SG11201803007TA - Kit for thermosetting resin film and second protective film forming film, thermosetting resin film, first protective film forming sheet, and method for forming first protective film for semiconductor wafer - Google Patents
Kit for thermosetting resin film and second protective film forming film, thermosetting resin film, first protective film forming sheet, and method for forming first protective film for semiconductor waferInfo
- Publication number
- SG11201803007TA SG11201803007TA SG11201803007TA SG11201803007TA SG11201803007TA SG 11201803007T A SG11201803007T A SG 11201803007TA SG 11201803007T A SG11201803007T A SG 11201803007TA SG 11201803007T A SG11201803007T A SG 11201803007TA SG 11201803007T A SG11201803007T A SG 11201803007TA
- Authority
- SG
- Singapore
- Prior art keywords
- film
- forming
- protective film
- thermosetting resin
- protective
- Prior art date
Links
- 230000001681 protective effect Effects 0.000 title 3
- 239000011347 resin Substances 0.000 title 2
- 229920005989 resin Polymers 0.000 title 2
- 229920001187 thermosetting polymer Polymers 0.000 title 2
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
- Paints Or Removers (AREA)
- Dicing (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015217097 | 2015-11-04 | ||
PCT/JP2016/082544 WO2017078053A1 (en) | 2015-11-04 | 2016-11-02 | Kit for thermosetting resin film and second protective film forming film, thermosetting resin film, first protective film forming sheet, and method for forming first protective film for semiconductor wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201803007TA true SG11201803007TA (en) | 2018-05-30 |
Family
ID=58661938
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201803007TA SG11201803007TA (en) | 2015-11-04 | 2016-11-02 | Kit for thermosetting resin film and second protective film forming film, thermosetting resin film, first protective film forming sheet, and method for forming first protective film for semiconductor wafer |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP6304852B2 (en) |
KR (1) | KR102541134B1 (en) |
CN (1) | CN108140622B (en) |
PH (1) | PH12018500801A1 (en) |
SG (1) | SG11201803007TA (en) |
TW (1) | TWI638845B (en) |
WO (1) | WO2017078053A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7210901B2 (en) * | 2017-06-26 | 2023-01-24 | 味の素株式会社 | Resin composition layer |
JP6998250B2 (en) * | 2018-03-27 | 2022-01-18 | 日本カーバイド工業株式会社 | Infrared laser irradiation resin composition and infrared laser irradiation resin film |
DE102020210104A1 (en) | 2020-08-10 | 2022-02-10 | Disco Corporation | PROCEDURE FOR PROCESSING A SUBSTRATE |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3317784B2 (en) * | 1994-08-10 | 2002-08-26 | 住友ベークライト株式会社 | Epoxy resin composition for semiconductor encapsulation |
JPH10158478A (en) * | 1996-11-29 | 1998-06-16 | Sumitomo Bakelite Co Ltd | Semiconductor-sealing epoxy resin composition |
TW469609B (en) * | 2000-10-11 | 2001-12-21 | Ultratera Corp | Chipless package semiconductor device and its manufacturing method |
JP4170839B2 (en) | 2003-07-11 | 2008-10-22 | 日東電工株式会社 | Laminated sheet |
JP4939002B2 (en) * | 2005-06-29 | 2012-05-23 | ローム株式会社 | Semiconductor device and semiconductor device assembly |
JP2007035880A (en) * | 2005-07-26 | 2007-02-08 | Matsushita Electric Works Ltd | Manufacturing method of wafer with bump, wafer with bump and semiconductor device |
WO2011090038A1 (en) * | 2010-01-21 | 2011-07-28 | 積水化学工業株式会社 | Thermosetting resin composition, flip-chip mounting adhesive, semiconductor device fabrication method, and semiconductor device |
JP2010212724A (en) * | 2010-05-17 | 2010-09-24 | Rohm Co Ltd | Semiconductor device |
WO2013172432A1 (en) * | 2012-05-17 | 2013-11-21 | 太陽インキ製造株式会社 | Alkaline-developable thermosetting resin composition and printed circuit board |
EP2914662A4 (en) * | 2012-10-31 | 2016-06-08 | Blue Cube Ip Llc | Curable compositions |
JP5735029B2 (en) * | 2013-03-28 | 2015-06-17 | 日東電工株式会社 | Resin sheet for sealing electronic device and method for manufacturing electronic device package |
-
2016
- 2016-11-02 KR KR1020187011396A patent/KR102541134B1/en active IP Right Grant
- 2016-11-02 CN CN201680060998.1A patent/CN108140622B/en active Active
- 2016-11-02 WO PCT/JP2016/082544 patent/WO2017078053A1/en active Application Filing
- 2016-11-02 SG SG11201803007TA patent/SG11201803007TA/en unknown
- 2016-11-02 TW TW105135532A patent/TWI638845B/en active
- 2016-11-02 JP JP2017545767A patent/JP6304852B2/en active Active
-
2018
- 2018-04-13 PH PH12018500801A patent/PH12018500801A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
JPWO2017078053A1 (en) | 2018-02-01 |
KR20180079307A (en) | 2018-07-10 |
JP6304852B2 (en) | 2018-04-04 |
PH12018500801B1 (en) | 2018-10-29 |
CN108140622A (en) | 2018-06-08 |
TWI638845B (en) | 2018-10-21 |
WO2017078053A1 (en) | 2017-05-11 |
CN108140622B (en) | 2021-03-05 |
PH12018500801A1 (en) | 2018-10-29 |
KR102541134B1 (en) | 2023-06-08 |
TW201728640A (en) | 2017-08-16 |
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