SG11201705001TA - Sheet laminate for forming resin film - Google Patents
Sheet laminate for forming resin filmInfo
- Publication number
- SG11201705001TA SG11201705001TA SG11201705001TA SG11201705001TA SG11201705001TA SG 11201705001T A SG11201705001T A SG 11201705001TA SG 11201705001T A SG11201705001T A SG 11201705001TA SG 11201705001T A SG11201705001T A SG 11201705001TA SG 11201705001T A SG11201705001T A SG 11201705001TA
- Authority
- SG
- Singapore
- Prior art keywords
- resin film
- forming resin
- sheet laminate
- laminate
- sheet
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014257128 | 2014-12-19 | ||
| PCT/JP2015/084790 WO2016098697A1 (en) | 2014-12-19 | 2015-12-11 | Sheet laminate for forming resin film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201705001TA true SG11201705001TA (en) | 2017-07-28 |
Family
ID=56126587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201705001TA SG11201705001TA (en) | 2014-12-19 | 2015-12-11 | Sheet laminate for forming resin film |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6574787B2 (en) |
| SG (1) | SG11201705001TA (en) |
| TW (1) | TWI667733B (en) |
| WO (1) | WO2016098697A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019065976A1 (en) | 2017-09-29 | 2019-04-04 | ナガセケムテックス株式会社 | Method for producing mounting structure, and layered sheet used in same |
| JP7475923B2 (en) | 2020-03-27 | 2024-04-30 | リンテック株式会社 | Sheet for manufacturing semiconductor device and method for manufacturing the sheet for manufacturing semiconductor device. |
| JP6827144B1 (en) * | 2020-11-12 | 2021-02-10 | リンテック株式会社 | Laminated body manufacturing method and laminated body manufacturing equipment |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009130320A (en) * | 2007-11-28 | 2009-06-11 | Furukawa Electric Co Ltd:The | Film for chip protection |
| TWI647295B (en) * | 2012-10-05 | 2019-01-11 | 日商琳得科股份有限公司 | Method for manufacturing cut sheet and wafer with protective film forming layer |
| CN105074878B (en) * | 2013-03-27 | 2017-08-04 | 琳得科株式会社 | Diaphragm formation composite sheet |
-
2015
- 2015-12-11 SG SG11201705001TA patent/SG11201705001TA/en unknown
- 2015-12-11 JP JP2016564827A patent/JP6574787B2/en active Active
- 2015-12-11 WO PCT/JP2015/084790 patent/WO2016098697A1/en active Application Filing
- 2015-12-16 TW TW104142222A patent/TWI667733B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| JP6574787B2 (en) | 2019-09-11 |
| JPWO2016098697A1 (en) | 2017-09-28 |
| WO2016098697A1 (en) | 2016-06-23 |
| TW201635422A (en) | 2016-10-01 |
| TWI667733B (en) | 2019-08-01 |
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