PH12018500799A1 - Thermosetting resin film, first protectivefilm forming sheet, and method for forming first protective film - Google Patents
Thermosetting resin film, first protectivefilm forming sheet, and method for forming first protective filmInfo
- Publication number
- PH12018500799A1 PH12018500799A1 PH12018500799A PH12018500799A PH12018500799A1 PH 12018500799 A1 PH12018500799 A1 PH 12018500799A1 PH 12018500799 A PH12018500799 A PH 12018500799A PH 12018500799 A PH12018500799 A PH 12018500799A PH 12018500799 A1 PH12018500799 A1 PH 12018500799A1
- Authority
- PH
- Philippines
- Prior art keywords
- thermosetting resin
- forming
- resin film
- protective film
- protectivefilm
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
A thermosetting resin film for forming a first protective film on a surface having a bump of a semiconductor wafer by being attached to the surface and being thermally cured, in which when the thermosetting resin film before curing is heated at a raising temperature speed of 10øC/min, a time during which a viscosity at a shear rate of 1 sú1 is equal to or lower than 100,000 Paús is equal to or longer than 500 seconds. The first protective film forming sheet is provided with the first supporting sheet, and the thermosetting resin film is provided on one surface of the first supporting sheet. A first protective film is formed by thermally curing the thermosetting resin film while pressurizing at a pressure of equal to or greater than 0.1 Pa.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015217117 | 2015-11-04 | ||
PCT/JP2016/082514 WO2017078039A1 (en) | 2015-11-04 | 2016-11-02 | Thermosetting resin film, first protective film forming sheet, and method for forming first protective film |
Publications (1)
Publication Number | Publication Date |
---|---|
PH12018500799A1 true PH12018500799A1 (en) | 2018-10-29 |
Family
ID=58661932
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PH12018500799A PH12018500799A1 (en) | 2015-11-04 | 2018-04-13 | Thermosetting resin film, first protectivefilm forming sheet, and method for forming first protective film |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP6381828B2 (en) |
KR (1) | KR102534927B1 (en) |
CN (1) | CN108140586A (en) |
PH (1) | PH12018500799A1 (en) |
SG (1) | SG11201803082SA (en) |
TW (1) | TWI761317B (en) |
WO (1) | WO2017078039A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7233377B2 (en) * | 2017-11-17 | 2023-03-06 | リンテック株式会社 | Thermosetting resin film and sheet for forming first protective film |
TWI692816B (en) * | 2019-05-22 | 2020-05-01 | 友達光電股份有限公司 | Display device and method for manufacturing the same |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004200195A (en) * | 2002-12-16 | 2004-07-15 | Seiko Epson Corp | Semiconductor device and its fabricating process |
JP4170839B2 (en) | 2003-07-11 | 2008-10-22 | 日東電工株式会社 | Laminated sheet |
JP2005229044A (en) * | 2004-02-16 | 2005-08-25 | Seiko Epson Corp | Electronic component, manufacturing method thereof, and electronic equipment |
JP4303705B2 (en) * | 2004-09-02 | 2009-07-29 | 住友ベークライト株式会社 | Adhesive film for semiconductor and semiconductor device using the same |
JP4179312B2 (en) * | 2004-09-15 | 2008-11-12 | セイコーエプソン株式会社 | Semiconductor device mounting method, semiconductor device |
JP2006253277A (en) * | 2005-03-09 | 2006-09-21 | Matsushita Electric Ind Co Ltd | Semiconductor device for module, module using the same, and module manufacturing method |
JP4380684B2 (en) * | 2006-10-20 | 2009-12-09 | 住友ベークライト株式会社 | Adhesive film for semiconductor, dicing film and semiconductor device |
WO2011033743A1 (en) * | 2009-09-16 | 2011-03-24 | 住友ベークライト株式会社 | Adhesive film, multilayer circuit board, electronic component, and semiconductor device |
CN102842541A (en) * | 2011-06-22 | 2012-12-26 | 日东电工株式会社 | Laminated film and use thereof |
JP2013062328A (en) * | 2011-09-12 | 2013-04-04 | Toshiba Corp | Semiconductor device |
TWI443761B (en) * | 2011-09-14 | 2014-07-01 | Manufacturing method for flip chip packaging | |
TWI600701B (en) * | 2012-07-19 | 2017-10-01 | Nagase Chemtex Corp | A semiconductor sealing epoxy resin composition and a method of manufacturing the semiconductor device |
JP2014019813A (en) * | 2012-07-20 | 2014-02-03 | Sumitomo Bakelite Co Ltd | Thermosetting resin composition, adhesive film, dicing tape integrated adhesive film, semiconductor device, multilayer circuit board and electronic component |
JP5735029B2 (en) * | 2013-03-28 | 2015-06-17 | 日東電工株式会社 | Resin sheet for sealing electronic device and method for manufacturing electronic device package |
-
2016
- 2016-10-28 TW TW105135054A patent/TWI761317B/en active
- 2016-11-02 WO PCT/JP2016/082514 patent/WO2017078039A1/en active Application Filing
- 2016-11-02 CN CN201680061246.7A patent/CN108140586A/en active Pending
- 2016-11-02 KR KR1020187011892A patent/KR102534927B1/en active IP Right Grant
- 2016-11-02 JP JP2017548788A patent/JP6381828B2/en active Active
- 2016-11-02 SG SG11201803082SA patent/SG11201803082SA/en unknown
-
2018
- 2018-04-13 PH PH12018500799A patent/PH12018500799A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR102534927B1 (en) | 2023-05-19 |
KR20180080206A (en) | 2018-07-11 |
TWI761317B (en) | 2022-04-21 |
TW201728636A (en) | 2017-08-16 |
SG11201803082SA (en) | 2018-05-30 |
JP6381828B2 (en) | 2018-08-29 |
JPWO2017078039A1 (en) | 2018-02-15 |
CN108140586A (en) | 2018-06-08 |
WO2017078039A1 (en) | 2017-05-11 |
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