PH12017500285B1 - Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating - Google Patents

Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating

Info

Publication number
PH12017500285B1
PH12017500285B1 PH12017500285A PH12017500285A PH12017500285B1 PH 12017500285 B1 PH12017500285 B1 PH 12017500285B1 PH 12017500285 A PH12017500285 A PH 12017500285A PH 12017500285 A PH12017500285 A PH 12017500285A PH 12017500285 B1 PH12017500285 B1 PH 12017500285B1
Authority
PH
Philippines
Prior art keywords
protective coating
forming sheet
semiconductor chip
manufacturing semiconductor
chip provided
Prior art date
Application number
PH12017500285A
Other versions
PH12017500285A1 (en
Inventor
Daisuke Yamamoto
Naoya Saiki
Hiroyuki Yoneyama
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of PH12017500285A1 publication Critical patent/PH12017500285A1/en
Publication of PH12017500285B1 publication Critical patent/PH12017500285B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Abstract

A protective coating-forming sheet having a first support sheet and a protective coating formation film laminated to a first surface side of the first support sheet, wherein the protective coating formation film is formed from a curable material, and the protective coating formation film has the following characteristics: namely, when the protective coating formation film is cured to form a protective coating, the protective coating has a breaking strain at 50øC of not more than 20 pcnt , and a loss tangent peak temperature T1 within a range from 25øC to 60øC.
PH12017500285A 2014-08-22 2017-02-16 Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating PH12017500285B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014169266 2014-08-22
JP2014169267 2014-08-22
PCT/JP2015/073503 WO2016027883A1 (en) 2014-08-22 2015-08-21 Protective-coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating

Publications (2)

Publication Number Publication Date
PH12017500285A1 PH12017500285A1 (en) 2017-06-28
PH12017500285B1 true PH12017500285B1 (en) 2017-06-28

Family

ID=55350823

Family Applications (2)

Application Number Title Priority Date Filing Date
PH12017500285A PH12017500285B1 (en) 2014-08-22 2017-02-16 Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating
PH12017500284A PH12017500284B1 (en) 2014-08-22 2017-02-16 Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating

Family Applications After (1)

Application Number Title Priority Date Filing Date
PH12017500284A PH12017500284B1 (en) 2014-08-22 2017-02-16 Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating

Country Status (8)

Country Link
JP (2) JP6589209B2 (en)
KR (2) KR102368140B1 (en)
CN (2) CN106660333B (en)
MY (2) MY186759A (en)
PH (2) PH12017500285B1 (en)
SG (2) SG11201701270QA (en)
TW (4) TWI668290B (en)
WO (2) WO2016027883A1 (en)

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WO2017073627A1 (en) * 2015-10-29 2017-05-04 リンテック株式会社 Film for protective film formation and composite sheet for protective film formation
JP6573841B2 (en) * 2016-03-04 2019-09-11 リンテック株式会社 Semiconductor processing sheet
JP6805230B2 (en) * 2016-03-04 2020-12-23 リンテック株式会社 Composite sheet for forming a protective film
WO2017149925A1 (en) * 2016-03-04 2017-09-08 リンテック株式会社 Semiconductor processing sheet
JP7008620B2 (en) * 2016-03-04 2022-01-25 リンテック株式会社 Sheet for semiconductor processing
JP6833804B2 (en) * 2016-03-04 2021-02-24 リンテック株式会社 Composite sheet for forming a protective film
JP6617056B2 (en) * 2016-03-04 2019-12-04 リンテック株式会社 Semiconductor processing sheet, winding body thereof, and method for manufacturing the winding body
TWI778960B (en) * 2016-04-28 2022-10-01 日商琳得科股份有限公司 Film for forming protective film, composite sheet for forming protective film, and method of manufacturing semiconductor chip having protective film
TWI796297B (en) * 2016-04-28 2023-03-21 日商琳得科股份有限公司 Composite sheet for forming protective film
TWI721158B (en) * 2016-04-28 2021-03-11 日商琳得科股份有限公司 Protective film forming film and composite sheet for forming protective film
CN109071845A (en) * 2016-04-28 2018-12-21 琳得科株式会社 Protective film formation film and protective film formation composite sheet
TWI731964B (en) * 2016-04-28 2021-07-01 日商琳得科股份有限公司 Complex sheet for forming protective film
JP6278164B1 (en) * 2016-05-12 2018-02-14 住友ベークライト株式会社 Adhesive tape for semiconductor substrate processing
JP6776081B2 (en) * 2016-09-28 2020-10-28 リンテック株式会社 Manufacturing method of semiconductor chip with protective film and manufacturing method of semiconductor device
TWI765038B (en) * 2017-05-17 2022-05-21 日商琳得科股份有限公司 Semiconductor device and method for manufacturing same
JP7107946B2 (en) * 2017-08-28 2022-07-27 リンテック株式会社 infrared sensor module
WO2019146607A1 (en) * 2018-01-24 2019-08-01 リンテック株式会社 Long laminated sheet, and winding body thereof
KR102487552B1 (en) 2018-02-05 2023-01-11 삼성전자주식회사 Composition for protective film against sawing process and method of manufacturing semiconductor package using the composition
CN111670231B (en) * 2018-03-23 2022-06-03 琳得科株式会社 Film-like adhesive and sheet for semiconductor processing
WO2019187014A1 (en) * 2018-03-30 2019-10-03 リンテック株式会社 Support sheet and composite sheet for protective film formation
CN111466014B (en) * 2018-03-30 2024-01-02 琳得科株式会社 Composite sheet for forming protective film and method for producing same
WO2020218519A1 (en) * 2019-04-26 2020-10-29 リンテック株式会社 Method for producing three-layer body, method for producing four-layer body, method for producing semiconductor device equipped with rear surface protective film, and three-layer body
JP7453879B2 (en) 2020-08-12 2024-03-21 リンテック株式会社 Protective film forming sheet roll and protective film forming sheet roll manufacturing method
JP7084972B2 (en) * 2020-10-06 2022-06-15 リンテック株式会社 Composite sheet for forming a protective film

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US20030190466A1 (en) * 2002-04-03 2003-10-09 Katsuji Nakaba Adhesive sheet for producing semiconductor devices
JP3857953B2 (en) * 2002-05-16 2006-12-13 株式会社巴川製紙所 Adhesive sheet for semiconductor device manufacturing
JP4364508B2 (en) * 2002-12-27 2009-11-18 リンテック株式会社 Protective film forming sheet for chip back surface and manufacturing method of chip with protective film
KR101215728B1 (en) * 2003-06-06 2012-12-26 히다치 가세고교 가부시끼가이샤 Semiconductor device producing method
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JP2011151362A (en) 2009-12-24 2011-08-04 Nitto Denko Corp Dicing tape-integrated film for semiconductor back surface
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JP5865045B2 (en) * 2011-12-07 2016-02-17 リンテック株式会社 Dicing sheet with protective film forming layer and chip manufacturing method
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Also Published As

Publication number Publication date
KR102368140B1 (en) 2022-02-25
KR20170044652A (en) 2017-04-25
CN106660332B (en) 2020-08-07
WO2016027888A1 (en) 2016-02-25
KR102376017B1 (en) 2022-03-17
TWI706023B (en) 2020-10-01
TWI712670B (en) 2020-12-11
PH12017500284A1 (en) 2017-07-03
TW201614024A (en) 2016-04-16
MY182846A (en) 2021-02-05
CN106660332A (en) 2017-05-10
PH12017500285A1 (en) 2017-06-28
TW201938728A (en) 2019-10-01
TWI672354B (en) 2019-09-21
PH12017500284B1 (en) 2017-07-03
SG11201701270QA (en) 2017-03-30
TW201940622A (en) 2019-10-16
JPWO2016027883A1 (en) 2017-06-01
TW201614023A (en) 2016-04-16
TWI668290B (en) 2019-08-11
JPWO2016027888A1 (en) 2017-06-01
MY186759A (en) 2021-08-18
CN106660333A (en) 2017-05-10
WO2016027883A1 (en) 2016-02-25
CN106660333B (en) 2018-11-06
KR20170044108A (en) 2017-04-24
SG11201701272UA (en) 2017-04-27
JP6589209B2 (en) 2019-10-16

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