TWI873155B - 製造印刷電路板的方法及依照該方法製造之印刷電路板 - Google Patents

製造印刷電路板的方法及依照該方法製造之印刷電路板 Download PDF

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Publication number
TWI873155B
TWI873155B TW109122330A TW109122330A TWI873155B TW I873155 B TWI873155 B TW I873155B TW 109122330 A TW109122330 A TW 109122330A TW 109122330 A TW109122330 A TW 109122330A TW I873155 B TWI873155 B TW I873155B
Authority
TW
Taiwan
Prior art keywords
metal layer
trench
covering metal
substrate side
substrate
Prior art date
Application number
TW109122330A
Other languages
English (en)
Chinese (zh)
Other versions
TW202109622A (zh
Inventor
克利司堤恩 史密德
Original Assignee
德商吉伯史密德公司
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Application filed by 德商吉伯史密德公司 filed Critical 德商吉伯史密德公司
Publication of TW202109622A publication Critical patent/TW202109622A/zh
Application granted granted Critical
Publication of TWI873155B publication Critical patent/TWI873155B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0585—Second resist used as mask for selective stripping of first resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4679—Aligning added circuit layers or via connections relative to previous circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW109122330A 2019-07-04 2020-07-02 製造印刷電路板的方法及依照該方法製造之印刷電路板 TWI873155B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102019209889.4 2019-07-04
DE102019209889.4A DE102019209889A1 (de) 2019-07-04 2019-07-04 Verfahren zur Leiterplattenherstellung sowie gemäß dem Verfahren hergestellte Leiterplatten

Publications (2)

Publication Number Publication Date
TW202109622A TW202109622A (zh) 2021-03-01
TWI873155B true TWI873155B (zh) 2025-02-21

Family

ID=71120168

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109122330A TWI873155B (zh) 2019-07-04 2020-07-02 製造印刷電路板的方法及依照該方法製造之印刷電路板

Country Status (8)

Country Link
US (1) US20220361341A1 (enExample)
EP (1) EP3994963A1 (enExample)
JP (1) JP2022537656A (enExample)
KR (1) KR20220030279A (enExample)
CN (1) CN114009154A (enExample)
DE (1) DE102019209889A1 (enExample)
TW (1) TWI873155B (enExample)
WO (1) WO2021001167A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021209939A1 (de) 2021-09-08 2023-03-09 Gebr. Schmid Gmbh Verfahren zur Leiterplattenherstellung und Leiterplatte
CN115884494A (zh) * 2021-09-28 2023-03-31 深南电路股份有限公司 一种线路内埋方法及线路内埋pcb板
CN114725026A (zh) * 2022-03-04 2022-07-08 苏州链芯半导体科技有限公司 一种叠加先进塑料的柔性无芯3d印刷集成电路模压工艺
CN114745845B (zh) * 2022-04-30 2023-08-08 苏州浪潮智能科技有限公司 一种印刷电路板及制造方法
DE102023116529A1 (de) 2023-06-23 2024-12-24 Gebr. Schmid Gmbh Verfahren zur Leiterplattenherstellung
DE102024125859A1 (de) * 2024-09-09 2026-03-12 Gebr. Schmid Gmbh Verfahren zur Herstellung mehrschichtiger Substrate mit einer integrierten Leiterstruktur und gemäss dem Verfahren herstellbare mehrschichtige Substrate

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US20060131176A1 (en) * 2004-12-21 2006-06-22 Shih-Ping Hsu Multi-layer circuit board with fine pitches and fabricating method thereof
US20130078806A1 (en) * 2011-09-28 2013-03-28 Shanghai Huali Microelectronics Corporation Method for Fabricating Copper Interconnections in an Ultra Low Dielectric Constant Film
US20150351235A1 (en) * 2014-05-29 2015-12-03 Toyota Jidosha Kabushiki Kaisha Multilayer wiring board and manufacturing method for the multilayer wiring board

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DE3373256D1 (en) * 1983-05-19 1987-10-01 Ibm Deutschland Process for manufacturing printed circuits with metallic conductor patterns embedded in the isolating substrate
JPH0724328B2 (ja) * 1989-07-03 1995-03-15 ポリプラスチックス株式会社 精密細線回路用成形品の製造方法
US5173442A (en) * 1990-07-23 1992-12-22 Microelectronics And Computer Technology Corporation Methods of forming channels and vias in insulating layers
US5244538A (en) * 1991-07-26 1993-09-14 Microelectronics And Computer Technology Corporation Method of patterning metal on a substrate using direct-write deposition of a mask
JP3361556B2 (ja) * 1992-09-25 2003-01-07 日本メクトロン株式会社 回路配線パタ−ンの形成法
JPH07240568A (ja) * 1994-02-28 1995-09-12 Mitsubishi Electric Corp 回路基板およびその製造方法
JP3726500B2 (ja) * 1997-07-28 2005-12-14 株式会社日立製作所 配線板及びその製造方法並びに無電解めっき方法
US6518160B1 (en) * 1998-02-05 2003-02-11 Tessera, Inc. Method of manufacturing connection components using a plasma patterned mask
US7091589B2 (en) * 2002-12-11 2006-08-15 Dai Nippon Printing Co., Ltd. Multilayer wiring board and manufacture method thereof
JP2005332928A (ja) * 2004-05-19 2005-12-02 Sumitomo Heavy Ind Ltd プリント配線板の製造方法
US20060127686A1 (en) * 2004-12-15 2006-06-15 Meloni Paul A Thermally conductive polyimide film composites having high thermal conductivity useful in an electronic device
KR101022914B1 (ko) * 2008-11-04 2011-03-16 삼성전기주식회사 인쇄회로기판의 제조방법
JP5892157B2 (ja) * 2011-03-25 2016-03-23 住友ベークライト株式会社 プリント配線基板、プリント配線基板の製造方法および半導体装置
KR101267277B1 (ko) * 2011-05-19 2013-05-24 한국기계연구원 유연기판의 금속배선 형성방법
US20140027163A1 (en) * 2012-07-30 2014-01-30 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method for manufacturing the same

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
US20060131176A1 (en) * 2004-12-21 2006-06-22 Shih-Ping Hsu Multi-layer circuit board with fine pitches and fabricating method thereof
US20130078806A1 (en) * 2011-09-28 2013-03-28 Shanghai Huali Microelectronics Corporation Method for Fabricating Copper Interconnections in an Ultra Low Dielectric Constant Film
US20150351235A1 (en) * 2014-05-29 2015-12-03 Toyota Jidosha Kabushiki Kaisha Multilayer wiring board and manufacturing method for the multilayer wiring board

Also Published As

Publication number Publication date
JP2022537656A (ja) 2022-08-29
KR20220030279A (ko) 2022-03-10
CN114009154A (zh) 2022-02-01
WO2021001167A1 (de) 2021-01-07
TW202109622A (zh) 2021-03-01
DE102019209889A1 (de) 2021-01-07
US20220361341A1 (en) 2022-11-10
EP3994963A1 (de) 2022-05-11

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