PH12018500801B1 - Kit for thermosetting resin film and second protective film forming film, thermosetting resin film, first protective film forming sheet, and method for forming first protective film for semiconductor wafer - Google Patents

Kit for thermosetting resin film and second protective film forming film, thermosetting resin film, first protective film forming sheet, and method for forming first protective film for semiconductor wafer

Info

Publication number
PH12018500801B1
PH12018500801B1 PH12018500801A PH12018500801A PH12018500801B1 PH 12018500801 B1 PH12018500801 B1 PH 12018500801B1 PH 12018500801 A PH12018500801 A PH 12018500801A PH 12018500801 A PH12018500801 A PH 12018500801A PH 12018500801 B1 PH12018500801 B1 PH 12018500801B1
Authority
PH
Philippines
Prior art keywords
film
thermosetting resin
protective film
forming
resin film
Prior art date
Application number
PH12018500801A
Other versions
PH12018500801A1 (en
Inventor
Masanori Yamagishi
Akinori Sato
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of PH12018500801B1 publication Critical patent/PH12018500801B1/en
Publication of PH12018500801A1 publication Critical patent/PH12018500801A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Paints Or Removers (AREA)
  • Dicing (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

In a kit for a thermosetting resin film and a second protective film forming film, a thermosetting resin film, a first protective film forming sheet, and a method for forming a first protective film for a semiconductor wafer of the present invention, a thermosetting resin film (1) and a second protective film forming film (2) include at least a thermosetting component, wherein the thermosetting resin film (1) has an exothermic onset temperature, as measured by differential scanning calorimetry, that is greater than or equal to the exothermic onset temperature of the second protective film forming film (2), the exothermic peak temperatures of the thermosetting resin film (1) and the second protective film forming film (2) are each 100-200øC, and the difference between the exothermic peak temperatures of the thermosetting resin film (1) and the second protective film forming film (2) is less than 35øC.
PH12018500801A 2015-11-04 2018-04-13 Kit for thermosetting resin film and second protective film forming film, thermosetting resin film, first protective film forming sheet, and method for forming first protective film for semiconductor wafer PH12018500801A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015217097 2015-11-04
PCT/JP2016/082544 WO2017078053A1 (en) 2015-11-04 2016-11-02 Kit for thermosetting resin film and second protective film forming film, thermosetting resin film, first protective film forming sheet, and method for forming first protective film for semiconductor wafer

Publications (2)

Publication Number Publication Date
PH12018500801B1 true PH12018500801B1 (en) 2018-10-29
PH12018500801A1 PH12018500801A1 (en) 2018-10-29

Family

ID=58661938

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12018500801A PH12018500801A1 (en) 2015-11-04 2018-04-13 Kit for thermosetting resin film and second protective film forming film, thermosetting resin film, first protective film forming sheet, and method for forming first protective film for semiconductor wafer

Country Status (7)

Country Link
JP (1) JP6304852B2 (en)
KR (1) KR102541134B1 (en)
CN (1) CN108140622B (en)
PH (1) PH12018500801A1 (en)
SG (1) SG11201803007TA (en)
TW (1) TWI638845B (en)
WO (1) WO2017078053A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7210901B2 (en) * 2017-06-26 2023-01-24 味の素株式会社 Resin composition layer
JP6998250B2 (en) * 2018-03-27 2022-01-18 日本カーバイド工業株式会社 Infrared laser irradiation resin composition and infrared laser irradiation resin film
DE102020210104A1 (en) * 2020-08-10 2022-02-10 Disco Corporation PROCEDURE FOR PROCESSING A SUBSTRATE

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3317784B2 (en) * 1994-08-10 2002-08-26 住友ベークライト株式会社 Epoxy resin composition for semiconductor encapsulation
JPH10158478A (en) * 1996-11-29 1998-06-16 Sumitomo Bakelite Co Ltd Semiconductor-sealing epoxy resin composition
TW469609B (en) * 2000-10-11 2001-12-21 Ultratera Corp Chipless package semiconductor device and its manufacturing method
JP4170839B2 (en) 2003-07-11 2008-10-22 日東電工株式会社 Laminated sheet
JP4939002B2 (en) * 2005-06-29 2012-05-23 ローム株式会社 Semiconductor device and semiconductor device assembly
JP2007035880A (en) * 2005-07-26 2007-02-08 Matsushita Electric Works Ltd Manufacturing method of wafer with bump, wafer with bump and semiconductor device
JP5130397B2 (en) * 2010-01-21 2013-01-30 積水化学工業株式会社 Thermosetting resin composition, pre-applied flip chip mounting adhesive, method for manufacturing semiconductor device, and semiconductor device
JP2010212724A (en) * 2010-05-17 2010-09-24 Rohm Co Ltd Semiconductor device
KR102073440B1 (en) * 2012-05-17 2020-02-04 다이요 잉키 세이조 가부시키가이샤 Alkaline-developable thermosetting resin composition and printed circuit board
BR112015009388A2 (en) * 2012-10-31 2017-07-04 Dow Global Technologies Llc curing composition, process for preparing a curing composition, curable composition, process for preparing a curable composition, process for preparing a thermoset and cured thermoset article
JP5735029B2 (en) * 2013-03-28 2015-06-17 日東電工株式会社 Resin sheet for sealing electronic device and method for manufacturing electronic device package

Also Published As

Publication number Publication date
KR20180079307A (en) 2018-07-10
KR102541134B1 (en) 2023-06-08
JP6304852B2 (en) 2018-04-04
TWI638845B (en) 2018-10-21
CN108140622B (en) 2021-03-05
SG11201803007TA (en) 2018-05-30
PH12018500801A1 (en) 2018-10-29
WO2017078053A1 (en) 2017-05-11
JPWO2017078053A1 (en) 2018-02-01
TW201728640A (en) 2017-08-16
CN108140622A (en) 2018-06-08

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