SG11202004020TA - Embedded vertical inductor in laminate stacked substrates - Google Patents
Embedded vertical inductor in laminate stacked substratesInfo
- Publication number
- SG11202004020TA SG11202004020TA SG11202004020TA SG11202004020TA SG11202004020TA SG 11202004020T A SG11202004020T A SG 11202004020TA SG 11202004020T A SG11202004020T A SG 11202004020TA SG 11202004020T A SG11202004020T A SG 11202004020TA SG 11202004020T A SG11202004020T A SG 11202004020TA
- Authority
- SG
- Singapore
- Prior art keywords
- stacked substrates
- embedded vertical
- vertical inductor
- laminate stacked
- laminate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
- H01F27/36—Electric or magnetic shields or screens
- H01F27/363—Electric or magnetic shields or screens made of electrically conductive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
- H01F2017/002—Details of via holes for interconnecting the layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/008—Electric or magnetic shielding of printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
- H01F27/36—Electric or magnetic shields or screens
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/04—Circuits
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Coils Or Transformers For Communication (AREA)
- Semiconductor Integrated Circuits (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Combinations Of Printed Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762599397P | 2017-12-15 | 2017-12-15 | |
US16/210,594 US11817239B2 (en) | 2017-12-15 | 2018-12-05 | Embedded vertical inductor in laminate stacked substrates |
PCT/US2018/064782 WO2019118366A1 (en) | 2017-12-15 | 2018-12-10 | Embedded vertical inductor in laminate stacked substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202004020TA true SG11202004020TA (en) | 2020-07-29 |
Family
ID=66814602
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202004020TA SG11202004020TA (en) | 2017-12-15 | 2018-12-10 | Embedded vertical inductor in laminate stacked substrates |
Country Status (7)
Country | Link |
---|---|
US (1) | US11817239B2 (en) |
EP (1) | EP3724900A1 (en) |
JP (1) | JP7442446B2 (en) |
KR (1) | KR20200097717A (en) |
CN (1) | CN111448626A (en) |
SG (1) | SG11202004020TA (en) |
WO (1) | WO2019118366A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11546019B2 (en) * | 2018-12-10 | 2023-01-03 | Skyworks Solutions, Inc. | Apparatus for minimizing electromagnetic coupling between surface mount device inductors |
US20200286660A1 (en) * | 2019-03-04 | 2020-09-10 | Intel Corporation | On-package vertical inductors and transformers for compact 5g modules |
CN117413359A (en) * | 2022-04-27 | 2024-01-16 | 京东方科技集团股份有限公司 | Filter, manufacturing method thereof and electronic equipment |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6501363B1 (en) * | 1999-11-03 | 2002-12-31 | Innosys, Inc. | Vertical transformer |
JP4341321B2 (en) * | 2003-07-18 | 2009-10-07 | パナソニック株式会社 | Electronic component built-in module |
US6931712B2 (en) | 2004-01-14 | 2005-08-23 | International Business Machines Corporation | Method of forming a dielectric substrate having a multiturn inductor |
US7733207B2 (en) | 2007-05-31 | 2010-06-08 | Electronics And Telecommunications Research Institute | Vertically formed inductor and electronic device having the same |
JP5407404B2 (en) | 2009-02-19 | 2014-02-05 | ソニー株式会社 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME, TUNER MODULE, AND ELECTRONIC DEVICE |
US8471358B2 (en) | 2010-06-01 | 2013-06-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | 3D inductor and transformer |
US9406738B2 (en) * | 2011-07-20 | 2016-08-02 | Xilinx, Inc. | Inductive structure formed using through silicon vias |
CN204335178U (en) | 2012-08-09 | 2015-05-13 | 株式会社村田制作所 | Antenna assembly and radio communication device |
US8952504B2 (en) | 2013-02-08 | 2015-02-10 | Qualcomm Incorporated | Small form factor magnetic shield for magnetorestrictive random access memory (MRAM) |
JP2014160751A (en) | 2013-02-20 | 2014-09-04 | Ibiden Co Ltd | Printed wiring board |
US9196406B2 (en) | 2013-03-15 | 2015-11-24 | Rf Micro Devices, Inc. | High Q factor inductor structure |
JP5585740B1 (en) | 2013-03-18 | 2014-09-10 | 株式会社村田製作所 | Multilayer inductor element and communication device |
JP2014232837A (en) | 2013-05-30 | 2014-12-11 | イビデン株式会社 | Wiring board |
JP2015026762A (en) | 2013-07-29 | 2015-02-05 | イビデン株式会社 | Printed wiring board |
US9806144B2 (en) | 2013-11-13 | 2017-10-31 | Qualcomm Incorporated | Solenoid inductor in a substrate |
US20150371764A1 (en) | 2014-06-20 | 2015-12-24 | International Business Machines Corporation | Nested helical inductor |
US9478348B2 (en) | 2014-06-24 | 2016-10-25 | Qualcomm Incorporated | Vertical spiral inductor |
US10796835B2 (en) | 2015-08-24 | 2020-10-06 | Qorvo Us, Inc. | Stacked laminate inductors for high module volume utilization and performance-cost-size-processing-time tradeoff |
CN106531410B (en) | 2015-09-15 | 2019-08-27 | 臻绚电子科技(上海)有限公司 | Coil, inductance element and application and preparation are in the method for the coil of inductance element |
US10483035B2 (en) | 2015-09-21 | 2019-11-19 | Qorvo Us, Inc. | Substrates with integrated three dimensional solenoid inductors |
-
2018
- 2018-12-05 US US16/210,594 patent/US11817239B2/en active Active
- 2018-12-10 EP EP18829662.8A patent/EP3724900A1/en active Pending
- 2018-12-10 SG SG11202004020TA patent/SG11202004020TA/en unknown
- 2018-12-10 KR KR1020207016813A patent/KR20200097717A/en not_active Application Discontinuation
- 2018-12-10 CN CN201880080174.XA patent/CN111448626A/en active Pending
- 2018-12-10 WO PCT/US2018/064782 patent/WO2019118366A1/en unknown
- 2018-12-10 JP JP2020531599A patent/JP7442446B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR20200097717A (en) | 2020-08-19 |
EP3724900A1 (en) | 2020-10-21 |
TW201931394A (en) | 2019-08-01 |
CN111448626A (en) | 2020-07-24 |
WO2019118366A1 (en) | 2019-06-20 |
US11817239B2 (en) | 2023-11-14 |
JP2021507508A (en) | 2021-02-22 |
JP7442446B2 (en) | 2024-03-04 |
US20190189327A1 (en) | 2019-06-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG11201605933YA (en) | Lamination transfer films for forming articles with engineered voids | |
PT3098071T (en) | Decorative sheet and decorative plate | |
EP3366470A4 (en) | Laminated sheet and formed container | |
HRP20182079T1 (en) | Melt laminated decorative laminate | |
EP3450229A4 (en) | Bracket-equipped laminated plate | |
PL3165360T3 (en) | Laminate | |
ZA201605203B (en) | Polyester laminated building boards with improved surface characteristics | |
SG11201701508SA (en) | Electrical multilayer lamination transfer films | |
TWI561386B (en) | Curve laminating equipment | |
EP3253589C0 (en) | Decorative laminate | |
SG11201701507QA (en) | Inorganic multilayer lamination transfer films | |
GB201610639D0 (en) | Glass laminate structure | |
EP3369565A4 (en) | Laminated sheet and laminate | |
SG11201508893YA (en) | Laminate | |
SG11202004020TA (en) | Embedded vertical inductor in laminate stacked substrates | |
PL3230064T3 (en) | A multilayer structure, a laminate comprising the same and articles comprising the laminate | |
HK1216745A1 (en) | Improved stack structures in electronic devices | |
EP3437442A4 (en) | Electronic component embedded by laminated sheet | |
PL3452280T3 (en) | Resin-compatible laminate structures | |
IL257257A (en) | Multilayer plate | |
PL3223958T3 (en) | Laminated nozzle with thick plate | |
PL2781572T3 (en) | Multilayer laminate | |
HK1224133A2 (en) | Laminate | |
GB201415857D0 (en) | Laminated structure | |
SG11202106697TA (en) | Laminate |