JP2022537656A - 印刷回路板を製造するための方法、及びかかる方法に従って製造された印刷回路板 - Google Patents

印刷回路板を製造するための方法、及びかかる方法に従って製造された印刷回路板 Download PDF

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Publication number
JP2022537656A
JP2022537656A JP2021572092A JP2021572092A JP2022537656A JP 2022537656 A JP2022537656 A JP 2022537656A JP 2021572092 A JP2021572092 A JP 2021572092A JP 2021572092 A JP2021572092 A JP 2021572092A JP 2022537656 A JP2022537656 A JP 2022537656A
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Japan
Prior art keywords
metal layer
cover metal
substrate side
substrate
groove
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Pending
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JP2021572092A
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Japanese (ja)
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JP2022537656A5 (enExample
Inventor
クリスティアン シュミット，
Original Assignee
ゲブリューダー シュミット ゲゼルシャフト ミット ベシュレンクテル ハフツング
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Publication of JP2022537656A publication Critical patent/JP2022537656A/ja
Publication of JP2022537656A5 publication Critical patent/JP2022537656A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0585—Second resist used as mask for selective stripping of first resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4679—Aligning added circuit layers or via connections relative to previous circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2021572092A 2019-07-04 2020-06-18 印刷回路板を製造するための方法、及びかかる方法に従って製造された印刷回路板 Pending JP2022537656A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102019209889.4 2019-07-04
DE102019209889.4A DE102019209889A1 (de) 2019-07-04 2019-07-04 Verfahren zur Leiterplattenherstellung sowie gemäß dem Verfahren hergestellte Leiterplatten
PCT/EP2020/067042 WO2021001167A1 (de) 2019-07-04 2020-06-18 VERFAHREN ZUR LEITERPLATTENHERSTELLUNG SOWIE GEMÄß DEM VERFAHREN HERGESTELLTE LEITERPLATTEN

Publications (2)

Publication Number Publication Date
JP2022537656A true JP2022537656A (ja) 2022-08-29
JP2022537656A5 JP2022537656A5 (enExample) 2023-04-26

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ID=71120168

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JP2021572092A Pending JP2022537656A (ja) 2019-07-04 2020-06-18 印刷回路板を製造するための方法、及びかかる方法に従って製造された印刷回路板

Country Status (8)

Country Link
US (1) US20220361341A1 (enExample)
EP (1) EP3994963A1 (enExample)
JP (1) JP2022537656A (enExample)
KR (1) KR20220030279A (enExample)
CN (1) CN114009154A (enExample)
DE (1) DE102019209889A1 (enExample)
TW (1) TWI873155B (enExample)
WO (1) WO2021001167A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021209939A1 (de) 2021-09-08 2023-03-09 Gebr. Schmid Gmbh Verfahren zur Leiterplattenherstellung und Leiterplatte
CN115884494A (zh) * 2021-09-28 2023-03-31 深南电路股份有限公司 一种线路内埋方法及线路内埋pcb板
CN114725026A (zh) * 2022-03-04 2022-07-08 苏州链芯半导体科技有限公司 一种叠加先进塑料的柔性无芯3d印刷集成电路模压工艺
CN114745845B (zh) * 2022-04-30 2023-08-08 苏州浪潮智能科技有限公司 一种印刷电路板及制造方法
DE102023116529A1 (de) 2023-06-23 2024-12-24 Gebr. Schmid Gmbh Verfahren zur Leiterplattenherstellung
DE102024125859A1 (de) * 2024-09-09 2026-03-12 Gebr. Schmid Gmbh Verfahren zur Herstellung mehrschichtiger Substrate mit einer integrierten Leiterstruktur und gemäss dem Verfahren herstellbare mehrschichtige Substrate

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0335585A (ja) * 1989-07-03 1991-02-15 Polyplastics Co 精密細線回路用成形品の製造方法
JPH07240568A (ja) * 1994-02-28 1995-09-12 Mitsubishi Electric Corp 回路基板およびその製造方法
JPH11103171A (ja) * 1997-07-28 1999-04-13 Hitachi Ltd 配線板及びその製造方法並びに無電解めっき方法
JP2005332928A (ja) * 2004-05-19 2005-12-02 Sumitomo Heavy Ind Ltd プリント配線板の製造方法
WO2012132325A1 (ja) * 2011-03-25 2012-10-04 住友ベークライト株式会社 プリント配線基板、プリント配線基板の製造方法および半導体装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3373256D1 (en) * 1983-05-19 1987-10-01 Ibm Deutschland Process for manufacturing printed circuits with metallic conductor patterns embedded in the isolating substrate
US5173442A (en) * 1990-07-23 1992-12-22 Microelectronics And Computer Technology Corporation Methods of forming channels and vias in insulating layers
US5244538A (en) * 1991-07-26 1993-09-14 Microelectronics And Computer Technology Corporation Method of patterning metal on a substrate using direct-write deposition of a mask
JP3361556B2 (ja) * 1992-09-25 2003-01-07 日本メクトロン株式会社 回路配線パタ−ンの形成法
US6518160B1 (en) * 1998-02-05 2003-02-11 Tessera, Inc. Method of manufacturing connection components using a plasma patterned mask
US7091589B2 (en) * 2002-12-11 2006-08-15 Dai Nippon Printing Co., Ltd. Multilayer wiring board and manufacture method thereof
US20060127686A1 (en) * 2004-12-15 2006-06-15 Meloni Paul A Thermally conductive polyimide film composites having high thermal conductivity useful in an electronic device
TWI253714B (en) * 2004-12-21 2006-04-21 Phoenix Prec Technology Corp Method for fabricating a multi-layer circuit board with fine pitch
KR101022914B1 (ko) * 2008-11-04 2011-03-16 삼성전기주식회사 인쇄회로기판의 제조방법
KR101267277B1 (ko) * 2011-05-19 2013-05-24 한국기계연구원 유연기판의 금속배선 형성방법
CN102315163A (zh) * 2011-09-28 2012-01-11 上海华力微电子有限公司 超低介电常数薄膜铜互连的制作方法
US20140027163A1 (en) * 2012-07-30 2014-01-30 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method for manufacturing the same
JP6044592B2 (ja) * 2014-05-29 2016-12-14 トヨタ自動車株式会社 多層配線基板及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0335585A (ja) * 1989-07-03 1991-02-15 Polyplastics Co 精密細線回路用成形品の製造方法
JPH07240568A (ja) * 1994-02-28 1995-09-12 Mitsubishi Electric Corp 回路基板およびその製造方法
JPH11103171A (ja) * 1997-07-28 1999-04-13 Hitachi Ltd 配線板及びその製造方法並びに無電解めっき方法
JP2005332928A (ja) * 2004-05-19 2005-12-02 Sumitomo Heavy Ind Ltd プリント配線板の製造方法
WO2012132325A1 (ja) * 2011-03-25 2012-10-04 住友ベークライト株式会社 プリント配線基板、プリント配線基板の製造方法および半導体装置

Also Published As

Publication number Publication date
KR20220030279A (ko) 2022-03-10
CN114009154A (zh) 2022-02-01
WO2021001167A1 (de) 2021-01-07
TW202109622A (zh) 2021-03-01
DE102019209889A1 (de) 2021-01-07
US20220361341A1 (en) 2022-11-10
EP3994963A1 (de) 2022-05-11
TWI873155B (zh) 2025-02-21

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