SG11201605933YA - Lamination transfer films for forming articles with engineered voids - Google Patents

Lamination transfer films for forming articles with engineered voids

Info

Publication number
SG11201605933YA
SG11201605933YA SG11201605933YA SG11201605933YA SG11201605933YA SG 11201605933Y A SG11201605933Y A SG 11201605933YA SG 11201605933Y A SG11201605933Y A SG 11201605933YA SG 11201605933Y A SG11201605933Y A SG 11201605933YA SG 11201605933Y A SG11201605933Y A SG 11201605933YA
Authority
SG
Singapore
Prior art keywords
transfer films
forming articles
lamination transfer
engineered voids
voids
Prior art date
Application number
SG11201605933YA
Inventor
Evan L Schwartz
Justin P Meyer
Olester Benson Jr
Terry O Collier
Michael Benton Free
Robert F Kamrath
Mieczyslaw H Mazurek
David B Olson
K Raveesh Shenoy
Martin B Wolk
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of SG11201605933YA publication Critical patent/SG11201605933YA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
    • B29D11/00788—Producing optical films
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/263—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer having non-uniform thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0036—Heat treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/06—Embossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1858—Handling of layers or the laminate using vacuum
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/875—Arrangements for extracting light from the devices
    • H10K59/879—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B2037/1253—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives curable adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/08—Dimensions, e.g. volume
    • B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
    • B32B2310/0831—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2419/00—Buildings or parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/12—Photovoltaic modules
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/302—Details of OLEDs of OLED structures
    • H10K2102/3023—Direction of light emission
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/302—Details of OLEDs of OLED structures
    • H10K2102/3023—Direction of light emission
    • H10K2102/3026—Top emission
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Ophthalmology & Optometry (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Thermal Sciences (AREA)
  • Structural Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Architecture (AREA)
  • Laminated Bodies (AREA)
  • Electroluminescent Light Sources (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
SG11201605933YA 2014-01-20 2015-01-14 Lamination transfer films for forming articles with engineered voids SG11201605933YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/159,300 US9246134B2 (en) 2014-01-20 2014-01-20 Lamination transfer films for forming articles with engineered voids
PCT/US2015/011375 WO2015108953A1 (en) 2014-01-20 2015-01-14 Lamination transfer films for forming articles with engineered voids

Publications (1)

Publication Number Publication Date
SG11201605933YA true SG11201605933YA (en) 2016-08-30

Family

ID=53543388

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201605933YA SG11201605933YA (en) 2014-01-20 2015-01-14 Lamination transfer films for forming articles with engineered voids

Country Status (8)

Country Link
US (3) US9246134B2 (en)
EP (1) EP3097596A4 (en)
JP (1) JP2017508647A (en)
KR (1) KR102305074B1 (en)
CN (1) CN105917485B (en)
SG (1) SG11201605933YA (en)
TW (1) TW201541678A (en)
WO (1) WO2015108953A1 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9780335B2 (en) 2012-07-20 2017-10-03 3M Innovative Properties Company Structured lamination transfer films and methods
US9711744B2 (en) 2012-12-21 2017-07-18 3M Innovative Properties Company Patterned structured transfer tape
US20140175707A1 (en) 2012-12-21 2014-06-26 3M Innovative Properties Company Methods of using nanostructured transfer tape and articles made therefrom
TWI632705B (en) * 2013-12-03 2018-08-11 皇家飛利浦有限公司 A method of manufacturing a ceramic light transmitting barrier cell, a barrier cell, a light source and a luminaire
US9246134B2 (en) * 2014-01-20 2016-01-26 3M Innovative Properties Company Lamination transfer films for forming articles with engineered voids
CN105916674B (en) * 2014-01-20 2019-04-02 3M创新有限公司 It is used to form the lamination transfer film of recessed structure
EP3096943A4 (en) 2014-01-22 2018-03-14 3M Innovative Properties Company Microoptics for glazing
TW201539736A (en) 2014-03-19 2015-10-16 3M Innovative Properties Co Nanostructures for color-by-white OLED devices
EP2941980A1 (en) * 2014-05-05 2015-11-11 D. Swarovski KG Compound body made of fibre compound material and decorative element
US9472788B2 (en) * 2014-08-27 2016-10-18 3M Innovative Properties Company Thermally-assisted self-assembly method of nanoparticles and nanowires within engineered periodic structures
US9586385B2 (en) * 2014-08-27 2017-03-07 3M Innovative Properties Company Inorganic multilayer lamination transfer films
JP7009992B2 (en) 2014-10-20 2022-01-26 スリーエム イノベイティブ プロパティズ カンパニー Micro-optical layer and method including adiabatic glazing unit and micro-structured diffuser
JPWO2016139705A1 (en) * 2015-03-02 2017-06-08 パナソニックＩｐマネジメント株式会社 Transfer film and transfer film manufacturing method
US10106643B2 (en) 2015-03-31 2018-10-23 3M Innovative Properties Company Dual-cure nanostructure transfer film
US10518512B2 (en) 2015-03-31 2019-12-31 3M Innovative Properties Company Method of forming dual-cure nanostructure transfer film
US20180269407A1 (en) * 2015-10-01 2018-09-20 Idemitsu Kosan Co., Ltd. Benzimidazolo[1,2-a]benzimidazole carrying triazine groups for organic light emitting diodes
DE102015015452A1 (en) * 2015-12-02 2017-06-08 Forschungszentrum Jülich GmbH Process for planarizing nanostructures
US11312100B2 (en) 2015-12-28 2022-04-26 3M Innovative Properties Company Article with microstructured layer
CN108472917B (en) 2015-12-28 2020-10-23 3M创新有限公司 Article having a microstructured layer
JP2018067414A (en) * 2016-10-18 2018-04-26 ＯＬＥＤ Ｍａｔｅｒｉａｌ Ｓｏｌｕｔｉｏｎｓ株式会社 Mother board of board for electronic device
KR102355529B1 (en) * 2017-08-07 2022-01-26 삼성디스플레이 주식회사 Organic electroluminescence display device
WO2019235955A1 (en) 2018-06-06 2019-12-12 Corning Incorporated Light extraction apparatus and oled displays
KR20220062291A (en) * 2019-09-18 2022-05-16 쓰리엠 이노베이티브 프로퍼티즈 캄파니 Articles comprising nanostructured surfaces and closed pores, and methods of making same
CN115997488A (en) * 2020-08-20 2023-04-21 应用材料公司 OLED light field architecture
CN115956405A (en) * 2020-08-28 2023-04-11 3M创新有限公司 Article comprising nanostructured surface and closed voids, method for making same, and optical element

Family Cites Families (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE24906E (en) 1955-11-18 1960-12-13 Pressure-sensitive adhesive sheet material
CA1254238A (en) 1985-04-30 1989-05-16 Alvin P. Gerk Process for durable sol-gel produced alumina-based ceramics, abrasive grain and abrasive products
JP3444053B2 (en) 1995-10-13 2003-09-08 ソニー株式会社 Thin film semiconductor device
DE69922725T2 (en) 1998-03-17 2005-12-15 Chi Mei Optoelectronics Corp. Material consisting of an anti-reflection coating on a flexible glass substrate
US6027595A (en) 1998-07-02 2000-02-22 Samsung Electronics Co., Ltd. Method of making optical replicas by stamping in photoresist and replicas formed thereby
EP1003078A3 (en) 1998-11-17 2001-11-07 Corning Incorporated Replicating a nanoscale pattern
US6376590B2 (en) 1999-10-28 2002-04-23 3M Innovative Properties Company Zirconia sol, process of making and composite material
US6521324B1 (en) * 1999-11-30 2003-02-18 3M Innovative Properties Company Thermal transfer of microstructured layers
DE10034737C2 (en) * 2000-07-17 2002-07-11 Fraunhofer Ges Forschung Process for producing a permanent release layer by plasma polymerization on the surface of a molding tool, a molding tool which can be produced by the process and its use
US20040190102A1 (en) * 2000-08-18 2004-09-30 Mullen Patrick W. Differentially-cured materials and process for forming same
TWI226103B (en) 2000-08-31 2005-01-01 Georgia Tech Res Inst Fabrication of semiconductor devices with air gaps for ultra low capacitance interconnections and methods of making same
JP2002093315A (en) 2000-09-14 2002-03-29 Matsushita Electric Ind Co Ltd Method and device of forming plasma display panel rib
US6858253B2 (en) 2001-05-31 2005-02-22 3M Innovative Properties Company Method of making dimensionally stable composite article
US6849558B2 (en) * 2002-05-22 2005-02-01 The Board Of Trustees Of The Leland Stanford Junior University Replication and transfer of microstructures and nanostructures
EP1398831A3 (en) 2002-09-13 2008-02-20 Shipley Co. L.L.C. Air gaps formation
US7294934B2 (en) 2002-11-21 2007-11-13 Intel Corporation Low-K dielectric structure and method
KR100563059B1 (en) * 2003-11-28 2006-03-24 삼성에스디아이 주식회사 Electroluminescence display device and laser induced thermal imaging donor film for the electroluminescence display device
US7419912B2 (en) 2004-04-01 2008-09-02 Cree, Inc. Laser patterning of light emitting devices
KR100852110B1 (en) * 2004-06-26 2008-08-13 삼성에스디아이 주식회사 An organic electroluminescent display device and method for preparing the same
US7241437B2 (en) 2004-12-30 2007-07-10 3M Innovative Properties Company Zirconia particles
US7339635B2 (en) * 2005-01-14 2008-03-04 3M Innovative Properties Company Pre-stacked optical films with adhesive layer
DE102005017170B4 (en) * 2005-04-13 2010-07-01 Ovd Kinegram Ag Transfer film, process for their preparation and multilayer body and its use
US20060270806A1 (en) 2005-05-26 2006-11-30 Hale Wesley R Miscible high Tg polyester/polymer blend compositions and films formed therefrom
US20110182805A1 (en) 2005-06-17 2011-07-28 Desimone Joseph M Nanoparticle fabrication methods, systems, and materials
US7924368B2 (en) * 2005-12-08 2011-04-12 3M Innovative Properties Company Diffuse multilayer optical assembly
US20070236939A1 (en) * 2006-03-31 2007-10-11 3M Innovative Properties Company Structured Composite Optical Films
TWI317086B (en) 2006-04-14 2009-11-11 Ritdisplay Corp Top-emitting organic led display having transparent touch panel
US7604916B2 (en) 2006-11-06 2009-10-20 3M Innovative Properties Company Donor films with pattern-directing layers
EP2091999B1 (en) 2006-12-13 2020-08-12 Pibond Oy Novel nanoparticle containing siloxane polymers
US20080233404A1 (en) 2007-03-22 2008-09-25 3M Innovative Properties Company Microreplication tools and patterns using laser induced thermal embossing
US20080304287A1 (en) * 2007-06-08 2008-12-11 Lentics Corporation Microstructure transfer medium and application thereof
TWI369916B (en) 2008-01-31 2012-08-01 Ind Tech Res Inst Top emitting oled display and fabrication method thereof
US8293354B2 (en) 2008-04-09 2012-10-23 The Regents Of The University Of Michigan UV curable silsesquioxane resins for nanoprint lithography
TWI365812B (en) 2008-10-23 2012-06-11 Compal Electronics Inc Transfer film, method of manufacturing the same, transfer method and object surface structure
US8222352B2 (en) 2008-12-24 2012-07-17 Nitto Denko Corporation Silicone resin composition
JP5052534B2 (en) 2009-01-08 2012-10-17 株式会社ブリヂストン Photocurable transfer sheet and method for forming uneven pattern using the same
US8499810B2 (en) 2009-08-27 2013-08-06 Transfer Devices Inc. Molecular transfer lithography apparatus and method for transferring patterned materials to a substrate
US8268067B2 (en) 2009-10-06 2012-09-18 3M Innovative Properties Company Perfluoropolyether coating composition for hard surfaces
KR20120123741A (en) * 2010-01-13 2012-11-09 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Optical films with microstructured low refractive index nanovoided layers and methods and therefor
JPWO2011155582A1 (en) 2010-06-11 2013-08-15 株式会社日立ハイテクノロジーズ Stamper for fine structure transfer and fine structure transfer device
KR20130143547A (en) 2010-07-16 2013-12-31 에이쥐씨 글래스 유럽 Translucent conductive substrate for organic light emitting devices
US8547015B2 (en) * 2010-10-20 2013-10-01 3M Innovative Properties Company Light extraction films for organic light emitting devices (OLEDs)
US8469551B2 (en) * 2010-10-20 2013-06-25 3M Innovative Properties Company Light extraction films for increasing pixelated OLED output with reduced blur
TWI458634B (en) 2010-12-09 2014-11-01 Asahi Kasei E Materials Corp Construction method of fine structure layered body, fine structure layered body and manufacturing method of fine structure
WO2012090541A1 (en) * 2010-12-28 2012-07-05 宇部興産株式会社 Polycrystalline silicon ingot casting mold and method for producing same, and silicon nitride powder for mold release material for polycrystalline silicon ingot casting mold and slurry containing same
WO2012102970A1 (en) * 2011-01-24 2012-08-02 Applied Materials, Inc. Growth of iii-v led stacks using nano masks
CN103946329B (en) * 2011-10-05 2016-03-23 3M创新有限公司 Micro-structural transition zone
KR101931336B1 (en) 2012-04-16 2018-12-20 엘지디스플레이 주식회사 Transfer Film For Attaching Protection Film To Flat Panel Display Device And Method For Manufacturing The Flat Panel Display Device Using The Same
US9780335B2 (en) 2012-07-20 2017-10-03 3M Innovative Properties Company Structured lamination transfer films and methods
TWI485452B (en) * 2012-10-31 2015-05-21 Compal Electronics Inc Composite light guide plate manufacturing method
TWI489179B (en) * 2012-12-14 2015-06-21 Wistron Corp Method and equipment for manufacturing light guide plate and light guide plate therewith
US20140175707A1 (en) 2012-12-21 2014-06-26 3M Innovative Properties Company Methods of using nanostructured transfer tape and articles made therefrom
US9711744B2 (en) * 2012-12-21 2017-07-18 3M Innovative Properties Company Patterned structured transfer tape
US20140242343A1 (en) * 2013-02-27 2014-08-28 3M Innovative Properties Company Lamination transfer films for forming embedded nanostructures
US9246134B2 (en) * 2014-01-20 2016-01-26 3M Innovative Properties Company Lamination transfer films for forming articles with engineered voids

Also Published As

Publication number Publication date
US9731473B2 (en) 2017-08-15
WO2015108953A1 (en) 2015-07-23
US9246134B2 (en) 2016-01-26
EP3097596A4 (en) 2020-10-28
US20150207107A1 (en) 2015-07-23
CN105917485A (en) 2016-08-31
TW201541678A (en) 2015-11-01
CN105917485B (en) 2018-08-21
KR102305074B1 (en) 2021-09-28
KR20160111952A (en) 2016-09-27
US20160087246A1 (en) 2016-03-24
US20160318277A1 (en) 2016-11-03
EP3097596A1 (en) 2016-11-30
US9419250B2 (en) 2016-08-16
JP2017508647A (en) 2017-03-30

Similar Documents

Publication Publication Date Title
SG11201605933YA (en) Lamination transfer films for forming articles with engineered voids
PT3135609T (en) Article transport facility
HUE037626T2 (en) Hybrid fluoropolymer composites
KR102463265B9 (en) Article transport facility
SG10201500011QA (en) Article transport carriage
PL3165360T3 (en) Laminate
GB201418581D0 (en) Composite component
EP3150501A4 (en) Laminated release container and method for manufacturing same
EP3096945A4 (en) Lamination transfer films for forming reentrant structures
PL3313341T3 (en) Methods for transferring discrete articles
SG11201701508SA (en) Electrical multilayer lamination transfer films
EP3163599A4 (en) Laminated ultra-high vacuum forming device
SG11201701507QA (en) Inorganic multilayer lamination transfer films
TWI561386B (en) Curve laminating equipment
GB201417769D0 (en) Composite article
DK3107507T3 (en) Thermoplastic Article
SG11201508893YA (en) Laminate
GB2533912B (en) Layered beverage
SG11201703878SA (en) Bioresorbable-magnesium composite
GB201706053D0 (en) Composite pallet
SG10201509803SA (en) Article storage facility
GB201421801D0 (en) Layer Repair
GB201417781D0 (en) Composite component
PL2803478T3 (en) Plastic multilayer film
SG11201705001TA (en) Sheet laminate for forming resin film