. 18 shows a third modification of the structure of the temperature control chamber 81 for improving the temperature uniformity. FIG. 19 is a cross-sectional view taken along line A_A of FIG. 1 is a plan view of the bottom wall 85 of FIG. In FIGS. 18 and 19, the fins 95 in the temperature control chamber 81 are The illustration is omitted.

In this modification, the diameter of the temperature control chamber 81 is larger than the diameter of the heat panel 2, and the temperature control chamber 81 is located at the portion protruding to the outer peripheral side from the heat panel 2, and the upper and lower partition plates on the inner side thereof It has a ring-shaped small room 1 2 1 separated from a region inside the temperature control room 8 1 by 1 2 3 and 1 2 5. A fluid inlet 87 is formed in the bottom wall of the ring-shaped small room 1 2 1, and between the upper and lower partition plates 1 2 3 and 1 2 5 inside the ring-shaped small room 1 2 1 In this case, a slit is vacant because the fluid flows from the small chamber 122 to the area inside the temperature control chamber 81.

The fluid flowing into the small room 1 2 1 from the fluid inlet 8 7 changes its direction of flow upon hitting the ceiling of the small room 1 2 1, and becomes a flow almost parallel to the lower surface 2 A of the heat panel 2. It flows into the area inside the temperature control chamber 81 through the slit between the partition plates 1 2 3 and 1 2 5. If the fluid flowing in from the fluid inlet 87 directly hits the lower surface 2A of the heat panel 2 at right angles, only the portion of the heat panel 2 corresponding to the fluid inlet 87 will locally increase the heat exchange efficiency. However, in this modification, such a problem is solved.

FIG. 20 shows a further modification of the modification shown in FIGS. Also in FIG. 20, the fins 95 in the temperature control chamber 81 are not shown.

Inside the ring-shaped small room 1 2 1, there is one partition plate connected from the ceiling to the bottom, but this partition plate 1 2 7 has many holes 1 2 9 everywhere, The fluid in the small room 122 is jetted as a shower flow to the inner region of the temperature control room 81 through these holes 122.

FIGS. 21 and 22 show yet another two modifications of the fluid inlet 87 of the temperature control chamber 81 for improving the heat uniformity.

In Fig. 21, the fluid inlet 87 is formed in a direction perpendicular to the side wall 83 of the temperature control chamber 81, and the fluid flows in the temperature control chamber 81 parallel to the lower surface 2A of the heat panel 2. Flow Enter. In Fig. 22, the fluid inlet 87 is formed in the bottom wall 85 of the temperature control chamber 81 in an oblique direction, and the fluid is temperature-controlled in a direction parallel to the lower surface 2A of the heat panel 2. It flows into room 81. In any of the modifications, the problem of local temperature unevenness caused by the fluid flowing from the fluid inlet 87 directly hit the lower surface 2A of the heat panel 2 at right angles is reduced.

FIG. 23 is a plan view of a bottom wall showing still another modified example of the fluid inlet 87 of the temperature control chamber 81 for improving the heat uniformity.

The fluid inlet 87 is an elongated slit, which is formed around the periphery of the bottom wall 85 over one circumference. Therefore, the fluid can be made to flow uniformly around the periphery of the bottom wall 85 over the entire circumference, and temperature unevenness depending on the location in the circumferential direction is eliminated.

FIG. 24 shows an example of the structure of the heat panel 2 and the temperature control chamber 81 manufactured by a method different from the above-described embodiment.

The structure described in FIGS. 12 to 23 is generally manufactured by joining the side wall 83 and the bottom wall 85 of the temperature control chamber 81 to the lower surface 2A of the heat panel 2 manufactured in advance. . In contrast, the structure shown in Fig. 24 was manufactured by the following method. First, a plate material 1 3 1 to be the bottom plate of the heat panel 2 is prepared, and for example, a number of columns 43 of the heat panel 2 shown in FIG. Many fins 95 are erected. Next, on the upper side of the plate 1 3 1, a plate 1 3 3 serving as a ceiling wall and a side wall of the heat panel 2 is joined, and on the lower surface, a plate 1 serving as a ceiling wall and a side wall of the temperature control room 81 1 3 Join 5 In some cases, this manufacturing method is easier than the manufacturing method of the structure described with reference to FIGS.

FIG. 25 is a partial cross-sectional view of yet another modified example of the third embodiment viewed from below. In this modification, a heating wire heater 141 wrapped like a maze is joined to the lower surface of the bottom wall 85 of the temperature control room 81 over the entire lower surface. Heating is performed exclusively with heating wire 14 1 or heating wire 14 1 and heating fluid, and cooling is performed exclusively with cooling fluid Do with.

FIG. 26, FIG. 27 and FIG. 28 show another two modifications using the heating wire. In FIG. 26, the heating wire 144 is joined to the upper surface 2 B of the heat panel 2. Heating efficiency is very good because the heating wire is closest to the wafer not shown. In FIG. 27, a drip-proof heating wire 144 is joined to the lower surface 2 A of the heat panel 2. The heating efficiency is much better than that of Fig. 25 because the heating wire is directly in contact with the heat panel 2. In FIG. 28, the peripheral portion 151 of the heat panel 2 is formed thicker than the other portions, and the heating peripheral portion 1C extends over the wide outer peripheral surface 2C of the thick peripheral portion 151. 4 7 are joined.

FIG. 29 and FIG. 30 show two further modified examples.

In FIG. 29, a heating wire 150 is embedded in the bottom wall 153 of the heat panel over the entire surface. In FIG. 30, a coil-shaped heating wire 157 is packed in the temperature control room 81 over the entire area. The coiled heating wire 157 also functions as a heat exchange fin. As yet another modification, although not shown, fins (which may be of various types as illustrated in FIG. 14) provided in the temperature control room 81 have a function of heating and heating. You may let it.

It is also possible to combine multiple types of heating wire heaters shown in FIGS. 25 to 30. For example, as shown in Fig. 25, a heating wire is provided on the bottom of the temperature control room 81, and the heating wire is also provided on the upper surface 2B of the heat panel 2 as shown in Fig. 26. Heater 1 4 3 and so on.

FIG. 31 shows still another modification. Fig. 32 is a sectional view taken along the line A-A in Fig. 31.

In this modification, a flow path 16 1 for the heating fluid and a flow path 16 3 for the cooling fluid are formed in the temperature control chamber 81 independently of each other. The bottom surface 2 A of the heat panel 2 forms a ceiling surface of the heating fluid channel 16 1 and the cooling fluid channel 16 3. These two channels 1 Numerals 61 and 163 are arranged in a spiral shape over the entire surface of the heat panel 2 as shown in FIG. 32, for example. Then, for example, the fluids are supplied from the outer peripheral ports 16 9, 17 1 of the spiral flow paths 16 1, 16 3, respectively, from the central ports 16 5, 16 7. Its fluid is drained. Since the flow passages 16 1 and 16 3 are spirally bent, the fluid flowing therethrough collides with the outer peripheral surface of the flow passages 16 1 and 16 3 and becomes turbulent, resulting in good heat exchange efficiency. . The material of the temperature control chamber 81 is preferably a material having high thermal conductivity. The channels 16 1 and 16 3 may have a shape other than the spiral shape, for example, a meandering shape.

FIG. 33 shows still another modification, and FIG. 34 is a cross-sectional view taken along line AA of FIG.

In this modification, a heating wire heater 173 is embedded or inserted in the temperature control chamber 81 in place of the heating fluid flow path 161 shown in FIG. As shown in FIG. 34, a cooling fluid flow path 16 3 is arranged in a meandering manner in the temperature control chamber 81, and a rod-shaped heating wire heater 1-3 is inserted in the gap. Since 163 is meandering, the fluid flowing therethrough is somewhat turbulent. The flow path 163 may be formed in a spiral shape as shown in FIG. 32, and a spiral heating wire 173 may be inserted into the gap. FIG. 35 shows another modification.

As shown in FIG. 28, the heat panel 2 has a peripheral portion 151 formed thicker than the other portions, and extends over a wide outer peripheral surface 2C of the thick peripheral portion 151. A ring-shaped temperature control chamber 81 is formed. An outer peripheral surface 2C of the heat panel 2 constitutes an inner peripheral surface of the temperature control chamber 81, and a number of heat exchange fins 95 are erected outward on the inner peripheral surface. In the temperature control chamber 81, one fluid inlet 87 and one fluid outlet 91 are formed at positions symmetrical with respect to the central axis of the heat panel 2.

As described above, some preferred embodiments of the present invention and modifications thereof have been described. However, the present invention is not limited to the above-described embodiments, and can be implemented in other various forms. For example, cooling is performed from the bottom of the heat pipe as in the embodiment, but heating is performed on the wafer. It is also possible to use heat pipes only for heating or cooling, for example, by using an infrared lamp located on the side without using a heat pipe. Further, the present invention can be applied not only to the semiconductor wafer processing apparatus as in the above-described embodiment, but also to various other substrate processing apparatuses and wall and table surface temperature control apparatuses.

Claims

The scope of the claims

1. A plate-shaped heat pipe with front and back,

At least one type of heat source device of a non-contact type, which is disposed apart from the rear surface of the heat pipe and injects a heat medium and contacts the rear surface of the heat pipe;

Temperature control device equipped with.

2. In the claim 1,

The plate-type heat pipe has a number of pipes filled with a working fluid, the number of pipes communicating with each other to form a pipe network, and substantially over the entire surface of the plate-type heat pipe. Temperature control device arranged at a uniform density.

3. In claim 2,

A temperature control device wherein each of said plurality of pipes is a regular polygon or a circle.

4. In the item of claim 2,

A temperature control device, wherein the mesh of the pipe network is arranged at a substantially uniform density over substantially the entire area of the pipe network.

5. Claims 1 to 3,

A temperature control device wherein the back surface of the plate-type heat pipe has irregularities.

6. In claims 1 to 4,

A temperature control device wherein the front surface of the plate-shaped heat pipe is flat.

7. Claims 1 to 6,

A temperature control device including a fluid ejection mechanism for ejecting a fluid, which is a liquid, a gas, or a mixture of a liquid and a gas, as the heat medium toward a back surface of the heat pipe;

8. In the device of claim 7,

A temperature control device, wherein the fluid ejection mechanism includes a heating mechanism that ejects a heating fluid, and a cooling mechanism that ejects a cooling fluid.

9. Claims 1 to 7,

A temperature control device, wherein the heat source device includes an electromagnetic wave radiating unit that radiates an electromagnetic wave as the heat medium toward a back surface of the heat pipe.

10. In the claims 1 to 9,

A temperature control device, wherein the heat source device is configured to apply the heat medium to a rear surface of the heat panel at a substantially uniform density over the entire rear surface.

11. A plate-shaped heat pipe having a front surface, a back surface, and a side surface, the plate having a turbulent flow mechanism for causing a turbulent flow of the thermal fluid when the thermal fluid hits the back surface or the lateral surface. Shaped heat pipe.

1 2. In claim 11,

A plate type heat pipe, wherein the turbulence mechanism is configured to form the turbulent flow of the thermal fluid over substantially the entire back or side surface of the plate type heat pipe.

1 3. In claim 11,

A plate-shaped heat pipe, wherein the turbulence mechanism includes a fluid ejection mechanism for injecting the hot fluid or a mixture of the hot fluid and a gas onto a back surface of the hot plate.

1 4. In the item of claim 11,

The plate heat pipe, wherein the turbulence mechanism includes a back surface or a side surface formed in an uneven shape of the plate heat pipe.

1 5. In the claim 1,

The plate-shaped heat pipe, wherein the turbulence mechanism includes a number of heat exchange fins provided on a back surface or a side surface of the plate-shaped heat pipe.

16. In the matter of claim 15,

A plate-type heat pipe in which the heat exchange fins are of a pin type or a needle type.

17. In the matter described in claim 15 or 16,

The heat exchange fins extend over substantially the entire back or side surface of the plate-type heat pipe. A plate-type heat pipe that is placed at the end.

1 8. In the claim 11,

The plate-shaped heat pipe, wherein the turbulence mechanism includes a flow path for flowing the heat fluid, which is provided on a back surface or a side surface of the plate-shaped heat pipe.

1 9. In the claim 18,

A plate-shaped heat pipe in which a large number of heat exchange fins are arranged in the flow path.

20. In the one described in claim 19,

A back surface or a side surface of the plate-shaped heat pipe constitutes a part of a wall of the flow path, and the heat exchange fins are joined to a back surface or a side surface of the plate-shaped heat pipe as a part of the wall. Plate heat pipe.

2 1. In the claim 18,

The flow path extends over substantially the entire rear surface of the plate-shaped heat pipe so as to cover substantially the entire rear surface of the heat pipe.

A plate-shaped heat pipe having an inlet or an outlet for the thermal fluid at a peripheral portion of the widened channel, and an outlet or an inlet for the thermal fluid at a center of the channel.

2 2. In the method described in claim 21,

The flow path is a circular one formed in contact with the back surface of the plate-shaped heat pipe,

A plate-shaped heat pipe having an inlet or an outlet for the thermal fluid at a peripheral portion of the circular channel, and an outlet or an inlet for the thermal fluid at a center of the channel.

23. In the matter described in claim 21 or 22,

2 4. In the thing described in claim 23,

The back surface of the plate-shaped heat pipe constitutes a negative wall of the flow path, and the heat exchange fins are provided on the back surface of the plate-shaped heat pipe as the one-side wall. Plate-shaped heat pipe joined.

25. In the matter described in claim 21 or 22,

A plate-type heat pipe in which the height near the center of the flow path is larger than the height near the periphery of the flow path.

26. In the matter described in claim 21 or 22,

The back surface of the plate-shaped heat pipe constitutes a negative wall of the flow path, and controls the flow of the thermal fluid flowing from the inflow port in a direction substantially parallel to the back surface of the plate-shaped heat pipe. Plate type heat pipe with flow control mechanism.

27. A plate-type heat pipe having a front face, a back face, and side faces, and heating or cooling an object on the front face side;

A temperature control chamber provided on the back or side surface of the plate-shaped heat pipe, for applying a turbulent flow of a thermal fluid to the back surface or side surface;

Temperature control device equipped with.

2 8 In claim 27,

The temperature control device, wherein the temperature control chamber is configured to apply the turbulent flow of the thermal fluid over substantially the entire back surface or side surface of the plate-type heat pipe.

29. In the matter of claim 27,

A temperature control device, comprising: a fluid ejection mechanism for injecting the heat fluid or a mixture of the heat fluid and a gas into a rear surface of the plate-type heat pipe inside the temperature control chamber.

30. In the matter of claim 27,

A temperature control device comprising a flow path for flowing the thermal fluid in the temperature control chamber.

3 1. In the claim 30,

A temperature control device in which a number of heat exchange fins are arranged in the flow path.

3 2. In the thing described in claim 31,

The back or side surface of the plate-shaped heat pipe constitutes a part of the wall of the flow path. A temperature control device in which the heat exchange fins are joined to a back surface or a side surface of the plate-shaped heat pipe as a part of the wall.

3 3. In the claim 30,

The flow path extends over substantially the entire back surface of the plate-shaped heat pipe so as to cover substantially the entire back surface of the plate-shaped heat pipe,

A temperature control device having an inlet or an outlet for the thermal fluid at a peripheral portion of the widened flow channel, and an outlet or an inlet for the thermal fluid at a center of the flow channel.

34. In the one described in claim 30,

A temperature control device comprising: an inlet or an outlet for the thermal fluid at a peripheral portion of the circular channel; and an outlet or an inlet for the thermal fluid at a center of the channel.

35. In the matter described in claim 33 or 34,

36. In the matter of claim 35,

A temperature control device, wherein a back surface of the plate-type heat pipe constitutes a negative wall of the flow path, and the heat exchange fins are joined to a back surface of the plate-type heat pipe as the one-side wall. .

37. In the matter described in claim 35 or 36,

A temperature control device, wherein the height near the center of the flow path is larger than the height near the periphery of the flow path.

38. In the method described in claim 33 or 34,

The back surface of the plate-shaped heat pipe constitutes a negative wall of the flow path, and controls the flow of the thermal fluid flowing from the inflow port in a direction substantially parallel to the back surface of the plate-shaped heat pipe. A temperature control device having a flow control mechanism.

39. In the matter of claim 27,

A temperature control device further comprising a fluid supply mechanism for selectively supplying a heating fluid and a cooling fluid to the temperature control chamber.

40. In the claim 27,

Further comprising a fluid supply mechanism for supplying the thermal fluid to the temperature control chamber,

A pump for feeding the hot fluid, a fluid temperature control device for heating or cooling the hot fluid, and a bypass for the hot fluid when the hot fluid is not supplied to the temperature control chamber. A temperature control device having a bypass for circulating the thermal fluid through the pump and the fluid temperature control device.

41. In the matter of claim 27,

A temperature control device, wherein a heating wire is provided on at least one of a front surface, a back surface, a side surface, and a wall of the plate-shaped heat pipe, and at least one of an inside, a bottom surface, a side surface, and a wall of the temperature control chamber.