PH12018500799A1 - Thermosetting resin film, first protectivefilm forming sheet, and method for forming first protective film - Google Patents

Thermosetting resin film, first protectivefilm forming sheet, and method for forming first protective film

Info

Publication number
PH12018500799A1
PH12018500799A1 PH12018500799A PH12018500799A PH12018500799A1 PH 12018500799 A1 PH12018500799 A1 PH 12018500799A1 PH 12018500799 A PH12018500799 A PH 12018500799A PH 12018500799 A PH12018500799 A PH 12018500799A PH 12018500799 A1 PH12018500799 A1 PH 12018500799A1
Authority
PH
Philippines
Prior art keywords
thermosetting resin
forming
resin film
protective film
protectivefilm
Prior art date
Application number
PH12018500799A
Inventor
Masanori Yamagishi
Akinori Sato
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of PH12018500799A1 publication Critical patent/PH12018500799A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

A thermosetting resin film for forming a first protective film on a surface having a bump of a semiconductor wafer by being attached to the surface and being thermally cured, in which when the thermosetting resin film before curing is heated at a raising temperature speed of 10øC/min, a time during which a viscosity at a shear rate of 1 sú1 is equal to or lower than 100,000 Paús is equal to or longer than 500 seconds. The first protective film forming sheet is provided with the first supporting sheet, and the thermosetting resin film is provided on one surface of the first supporting sheet. A first protective film is formed by thermally curing the thermosetting resin film while pressurizing at a pressure of equal to or greater than 0.1 Pa.
PH12018500799A 2015-11-04 2018-04-13 Thermosetting resin film, first protectivefilm forming sheet, and method for forming first protective film PH12018500799A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015217117 2015-11-04
PCT/JP2016/082514 WO2017078039A1 (en) 2015-11-04 2016-11-02 Thermosetting resin film, first protective film forming sheet, and method for forming first protective film

Publications (1)

Publication Number Publication Date
PH12018500799A1 true PH12018500799A1 (en) 2018-10-29

Family

ID=58661932

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12018500799A PH12018500799A1 (en) 2015-11-04 2018-04-13 Thermosetting resin film, first protectivefilm forming sheet, and method for forming first protective film

Country Status (7)

Country Link
JP (1) JP6381828B2 (en)
KR (1) KR102534927B1 (en)
CN (1) CN108140586A (en)
PH (1) PH12018500799A1 (en)
SG (1) SG11201803082SA (en)
TW (1) TWI761317B (en)
WO (1) WO2017078039A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7233377B2 (en) * 2017-11-17 2023-03-06 リンテック株式会社 Thermosetting resin film and sheet for forming first protective film
TWI692816B (en) 2019-05-22 2020-05-01 友達光電股份有限公司 Display device and method for manufacturing the same

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004200195A (en) * 2002-12-16 2004-07-15 Seiko Epson Corp Semiconductor device and its fabricating process
JP4170839B2 (en) 2003-07-11 2008-10-22 日東電工株式会社 Laminated sheet
JP2005229044A (en) * 2004-02-16 2005-08-25 Seiko Epson Corp Electronic component, manufacturing method thereof, and electronic equipment
JP4303705B2 (en) * 2004-09-02 2009-07-29 住友ベークライト株式会社 Adhesive film for semiconductor and semiconductor device using the same
JP4179312B2 (en) * 2004-09-15 2008-11-12 セイコーエプソン株式会社 Semiconductor device mounting method, semiconductor device
JP2006253277A (en) * 2005-03-09 2006-09-21 Matsushita Electric Ind Co Ltd Semiconductor device for module, module using the same, and module manufacturing method
JP4380684B2 (en) * 2006-10-20 2009-12-09 住友ベークライト株式会社 Adhesive film for semiconductor, dicing film and semiconductor device
US20120156502A1 (en) * 2009-09-16 2012-06-21 Sumitomo Bakelite Co., Ltd. Adhesive film, multilayer circuit board, electronic component and semiconductor device
CN102842541A (en) * 2011-06-22 2012-12-26 日东电工株式会社 Laminated film and use thereof
JP2013062328A (en) * 2011-09-12 2013-04-04 Toshiba Corp Semiconductor device
TWI443761B (en) * 2011-09-14 2014-07-01 Manufacturing method for flip chip packaging
TWI600701B (en) * 2012-07-19 2017-10-01 Nagase Chemtex Corp A semiconductor sealing epoxy resin composition and a method of manufacturing the semiconductor device
JP2014019813A (en) * 2012-07-20 2014-02-03 Sumitomo Bakelite Co Ltd Thermosetting resin composition, adhesive film, dicing tape integrated adhesive film, semiconductor device, multilayer circuit board and electronic component
JP5735029B2 (en) * 2013-03-28 2015-06-17 日東電工株式会社 Resin sheet for sealing electronic device and method for manufacturing electronic device package

Also Published As

Publication number Publication date
KR102534927B1 (en) 2023-05-19
JP6381828B2 (en) 2018-08-29
SG11201803082SA (en) 2018-05-30
TWI761317B (en) 2022-04-21
KR20180080206A (en) 2018-07-11
WO2017078039A1 (en) 2017-05-11
TW201728636A (en) 2017-08-16
CN108140586A (en) 2018-06-08
JPWO2017078039A1 (en) 2018-02-15

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