JP2021507508A5 - - Google Patents
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- Publication number
- JP2021507508A5 JP2021507508A5 JP2020531599A JP2020531599A JP2021507508A5 JP 2021507508 A5 JP2021507508 A5 JP 2021507508A5 JP 2020531599 A JP2020531599 A JP 2020531599A JP 2020531599 A JP2020531599 A JP 2020531599A JP 2021507508 A5 JP2021507508 A5 JP 2021507508A5
- Authority
- JP
- Japan
- Prior art keywords
- laminated substrate
- vertical
- vertical columns
- traces
- laminated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762599397P | 2017-12-15 | 2017-12-15 | |
| US62/599,397 | 2017-12-15 | ||
| US16/210,594 US11817239B2 (en) | 2017-12-15 | 2018-12-05 | Embedded vertical inductor in laminate stacked substrates |
| US16/210,594 | 2018-12-05 | ||
| PCT/US2018/064782 WO2019118366A1 (en) | 2017-12-15 | 2018-12-10 | Embedded vertical inductor in laminate stacked substrates |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021507508A JP2021507508A (ja) | 2021-02-22 |
| JP2021507508A5 true JP2021507508A5 (https=) | 2022-01-06 |
| JP7442446B2 JP7442446B2 (ja) | 2024-03-04 |
Family
ID=66814602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020531599A Active JP7442446B2 (ja) | 2017-12-15 | 2018-12-10 | ラミネート積層基板における埋め込み垂直インダクタ |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US11817239B2 (https=) |
| EP (1) | EP3724900A1 (https=) |
| JP (1) | JP7442446B2 (https=) |
| KR (1) | KR102722208B1 (https=) |
| CN (1) | CN111448626A (https=) |
| SG (1) | SG11202004020TA (https=) |
| TW (1) | TWI837106B (https=) |
| WO (1) | WO2019118366A1 (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11546019B2 (en) | 2018-12-10 | 2023-01-03 | Skyworks Solutions, Inc. | Apparatus for minimizing electromagnetic coupling between surface mount device inductors |
| US20200286660A1 (en) * | 2019-03-04 | 2020-09-10 | Intel Corporation | On-package vertical inductors and transformers for compact 5g modules |
| US11728293B2 (en) * | 2021-02-03 | 2023-08-15 | Qualcomm Incorporated | Chip modules employing conductive pillars to couple a passive component device to conductive traces in a metallization structure to form a passive component |
| US12592334B2 (en) * | 2021-11-22 | 2026-03-31 | Intel Corporation | Stacked magnetic inductor and method |
| JP2023089544A (ja) * | 2021-12-16 | 2023-06-28 | キオクシア株式会社 | 半導体装置 |
| US20240379650A1 (en) * | 2022-04-27 | 2024-11-14 | Beijing Boe Optoelectronics Technology Co., Ltd. | Filter and manufacturing method therefor |
| CN116544008B (zh) * | 2023-03-31 | 2026-03-17 | 泉州市三安集成电路有限公司 | 一种桥式电感结构及其制作方法和应用 |
| WO2025020187A1 (zh) * | 2023-07-27 | 2025-01-30 | 京东方科技集团股份有限公司 | 电感结构、滤波器 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6501363B1 (en) * | 1999-11-03 | 2002-12-31 | Innosys, Inc. | Vertical transformer |
| JP4341321B2 (ja) * | 2003-07-18 | 2009-10-07 | パナソニック株式会社 | 電子部品内蔵モジュール |
| US6931712B2 (en) | 2004-01-14 | 2005-08-23 | International Business Machines Corporation | Method of forming a dielectric substrate having a multiturn inductor |
| US7733207B2 (en) | 2007-05-31 | 2010-06-08 | Electronics And Telecommunications Research Institute | Vertically formed inductor and electronic device having the same |
| JP5407404B2 (ja) | 2009-02-19 | 2014-02-05 | ソニー株式会社 | 配線基板とその製造方法、チューナモジュール、及び電子機器 |
| US8471358B2 (en) | 2010-06-01 | 2013-06-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | 3D inductor and transformer |
| US9406738B2 (en) * | 2011-07-20 | 2016-08-02 | Xilinx, Inc. | Inductive structure formed using through silicon vias |
| JP5761463B2 (ja) | 2012-08-09 | 2015-08-12 | 株式会社村田製作所 | アンテナ装置および無線通信装置 |
| US8952504B2 (en) | 2013-02-08 | 2015-02-10 | Qualcomm Incorporated | Small form factor magnetic shield for magnetorestrictive random access memory (MRAM) |
| JP2014160751A (ja) | 2013-02-20 | 2014-09-04 | Ibiden Co Ltd | プリント配線板 |
| US9196406B2 (en) | 2013-03-15 | 2015-11-24 | Rf Micro Devices, Inc. | High Q factor inductor structure |
| JP5585740B1 (ja) | 2013-03-18 | 2014-09-10 | 株式会社村田製作所 | 積層型インダクタ素子および通信装置 |
| JP2014232837A (ja) | 2013-05-30 | 2014-12-11 | イビデン株式会社 | 配線板 |
| JP2015026762A (ja) | 2013-07-29 | 2015-02-05 | イビデン株式会社 | プリント配線板 |
| US9806144B2 (en) | 2013-11-13 | 2017-10-31 | Qualcomm Incorporated | Solenoid inductor in a substrate |
| US20150371764A1 (en) | 2014-06-20 | 2015-12-24 | International Business Machines Corporation | Nested helical inductor |
| US9478348B2 (en) | 2014-06-24 | 2016-10-25 | Qualcomm Incorporated | Vertical spiral inductor |
| US10796835B2 (en) | 2015-08-24 | 2020-10-06 | Qorvo Us, Inc. | Stacked laminate inductors for high module volume utilization and performance-cost-size-processing-time tradeoff |
| CN106531410B (zh) | 2015-09-15 | 2019-08-27 | 臻绚电子科技(上海)有限公司 | 线圈，电感元件及制备应用于电感元件的线圈的方法 |
| US20170084379A1 (en) | 2015-09-21 | 2017-03-23 | Qorvo Us, Inc. | Substrates with integrated three dimensional inductors with via columns |
-
2018
- 2018-12-05 US US16/210,594 patent/US11817239B2/en active Active
- 2018-12-10 KR KR1020207016813A patent/KR102722208B1/ko active Active
- 2018-12-10 SG SG11202004020TA patent/SG11202004020TA/en unknown
- 2018-12-10 JP JP2020531599A patent/JP7442446B2/ja active Active
- 2018-12-10 CN CN201880080174.XA patent/CN111448626A/zh active Pending
- 2018-12-10 WO PCT/US2018/064782 patent/WO2019118366A1/en not_active Ceased
- 2018-12-10 EP EP18829662.8A patent/EP3724900A1/en active Pending
- 2018-12-11 TW TW107144500A patent/TWI837106B/zh active
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