SG11201803250TA - First protective film forming sheet - Google Patents
First protective film forming sheetInfo
- Publication number
- SG11201803250TA SG11201803250TA SG11201803250TA SG11201803250TA SG11201803250TA SG 11201803250T A SG11201803250T A SG 11201803250TA SG 11201803250T A SG11201803250T A SG 11201803250TA SG 11201803250T A SG11201803250T A SG 11201803250TA SG 11201803250T A SG11201803250T A SG 11201803250TA
- Authority
- SG
- Singapore
- Prior art keywords
- protective film
- film forming
- forming sheet
- sheet
- protective
- Prior art date
Links
- 230000001681 protective effect Effects 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015217110 | 2015-11-04 | ||
PCT/JP2016/082543 WO2017078052A1 (en) | 2015-11-04 | 2016-11-02 | First protective film forming sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201803250TA true SG11201803250TA (en) | 2018-05-30 |
Family
ID=58661960
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201803250TA SG11201803250TA (en) | 2015-11-04 | 2016-11-02 | First protective film forming sheet |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP6230761B2 (en) |
KR (1) | KR102545393B1 (en) |
CN (1) | CN108140585B (en) |
PH (1) | PH12018500851B1 (en) |
SG (1) | SG11201803250TA (en) |
TW (1) | TWI704996B (en) |
WO (1) | WO2017078052A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019013589A1 (en) * | 2017-07-13 | 2019-01-17 | 두성산업 주식회사 | Magnetic tape for fixing semiconductor |
KR102529495B1 (en) * | 2017-10-27 | 2023-05-04 | 린텍 가부시키가이샤 | Manufacturing method of composite sheet for forming protective film and semiconductor chip |
CN111344850A (en) * | 2017-11-17 | 2020-06-26 | 琳得科株式会社 | Semiconductor chip with first protective film, method for manufacturing same, and method for evaluating semiconductor chip-first protective film laminate |
JP7129110B2 (en) * | 2018-10-02 | 2022-09-01 | リンテック株式会社 | Laminate and method for producing cured sealing body |
JP7266953B2 (en) * | 2019-08-07 | 2023-05-01 | 株式会社ディスコ | Protective member forming method and protective member forming apparatus |
JP7323734B1 (en) * | 2022-01-12 | 2023-08-08 | リンテック株式会社 | Sheet for forming first protective film, method for manufacturing semiconductor device, and use of sheet |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4170839B2 (en) | 2003-07-11 | 2008-10-22 | 日東電工株式会社 | Laminated sheet |
JP4443962B2 (en) * | 2004-03-17 | 2010-03-31 | 日東電工株式会社 | Dicing die bond film |
JP4776188B2 (en) * | 2004-08-03 | 2011-09-21 | 古河電気工業株式会社 | Semiconductor device manufacturing method and wafer processing tape |
JP2012074623A (en) * | 2010-09-29 | 2012-04-12 | Sekisui Chem Co Ltd | Adhesive film for processing semiconductor, and method of manufacturing semiconductor chip mounting body |
JP5666335B2 (en) * | 2011-02-15 | 2015-02-12 | 日東電工株式会社 | Protective layer forming film |
JP5830250B2 (en) * | 2011-02-15 | 2015-12-09 | 日東電工株式会社 | Manufacturing method of semiconductor device |
US9443750B2 (en) * | 2011-12-26 | 2016-09-13 | Lintec Corporation | Dicing sheet with protective film-forming layer, and method for producing chip |
JP5242830B1 (en) * | 2012-07-06 | 2013-07-24 | 古河電気工業株式会社 | Adhesive tape for protecting semiconductor wafer surface and method for producing semiconductor wafer |
CN104837942B (en) * | 2012-12-14 | 2017-04-26 | 琳得科株式会社 | Holding membrane forming film |
CN105074878B (en) * | 2013-03-27 | 2017-08-04 | 琳得科株式会社 | Diaphragm formation composite sheet |
JP5779260B2 (en) * | 2014-01-29 | 2015-09-16 | リンテック株式会社 | Protective film forming sheet for chip and manufacturing method of semiconductor chip with protective film |
-
2016
- 2016-11-02 JP JP2017536057A patent/JP6230761B2/en active Active
- 2016-11-02 CN CN201680061240.XA patent/CN108140585B/en active Active
- 2016-11-02 SG SG11201803250TA patent/SG11201803250TA/en unknown
- 2016-11-02 WO PCT/JP2016/082543 patent/WO2017078052A1/en active Application Filing
- 2016-11-02 TW TW105135523A patent/TWI704996B/en active
- 2016-11-02 KR KR1020187013196A patent/KR102545393B1/en active IP Right Grant
-
2018
- 2018-04-20 PH PH12018500851A patent/PH12018500851B1/en unknown
Also Published As
Publication number | Publication date |
---|---|
PH12018500851A1 (en) | 2018-11-05 |
JPWO2017078052A1 (en) | 2017-12-07 |
JP6230761B2 (en) | 2017-11-15 |
TW201738089A (en) | 2017-11-01 |
KR20180079340A (en) | 2018-07-10 |
PH12018500851B1 (en) | 2018-11-05 |
TWI704996B (en) | 2020-09-21 |
KR102545393B1 (en) | 2023-06-19 |
CN108140585A (en) | 2018-06-08 |
CN108140585B (en) | 2021-06-08 |
WO2017078052A1 (en) | 2017-05-11 |
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