Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/12—Mountings, e.g. non-detachable insulating substrates
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
  • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
  • H01L23/293—Organic, e.g. plastic
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
  • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
  • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
  • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
  • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Computer Hardware Design (AREA)
• Power Engineering (AREA)
• Adhesive Tapes (AREA)
• Laminated Bodies (AREA)
• Mechanical Treatment Of Semiconductor (AREA)
• Adhesives Or Adhesive Processes (AREA)
• Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
• Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=58661930

Family Applications (1)

Country Status (7)

Families Citing this family (2)

Family Cites Families (8)

• 2016
  • 2016-11-02 KR KR1020187013189A patent/KR102544368B1/en active IP Right Grant
  • 2016-11-02 JP JP2017548791A patent/JP6775517B2/en active Active
  • 2016-11-02 CN CN201680063564.7A patent/CN108352365B/en active Active
  • 2016-11-02 SG SG11201803247PA patent/SG11201803247PA/en unknown
  • 2016-11-02 TW TW105135527A patent/TWI745314B/en active
  • 2016-11-02 WO PCT/JP2016/082518 patent/WO2017078042A1/en active Application Filing
• 2018
  • 2018-04-20 PH PH12018500850A patent/PH12018500850B1/en unknown

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