MY186759A - Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating - Google Patents

Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating

Info

Publication number
MY186759A
MY186759A MYPI2017700515A MYPI2017700515A MY186759A MY 186759 A MY186759 A MY 186759A MY PI2017700515 A MYPI2017700515 A MY PI2017700515A MY PI2017700515 A MYPI2017700515 A MY PI2017700515A MY 186759 A MY186759 A MY 186759A
Authority
MY
Malaysia
Prior art keywords
protective coating
forming sheet
semiconductor chip
manufacturing semiconductor
chip provided
Prior art date
Application number
MYPI2017700515A
Inventor
Daisuke Yamamoto
Naoya Saiki
Hiroyuki Yoneyama
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of MY186759A publication Critical patent/MY186759A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laminated Bodies (AREA)
  • Laser Beam Processing (AREA)
  • Adhesive Tapes (AREA)
  • Paints Or Removers (AREA)
  • Formation Of Insulating Films (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

A protective coating-forming sheet (3, 3A, 3B) having a first support sheet (4) and a protective coating formation film (1) laminated to a first surface side of the first support sheet, wherein the protective coating formation film is formed from a curable material, and the protective coating formation film has the following characteristics: namely, when the protective coating formation film is cured to form a protective coating, the protective coating has a breaking strain at 50?C of not more than 20%, and a loss tangent peak temperature T1 within a range from 25?C to 60?C.
MYPI2017700515A 2014-08-22 2015-08-21 Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating MY186759A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014169266 2014-08-22
JP2014169267 2014-08-22
PCT/JP2015/073503 WO2016027883A1 (en) 2014-08-22 2015-08-21 Protective-coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating

Publications (1)

Publication Number Publication Date
MY186759A true MY186759A (en) 2021-08-18

Family

ID=55350823

Family Applications (2)

Application Number Title Priority Date Filing Date
MYPI2017700515A MY186759A (en) 2014-08-22 2015-08-21 Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating
MYPI2017700479A MY182846A (en) 2014-08-22 2015-08-21 Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating

Family Applications After (1)

Application Number Title Priority Date Filing Date
MYPI2017700479A MY182846A (en) 2014-08-22 2015-08-21 Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating

Country Status (8)

Country Link
JP (2) JPWO2016027888A1 (en)
KR (2) KR102368140B1 (en)
CN (2) CN106660333B (en)
MY (2) MY186759A (en)
PH (2) PH12017500284A1 (en)
SG (2) SG11201701272UA (en)
TW (4) TWI668290B (en)
WO (2) WO2016027883A1 (en)

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WO2017073627A1 (en) * 2015-10-29 2017-05-04 リンテック株式会社 Film for protective film formation and composite sheet for protective film formation
JP6617056B2 (en) * 2016-03-04 2019-12-04 リンテック株式会社 Semiconductor processing sheet, winding body thereof, and method for manufacturing the winding body
CN108271381B (en) * 2016-03-04 2022-06-07 琳得科株式会社 Semiconductor processing sheet
JP6833804B2 (en) * 2016-03-04 2021-02-24 リンテック株式会社 Composite sheet for forming a protective film
JP6573841B2 (en) * 2016-03-04 2019-09-11 リンテック株式会社 Semiconductor processing sheet
SG11201805895XA (en) * 2016-03-04 2018-09-27 Lintec Corp Protective film-forming composite sheet
WO2017149926A1 (en) * 2016-03-04 2017-09-08 リンテック株式会社 Semiconductor processing sheet
TWI721158B (en) * 2016-04-28 2021-03-11 日商琳得科股份有限公司 Protective film forming film and composite sheet for forming protective film
TWI731964B (en) * 2016-04-28 2021-07-01 日商琳得科股份有限公司 Complex sheet for forming protective film
TWI778960B (en) * 2016-04-28 2022-10-01 日商琳得科股份有限公司 Film for forming protective film, composite sheet for forming protective film, and method of manufacturing semiconductor chip having protective film
WO2017188231A1 (en) * 2016-04-28 2017-11-02 リンテック株式会社 Film for forming protective coat and composite sheet for forming protective coat
TWI796297B (en) * 2016-04-28 2023-03-21 日商琳得科股份有限公司 Composite sheet for forming protective film
CN109328219B (en) * 2016-05-12 2020-04-28 住友电木株式会社 Adhesive tape for processing semiconductor substrate
JP6776081B2 (en) * 2016-09-28 2020-10-28 リンテック株式会社 Manufacturing method of semiconductor chip with protective film and manufacturing method of semiconductor device
CN110622302B (en) * 2017-05-17 2022-11-22 琳得科株式会社 Semiconductor device and method for manufacturing the same
WO2019044046A1 (en) * 2017-08-28 2019-03-07 リンテック株式会社 Film-like transparent adhesive and infrared sensor module
JP7402052B2 (en) * 2018-01-24 2023-12-20 リンテック株式会社 Long laminated sheets and their rolls
KR102487552B1 (en) 2018-02-05 2023-01-11 삼성전자주식회사 Composition for protective film against sawing process and method of manufacturing semiconductor package using the composition
CN111670231B (en) * 2018-03-23 2022-06-03 琳得科株式会社 Film-like adhesive and sheet for semiconductor processing
CN111587472B (en) * 2018-03-30 2024-04-30 琳得科株式会社 Support sheet and composite sheet for forming protective film
KR102524205B1 (en) * 2018-03-30 2023-04-20 린텍 가부시키가이샤 Composite sheet for forming protective film and manufacturing method thereof
CN112868095A (en) 2019-02-26 2021-05-28 琳得科株式会社 Thermosetting resin film and first protective film-forming sheet
TWI839508B (en) * 2019-04-26 2024-04-21 日商琳得科股份有限公司 Method for manufacturing a third laminate, method for manufacturing a fourth laminate, method for manufacturing a semiconductor device with an inner surface protective film, and method for manufacturing a third laminate
JP7453879B2 (en) 2020-08-12 2024-03-21 リンテック株式会社 Protective film forming sheet roll and protective film forming sheet roll manufacturing method
JP7484557B2 (en) 2020-08-18 2024-05-16 三菱ケミカル株式会社 Adhesive composition, adhesive sheet and laminate
JP7084972B2 (en) * 2020-10-06 2022-06-15 リンテック株式会社 Composite sheet for forming a protective film

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EP2194575B1 (en) 2002-03-12 2017-08-16 Hamamatsu Photonics K.K. Substrate Dividing Method
JP3857953B2 (en) * 2002-05-16 2006-12-13 株式会社巴川製紙所 Adhesive sheet for semiconductor device manufacturing
US20030190466A1 (en) * 2002-04-03 2003-10-09 Katsuji Nakaba Adhesive sheet for producing semiconductor devices
JP4364508B2 (en) * 2002-12-27 2009-11-18 リンテック株式会社 Protective film forming sheet for chip back surface and manufacturing method of chip with protective film
TWI401302B (en) * 2003-06-06 2013-07-11 Hitachi Chemical Co Ltd Sticking sheet unified with dicing tape
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Also Published As

Publication number Publication date
WO2016027883A1 (en) 2016-02-25
TW201938728A (en) 2019-10-01
CN106660333B (en) 2018-11-06
KR20170044652A (en) 2017-04-25
PH12017500285A1 (en) 2017-06-28
KR20170044108A (en) 2017-04-24
PH12017500284B1 (en) 2017-07-03
CN106660332A (en) 2017-05-10
KR102376017B1 (en) 2022-03-17
JP6589209B2 (en) 2019-10-16
PH12017500285B1 (en) 2017-06-28
SG11201701270QA (en) 2017-03-30
TWI712670B (en) 2020-12-11
TW201614023A (en) 2016-04-16
PH12017500284A1 (en) 2017-07-03
TWI672354B (en) 2019-09-21
KR102368140B1 (en) 2022-02-25
JPWO2016027883A1 (en) 2017-06-01
SG11201701272UA (en) 2017-04-27
MY182846A (en) 2021-02-05
WO2016027888A1 (en) 2016-02-25
TWI706023B (en) 2020-10-01
TW201940622A (en) 2019-10-16
CN106660333A (en) 2017-05-10
TWI668290B (en) 2019-08-11
CN106660332B (en) 2020-08-07
TW201614024A (en) 2016-04-16
JPWO2016027888A1 (en) 2017-06-01

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