TW201614023A - Sheet for forming protective film and method of manufacturing semiconductor tip having protective film - Google Patents

Sheet for forming protective film and method of manufacturing semiconductor tip having protective film

Info

Publication number
TW201614023A
TW201614023A TW104127314A TW104127314A TW201614023A TW 201614023 A TW201614023 A TW 201614023A TW 104127314 A TW104127314 A TW 104127314A TW 104127314 A TW104127314 A TW 104127314A TW 201614023 A TW201614023 A TW 201614023A
Authority
TW
Taiwan
Prior art keywords
protective film
forming
sheet
manufacturing semiconductor
film
Prior art date
Application number
TW104127314A
Other languages
Chinese (zh)
Other versions
TWI668290B (en
Inventor
Daisuke Yamamoto
Naoya Saiki
Hiroyuki Yoneyama
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of TW201614023A publication Critical patent/TW201614023A/en
Application granted granted Critical
Publication of TWI668290B publication Critical patent/TWI668290B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Dicing (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laser Beam Processing (AREA)
  • Laminated Bodies (AREA)
  • Formation Of Insulating Films (AREA)
  • Paints Or Removers (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

A sheet for forming a protective film which includes a first supporting sheet and a film for forming a protective film laminated on a first surface side of the first supporting sheet, wherein the film for forming the protective film is composed of a curable material and has following properties: when the film for forming the protective film is cured to form the protective film, the breaking strain of the protective film at 50 DEG C is 20% or less and the breaking stress of the protective film at 50 DEG C is 2.0*10<SP>7</SP>Pa or less.
TW104127314A 2014-08-22 2015-08-21 Sheet for forming protective film and method of manufacturing semiconductor tip having protective film TWI668290B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014169266 2014-08-22
JP2014-169267 2014-08-22
JP2014169267 2014-08-22
JP2014-169266 2014-08-22

Publications (2)

Publication Number Publication Date
TW201614023A true TW201614023A (en) 2016-04-16
TWI668290B TWI668290B (en) 2019-08-11

Family

ID=55350823

Family Applications (4)

Application Number Title Priority Date Filing Date
TW104127316A TWI672354B (en) 2014-08-22 2015-08-21 Sheet for forming protective film and method of manufacturing semiconductor tip having protective film
TW104127314A TWI668290B (en) 2014-08-22 2015-08-21 Sheet for forming protective film and method of manufacturing semiconductor tip having protective film
TW108128902A TWI712670B (en) 2014-08-22 2015-08-21 Sheet for forming protective film and method of manufacturing tip having protective film
TW108122914A TWI706023B (en) 2014-08-22 2015-08-21 Sheet for forming protective film and method of manufacturing tip having protective film

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW104127316A TWI672354B (en) 2014-08-22 2015-08-21 Sheet for forming protective film and method of manufacturing semiconductor tip having protective film

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW108128902A TWI712670B (en) 2014-08-22 2015-08-21 Sheet for forming protective film and method of manufacturing tip having protective film
TW108122914A TWI706023B (en) 2014-08-22 2015-08-21 Sheet for forming protective film and method of manufacturing tip having protective film

Country Status (8)

Country Link
JP (2) JP6589209B2 (en)
KR (2) KR102376017B1 (en)
CN (2) CN106660333B (en)
MY (2) MY186759A (en)
PH (2) PH12017500285A1 (en)
SG (2) SG11201701272UA (en)
TW (4) TWI672354B (en)
WO (2) WO2016027883A1 (en)

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JP6837001B2 (en) * 2015-10-29 2021-03-03 リンテック株式会社 Protective film forming film and protective film forming composite sheet
JP6617056B2 (en) * 2016-03-04 2019-12-04 リンテック株式会社 Semiconductor processing sheet, winding body thereof, and method for manufacturing the winding body
SG11201807528RA (en) * 2016-03-04 2018-09-27 Lintec Corp Protective film-forming composite sheet
KR20180122317A (en) * 2016-03-04 2018-11-12 린텍 가부시키가이샤 Semiconductor processing sheet
JP6805230B2 (en) * 2016-03-04 2020-12-23 リンテック株式会社 Composite sheet for forming a protective film
JP7042211B2 (en) * 2016-03-04 2022-03-25 リンテック株式会社 Sheet for semiconductor processing
JP6573841B2 (en) * 2016-03-04 2019-09-11 リンテック株式会社 Semiconductor processing sheet
JP6971977B2 (en) * 2016-04-28 2021-11-24 リンテック株式会社 A film for forming a protective film, a composite sheet for forming a protective film, a method for manufacturing a semiconductor chip with a protective film, and a method for packing the semiconductor chip with a protective film.
TWI778960B (en) * 2016-04-28 2022-10-01 日商琳得科股份有限公司 Film for forming protective film, composite sheet for forming protective film, and method of manufacturing semiconductor chip having protective film
TWI796297B (en) * 2016-04-28 2023-03-21 日商琳得科股份有限公司 Composite sheet for forming protective film
TWI721158B (en) * 2016-04-28 2021-03-11 日商琳得科股份有限公司 Protective film forming film and composite sheet for forming protective film
TWI731964B (en) * 2016-04-28 2021-07-01 日商琳得科股份有限公司 Complex sheet for forming protective film
WO2017195711A1 (en) * 2016-05-12 2017-11-16 住友ベークライト株式会社 Adhesive tape for processing semiconductor substrates
JP6776081B2 (en) * 2016-09-28 2020-10-28 リンテック株式会社 Manufacturing method of semiconductor chip with protective film and manufacturing method of semiconductor device
TWI765038B (en) * 2017-05-17 2022-05-21 日商琳得科股份有限公司 Semiconductor device and method for manufacturing same
CN111051455B (en) * 2017-08-28 2022-05-03 琳得科株式会社 Film-like transparent adhesive and infrared sensor module
JP7402052B2 (en) * 2018-01-24 2023-12-20 リンテック株式会社 Long laminated sheets and their rolls
KR102487552B1 (en) 2018-02-05 2023-01-11 삼성전자주식회사 Composition for protective film against sawing process and method of manufacturing semiconductor package using the composition
WO2019182001A1 (en) * 2018-03-23 2019-09-26 リンテック株式会社 Film-like adhesive and sheet for semiconductor processing
KR102467148B1 (en) * 2018-03-30 2022-11-14 린텍 가부시키가이샤 Composite sheet for forming support sheet and protective film
JP7203087B2 (en) * 2018-03-30 2023-01-12 リンテック株式会社 COMPOSITE SHEET FOR PROTECTIVE FILM FORMATION AND METHOD FOR MANUFACTURING SAME
SG11202110169VA (en) * 2019-04-26 2021-10-28 Lintec Corp Method of manufacturing third laminate, method of manufacturing fourth laminate, method of manufacturing semiconductor device with back surface protective film, and third laminate
JP7453879B2 (en) 2020-08-12 2024-03-21 リンテック株式会社 Protective film forming sheet roll and protective film forming sheet roll manufacturing method
JP7484557B2 (en) 2020-08-18 2024-05-16 三菱ケミカル株式会社 Adhesive composition, adhesive sheet and laminate
JP7084972B2 (en) * 2020-10-06 2022-06-15 リンテック株式会社 Composite sheet for forming a protective film

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JP3857953B2 (en) * 2002-05-16 2006-12-13 株式会社巴川製紙所 Adhesive sheet for semiconductor device manufacturing
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JP4364508B2 (en) * 2002-12-27 2009-11-18 リンテック株式会社 Protective film forming sheet for chip back surface and manufacturing method of chip with protective film
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Also Published As

Publication number Publication date
TWI706023B (en) 2020-10-01
JPWO2016027883A1 (en) 2017-06-01
KR102368140B1 (en) 2022-02-25
PH12017500284A1 (en) 2017-07-03
TWI672354B (en) 2019-09-21
KR20170044652A (en) 2017-04-25
CN106660333A (en) 2017-05-10
TWI712670B (en) 2020-12-11
PH12017500284B1 (en) 2017-07-03
SG11201701270QA (en) 2017-03-30
PH12017500285B1 (en) 2017-06-28
TW201938728A (en) 2019-10-01
KR20170044108A (en) 2017-04-24
SG11201701272UA (en) 2017-04-27
MY186759A (en) 2021-08-18
TW201614024A (en) 2016-04-16
JPWO2016027888A1 (en) 2017-06-01
TWI668290B (en) 2019-08-11
PH12017500285A1 (en) 2017-06-28
KR102376017B1 (en) 2022-03-17
JP6589209B2 (en) 2019-10-16
TW201940622A (en) 2019-10-16
MY182846A (en) 2021-02-05
WO2016027883A1 (en) 2016-02-25
CN106660333B (en) 2018-11-06
CN106660332A (en) 2017-05-10
WO2016027888A1 (en) 2016-02-25
CN106660332B (en) 2020-08-07

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