SG11201704005XA - Resin film-forming sheet, resin film-forming composite sheet, and silicon wafer regeneration method - Google Patents

Resin film-forming sheet, resin film-forming composite sheet, and silicon wafer regeneration method

Info

Publication number
SG11201704005XA
SG11201704005XA SG11201704005XA SG11201704005XA SG11201704005XA SG 11201704005X A SG11201704005X A SG 11201704005XA SG 11201704005X A SG11201704005X A SG 11201704005XA SG 11201704005X A SG11201704005X A SG 11201704005XA SG 11201704005X A SG11201704005X A SG 11201704005XA
Authority
SG
Singapore
Prior art keywords
resin film
forming
sheet
silicon wafer
regeneration method
Prior art date
Application number
SG11201704005XA
Inventor
Naoya Saiki
Daisuke Yamamoto
Hiroyuki Yoneyama
Youichi Inao
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of SG11201704005XA publication Critical patent/SG11201704005XA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/18—Homopolymers or copolymers of nitriles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
SG11201704005XA 2015-01-14 2015-11-18 Resin film-forming sheet, resin film-forming composite sheet, and silicon wafer regeneration method SG11201704005XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015005168 2015-01-14
PCT/JP2015/082433 WO2016113998A1 (en) 2015-01-14 2015-11-18 Resin film-forming sheet, resin film-forming composite sheet, and silicon wafer regeneration method

Publications (1)

Publication Number Publication Date
SG11201704005XA true SG11201704005XA (en) 2017-07-28

Family

ID=56405555

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201704005XA SG11201704005XA (en) 2015-01-14 2015-11-18 Resin film-forming sheet, resin film-forming composite sheet, and silicon wafer regeneration method

Country Status (6)

Country Link
JP (1) JP6464196B2 (en)
KR (1) KR102343970B1 (en)
CN (1) CN107001664B (en)
SG (1) SG11201704005XA (en)
TW (2) TWI694129B (en)
WO (1) WO2016113998A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7086102B2 (en) * 2017-12-07 2022-06-17 リンテック株式会社 Manufacturing method of workpiece sheet and processed workpiece
JP7025231B2 (en) * 2018-02-01 2022-02-24 日東電工株式会社 Surface protective film
WO2019235287A1 (en) * 2018-06-06 2019-12-12 積水化学工業株式会社 Pressure-sensitive adhesive tape
JP7251167B2 (en) * 2019-01-28 2023-04-04 株式会社レゾナック FILM ADHESIVE, ADHESIVE SHEET, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
KR102455146B1 (en) * 2020-02-10 2022-10-17 주식회사 나노인 Reversible Coating Method for Encapsulating and Filling Structures on Substrates

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1053746A (en) * 1996-08-09 1998-02-24 Oji Paper Co Ltd Method of peeling protective film
JP2003003131A (en) * 2001-06-18 2003-01-08 Nitto Denko Corp Peeling tape for semiconductor wafer-protecting sheet
JP3766304B2 (en) * 2001-10-09 2006-04-12 クレハエラストマー株式会社 Heat release type adhesive sheet
JP2009138026A (en) 2007-12-03 2009-06-25 Furukawa Electric Co Ltd:The Energy ray-curable chip protecting film
JP5097600B2 (en) * 2008-03-31 2012-12-12 リンテック株式会社 Chip holding structure, die sort sheet, and semiconductor device manufacturing method
JP2009246302A (en) * 2008-03-31 2009-10-22 Lintec Corp Die sorting tape
JP5805367B2 (en) 2009-01-30 2015-11-04 日東電工株式会社 Dicing tape integrated wafer back surface protection film
JP2013181063A (en) * 2012-02-29 2013-09-12 Nitto Denko Corp Self-rolling adhesive film
JP2013237732A (en) * 2012-05-11 2013-11-28 Dainippon Printing Co Ltd Energy ray-peelable adhesive composition, and adhesive tape
JP2014096422A (en) * 2012-11-07 2014-05-22 Fujifilm Corp Substrate support member, substrate processing apparatus, manufacturing method for substrate support member, and substrate processing method
TWI637439B (en) * 2012-12-14 2018-10-01 琳得科股份有限公司 Protective film forming film

Also Published As

Publication number Publication date
TWI736196B (en) 2021-08-11
KR102343970B1 (en) 2021-12-27
CN107001664B (en) 2020-05-12
TW202030287A (en) 2020-08-16
TWI694129B (en) 2020-05-21
JP6464196B2 (en) 2019-02-06
WO2016113998A1 (en) 2016-07-21
TW201638260A (en) 2016-11-01
KR20170103749A (en) 2017-09-13
CN107001664A (en) 2017-08-01
JPWO2016113998A1 (en) 2017-10-19

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