PH12018500850B1 - Protective film forming sheet - Google Patents

Protective film forming sheet

Info

Publication number
PH12018500850B1
PH12018500850B1 PH12018500850A PH12018500850A PH12018500850B1 PH 12018500850 B1 PH12018500850 B1 PH 12018500850B1 PH 12018500850 A PH12018500850 A PH 12018500850A PH 12018500850 A PH12018500850 A PH 12018500850A PH 12018500850 B1 PH12018500850 B1 PH 12018500850B1
Authority
PH
Philippines
Prior art keywords
protective film
film forming
resin layer
thermosetting resin
forming sheet
Prior art date
Application number
PH12018500850A
Other versions
PH12018500850A1 (en
Inventor
Masanori Yamagishi
Akinori Sato
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of PH12018500850B1 publication Critical patent/PH12018500850B1/en
Publication of PH12018500850A1 publication Critical patent/PH12018500850A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection

Abstract

A protective film forming sheet (1) is formed by stacking a thermosetting resin layer (12) on a first supporting sheet (101), the thermosetting resin layer (12) is adhered to a surface having bumps of a semiconductor wafer and is cured by heat, whereby the first protective film is formed on the semiconductor wafer surface, and a difference between a surface free energy of a first supporting sheet (101) side surface of the thermosetting resin layer (12) before thermal curing and a surface free energy of a thermosetting resin layer (12) side surface of the first supporting sheet (101) is 10 mJ/m2 or more
PH12018500850A 2015-11-04 2018-04-20 Protective film forming sheet PH12018500850A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015217115 2015-11-04
PCT/JP2016/082518 WO2017078042A1 (en) 2015-11-04 2016-11-02 Protective film forming sheet

Publications (2)

Publication Number Publication Date
PH12018500850B1 true PH12018500850B1 (en) 2018-11-05
PH12018500850A1 PH12018500850A1 (en) 2018-11-05

Family

ID=58661930

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12018500850A PH12018500850A1 (en) 2015-11-04 2018-04-20 Protective film forming sheet

Country Status (7)

Country Link
JP (1) JP6775517B2 (en)
KR (1) KR102544368B1 (en)
CN (1) CN108352365B (en)
PH (1) PH12018500850A1 (en)
SG (1) SG11201803247PA (en)
TW (1) TWI745314B (en)
WO (1) WO2017078042A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019098326A1 (en) * 2017-11-17 2019-05-23 リンテック株式会社 Semiconductor chip with first protective film, method for manufacturing semiconductor chip with first protective film, and method for evaluating laminate of semiconductor chip and first protective film
JP7268344B2 (en) * 2018-12-17 2023-05-08 東亞合成株式会社 Optical molding kit and method for manufacturing molded member

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004200394A (en) * 2002-12-18 2004-07-15 Nitto Denko Corp Manufacturing method of semiconductor device
JP4170839B2 (en) 2003-07-11 2008-10-22 日東電工株式会社 Laminated sheet
JP5666335B2 (en) * 2011-02-15 2015-02-12 日東電工株式会社 Protective layer forming film
JP4865926B1 (en) * 2011-06-24 2012-02-01 古河電気工業株式会社 Wafer processing tape
CN103896595A (en) * 2012-12-26 2014-07-02 株式会社村田制作所 Ceramic raw piece and manufacturing method
WO2014137801A1 (en) * 2013-03-03 2014-09-12 John Moore Temporary adhesive with tunable adhesion force sufficient for processing thin solid materials
JP6347657B2 (en) * 2014-04-22 2018-06-27 デクセリアルズ株式会社 Protective tape and method of manufacturing semiconductor device using the same
JP6272729B2 (en) * 2014-05-16 2018-01-31 日東電工株式会社 Dicing tape-integrated film for semiconductor back surface and method for manufacturing semiconductor device

Also Published As

Publication number Publication date
TW201727843A (en) 2017-08-01
KR102544368B1 (en) 2023-06-15
CN108352365A (en) 2018-07-31
CN108352365B (en) 2021-08-10
JP6775517B2 (en) 2020-10-28
KR20180079337A (en) 2018-07-10
SG11201803247PA (en) 2018-05-30
PH12018500850A1 (en) 2018-11-05
JPWO2017078042A1 (en) 2018-08-30
WO2017078042A1 (en) 2017-05-11
TWI745314B (en) 2021-11-11

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