PH12017500285A1 - Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating - Google Patents
Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coatingInfo
- Publication number
- PH12017500285A1 PH12017500285A1 PH12017500285A PH12017500285A PH12017500285A1 PH 12017500285 A1 PH12017500285 A1 PH 12017500285A1 PH 12017500285 A PH12017500285 A PH 12017500285A PH 12017500285 A PH12017500285 A PH 12017500285A PH 12017500285 A1 PH12017500285 A1 PH 12017500285A1
- Authority
- PH
- Philippines
- Prior art keywords
- protective coating
- protective
- coating
- forming sheet
- semiconductor chip
- Prior art date
Links
- 239000011253 protective coating Substances 0.000 title abstract 7
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 230000001681 protective effect Effects 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 230000015572 biosynthetic process Effects 0.000 abstract 4
- 101100243022 Mus musculus Pcnt gene Proteins 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Dicing (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Laminated Bodies (AREA)
- Laser Beam Processing (AREA)
- Formation Of Insulating Films (AREA)
- Adhesive Tapes (AREA)
- Paints Or Removers (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
A protective-coating-forming sheet (3) provided with a first support sheet (4) and a protective-coating formation film (1) layered on a first surface side of the first support sheet (4), the protective-coating formation film (1) comprising a curable material, and the protective-coating formation film (1) having the following characteristics: when the protective-coating formation film (1) is cured and a protective coating is obtained, the breaking strain of the protective coating at 50oC is 20 pcnt or less, and the loss tangent peak temperature T1 thereof is 25oC to 60oC.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014169266 | 2014-08-22 | ||
JP2014169267 | 2014-08-22 | ||
PCT/JP2015/073503 WO2016027883A1 (en) | 2014-08-22 | 2015-08-21 | Protective-coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating |
Publications (2)
Publication Number | Publication Date |
---|---|
PH12017500285A1 true PH12017500285A1 (en) | 2017-06-28 |
PH12017500285B1 PH12017500285B1 (en) | 2017-06-28 |
Family
ID=55350823
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PH12017500284A PH12017500284A1 (en) | 2014-08-22 | 2017-02-16 | Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating |
PH12017500285A PH12017500285B1 (en) | 2014-08-22 | 2017-02-16 | Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PH12017500284A PH12017500284A1 (en) | 2014-08-22 | 2017-02-16 | Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating |
Country Status (8)
Country | Link |
---|---|
JP (2) | JPWO2016027888A1 (en) |
KR (2) | KR102368140B1 (en) |
CN (2) | CN106660333B (en) |
MY (2) | MY186759A (en) |
PH (2) | PH12017500284A1 (en) |
SG (2) | SG11201701270QA (en) |
TW (4) | TWI712670B (en) |
WO (2) | WO2016027883A1 (en) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017073627A1 (en) * | 2015-10-29 | 2017-05-04 | リンテック株式会社 | Film for protective film formation and composite sheet for protective film formation |
JP6617056B2 (en) * | 2016-03-04 | 2019-12-04 | リンテック株式会社 | Semiconductor processing sheet, winding body thereof, and method for manufacturing the winding body |
JP6833804B2 (en) * | 2016-03-04 | 2021-02-24 | リンテック株式会社 | Composite sheet for forming a protective film |
KR20180122316A (en) * | 2016-03-04 | 2018-11-12 | 린텍 가부시키가이샤 | Semiconductor processing sheet |
JP6573841B2 (en) * | 2016-03-04 | 2019-09-11 | リンテック株式会社 | Semiconductor processing sheet |
CN108243616B (en) * | 2016-03-04 | 2022-10-28 | 琳得科株式会社 | Semiconductor processing sheet |
JP6805230B2 (en) * | 2016-03-04 | 2020-12-23 | リンテック株式会社 | Composite sheet for forming a protective film |
TWI778960B (en) * | 2016-04-28 | 2022-10-01 | 日商琳得科股份有限公司 | Film for forming protective film, composite sheet for forming protective film, and method of manufacturing semiconductor chip having protective film |
KR102407322B1 (en) * | 2016-04-28 | 2022-06-10 | 린텍 가부시키가이샤 | A film for forming a protective film and a composite sheet for forming a protective film |
TWI721158B (en) * | 2016-04-28 | 2021-03-11 | 日商琳得科股份有限公司 | Protective film forming film and composite sheet for forming protective film |
TWI731964B (en) * | 2016-04-28 | 2021-07-01 | 日商琳得科股份有限公司 | Complex sheet for forming protective film |
TWI796297B (en) * | 2016-04-28 | 2023-03-21 | 日商琳得科股份有限公司 | Composite sheet for forming protective film |
WO2017195711A1 (en) * | 2016-05-12 | 2017-11-16 | 住友ベークライト株式会社 | Adhesive tape for processing semiconductor substrates |
JP6776081B2 (en) * | 2016-09-28 | 2020-10-28 | リンテック株式会社 | Manufacturing method of semiconductor chip with protective film and manufacturing method of semiconductor device |
JP6438181B1 (en) * | 2017-05-17 | 2018-12-12 | リンテック株式会社 | Semiconductor device and manufacturing method thereof |
WO2019044046A1 (en) * | 2017-08-28 | 2019-03-07 | リンテック株式会社 | Film-like transparent adhesive and infrared sensor module |
JP7402052B2 (en) * | 2018-01-24 | 2023-12-20 | リンテック株式会社 | Long laminated sheets and their rolls |
KR102487552B1 (en) | 2018-02-05 | 2023-01-11 | 삼성전자주식회사 | Composition for protective film against sawing process and method of manufacturing semiconductor package using the composition |
KR102637855B1 (en) * | 2018-03-23 | 2024-02-16 | 린텍 가부시키가이샤 | Film-like adhesives and sheets for semiconductor processing |
WO2019187010A1 (en) * | 2018-03-30 | 2019-10-03 | リンテック株式会社 | Composite sheet for protective film formation and method for producing same |
KR102467148B1 (en) * | 2018-03-30 | 2022-11-14 | 린텍 가부시키가이샤 | Composite sheet for forming support sheet and protective film |
WO2020218519A1 (en) * | 2019-04-26 | 2020-10-29 | リンテック株式会社 | Method for producing three-layer body, method for producing four-layer body, method for producing semiconductor device equipped with rear surface protective film, and three-layer body |
JP7453879B2 (en) | 2020-08-12 | 2024-03-21 | リンテック株式会社 | Protective film forming sheet roll and protective film forming sheet roll manufacturing method |
JP7484557B2 (en) | 2020-08-18 | 2024-05-16 | 三菱ケミカル株式会社 | Adhesive composition, adhesive sheet and laminate |
JP7084972B2 (en) * | 2020-10-06 | 2022-06-15 | リンテック株式会社 | Composite sheet for forming a protective film |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100485902C (en) | 2002-03-12 | 2009-05-06 | 浜松光子学株式会社 | Substrate dividing method |
TWI289155B (en) * | 2002-04-03 | 2007-11-01 | Tomoegawa Paper Co Ltd | Adhesive sheet for producing semiconductor devices |
JP3857953B2 (en) * | 2002-05-16 | 2006-12-13 | 株式会社巴川製紙所 | Adhesive sheet for semiconductor device manufacturing |
JP4364508B2 (en) * | 2002-12-27 | 2009-11-18 | リンテック株式会社 | Protective film forming sheet for chip back surface and manufacturing method of chip with protective film |
TWI318649B (en) * | 2003-06-06 | 2009-12-21 | Hitachi Chemical Co Ltd | Sticking sheep, connecting sheet unified with dicing tape,and fabricating method of semiconductor device |
DE602004026875D1 (en) * | 2003-07-08 | 2010-06-10 | Lintec Corp | HARDENABLE SELF-ADHESIVE FILM FOR DISCONNECTING OR BZW. CHIP BONDING AND METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT |
JP4846406B2 (en) * | 2006-03-28 | 2011-12-28 | リンテック株式会社 | Chip protection film forming sheet |
KR101258920B1 (en) * | 2008-11-27 | 2013-04-29 | 듀폰-미츠이 폴리케미칼 가부시키가이샤 | Protective film for electronic component, manufacturing method therefor, and use thereof |
JP5335483B2 (en) * | 2009-02-27 | 2013-11-06 | リンテック株式会社 | Method for producing polarizing plate with adhesive layer |
JP5603757B2 (en) * | 2009-12-04 | 2014-10-08 | リンテック株式会社 | Laser dicing adhesive sheet and method for manufacturing semiconductor device |
JP2011151362A (en) | 2009-12-24 | 2011-08-04 | Nitto Denko Corp | Dicing tape-integrated film for semiconductor back surface |
JP2012033637A (en) | 2010-07-29 | 2012-02-16 | Nitto Denko Corp | Dicing tape integrated semiconductor rear face film, and method of manufacturing semiconductor device |
JP5580701B2 (en) * | 2010-09-13 | 2014-08-27 | 日東電工株式会社 | Dicing die bond film |
KR101649020B1 (en) * | 2011-07-01 | 2016-08-17 | 후루카와 덴키 고교 가부시키가이샤 | Adhesive film, and dicing/die bonding film and method for processing semiconductor using said dicing/die bonding film |
JP5865045B2 (en) * | 2011-12-07 | 2016-02-17 | リンテック株式会社 | Dicing sheet with protective film forming layer and chip manufacturing method |
JP6001273B2 (en) * | 2012-02-13 | 2016-10-05 | 信越化学工業株式会社 | Protective film for semiconductor wafer and method for manufacturing semiconductor chip |
US10086594B2 (en) * | 2012-05-14 | 2018-10-02 | Lintec Corporation | Sheet having adhesive resin layer attached thereto, and method for producing semiconductor device |
WO2014083872A1 (en) * | 2012-11-30 | 2014-06-05 | リンテック株式会社 | Sheet for forming resin film for chips and method for manufacturing semiconductor device |
KR102221484B1 (en) * | 2014-03-24 | 2021-02-26 | 린텍 가부시키가이샤 | Protective film forming film, protective film forming sheet and work product manufacturing method |
SG11201607716PA (en) * | 2014-03-24 | 2016-11-29 | Lintec Corp | Protection membrane forming film, protection membrane forming utilization sheet, production method and inspection method for workpiece or processed product, workpiece determined as adequate product, and processed product determined as adequate product |
-
2015
- 2015-08-21 TW TW108128902A patent/TWI712670B/en active
- 2015-08-21 WO PCT/JP2015/073503 patent/WO2016027883A1/en active Application Filing
- 2015-08-21 MY MYPI2017700515A patent/MY186759A/en unknown
- 2015-08-21 CN CN201580044562.9A patent/CN106660333B/en active Active
- 2015-08-21 KR KR1020177004497A patent/KR102368140B1/en active IP Right Grant
- 2015-08-21 SG SG11201701270QA patent/SG11201701270QA/en unknown
- 2015-08-21 TW TW104127316A patent/TWI672354B/en active
- 2015-08-21 TW TW108122914A patent/TWI706023B/en active
- 2015-08-21 TW TW104127314A patent/TWI668290B/en active
- 2015-08-21 JP JP2016544268A patent/JPWO2016027888A1/en active Pending
- 2015-08-21 JP JP2016544263A patent/JP6589209B2/en active Active
- 2015-08-21 SG SG11201701272UA patent/SG11201701272UA/en unknown
- 2015-08-21 MY MYPI2017700479A patent/MY182846A/en unknown
- 2015-08-21 CN CN201580044561.4A patent/CN106660332B/en active Active
- 2015-08-21 KR KR1020177004494A patent/KR102376017B1/en active IP Right Grant
- 2015-08-21 WO PCT/JP2015/073545 patent/WO2016027888A1/en active Application Filing
-
2017
- 2017-02-16 PH PH12017500284A patent/PH12017500284A1/en unknown
- 2017-02-16 PH PH12017500285A patent/PH12017500285B1/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR102376017B1 (en) | 2022-03-17 |
TW201940622A (en) | 2019-10-16 |
TWI672354B (en) | 2019-09-21 |
TW201614024A (en) | 2016-04-16 |
JP6589209B2 (en) | 2019-10-16 |
TWI712670B (en) | 2020-12-11 |
CN106660332B (en) | 2020-08-07 |
WO2016027888A1 (en) | 2016-02-25 |
SG11201701272UA (en) | 2017-04-27 |
CN106660333B (en) | 2018-11-06 |
MY182846A (en) | 2021-02-05 |
CN106660333A (en) | 2017-05-10 |
SG11201701270QA (en) | 2017-03-30 |
CN106660332A (en) | 2017-05-10 |
TWI668290B (en) | 2019-08-11 |
PH12017500285B1 (en) | 2017-06-28 |
WO2016027883A1 (en) | 2016-02-25 |
TW201614023A (en) | 2016-04-16 |
PH12017500284B1 (en) | 2017-07-03 |
KR20170044108A (en) | 2017-04-24 |
MY186759A (en) | 2021-08-18 |
PH12017500284A1 (en) | 2017-07-03 |
JPWO2016027883A1 (en) | 2017-06-01 |
TWI706023B (en) | 2020-10-01 |
KR102368140B1 (en) | 2022-02-25 |
JPWO2016027888A1 (en) | 2017-06-01 |
KR20170044652A (en) | 2017-04-25 |
TW201938728A (en) | 2019-10-01 |
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